会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20120241872A1
    • 2012-09-27
    • US13236690
    • 2011-09-20
    • Masato ENDO
    • Masato ENDO
    • H01L29/78
    • H01L27/11524H01L27/11531
    • A nonvolatile semiconductor memory device in one embodiment includes a select gate switch transistor having a gate insulating film formed on a semiconductor substrate, a gate electrode formed on the gate insulating film, and first and second source/drain regions provided in the semiconductor substrate so as to face each other across the gate electrode. The first source/drain region includes a first n-type impurity layer and a second n-type impurity layer which has a higher impurity concentration and has a shallower depth than the first n-type impurity layer. The second source/drain region has a third n-type impurity layer which has a lower impurity concentration and has a shallower depth than the first n-type impurity layer and a fourth n-type impurity layer which has a higher impurity concentration and has a deeper depth than the third n-type impurity layer.
    • 一个实施例中的非易失性半导体存储器件包括选择栅极开关晶体管,其具有形成在半导体衬底上的栅极绝缘膜,形成在栅极绝缘膜上的栅极电极以及设置在半导体衬底中的第一和第二源极/漏极区域, 以跨越栅极电极彼此面对。 第一源极/漏极区包括第一n型杂质层和具有比第一n型杂质层更浅的杂质浓度的第二n型杂质层。 第二源极/漏极区具有第三n型杂质层,其具有较低的杂质浓度并且具有比第一n型杂质层更浅的深度和具有较高杂质浓度的第四n型杂质层,并且具有 比第三n型杂质层更深的深度。
    • 7. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110188309A1
    • 2011-08-04
    • US13014212
    • 2011-01-26
    • Masato ENDO
    • Masato ENDO
    • G11C5/06H01L27/112
    • G11C5/06H01L27/112
    • According to one embodiment, a semiconductor device includes a first circuit unit having first and second interconnects, a second circuit unit having third and fourth interconnects, and an intermediate unit provided therebetween and having first and second transistors juxtaposed to each other along a direction perpendicular to a direction from the first circuit unit toward the second circuit unit. A high impurity concentration region in a first connection region of one diffusion layer of the first transistor is connected to the first interconnect, and other diffusion layer is connected to the third interconnect. A distance from the first connection region to a gate is longer than a distance from the second connection region to a gate. An midpoint region with a narrower width than the first connection region is provided between the gate and the first connection region of the one diffusion layer of the first transistor.
    • 根据一个实施例,半导体器件包括具有第一和第二互连的第一电路单元,具有第三和第四互连的第二电路单元,以及设置在它们之间的中间单元,并且具有沿着垂直于第一和第二互连的方向彼此并置的第一和第二晶体管 从第一电路单元朝向第二电路单元的方向。 第一晶体管的一个扩散层的第一连接区域中的高杂质浓度区域连接到第一互连,其它扩散层连接到第三互连。 从第一连接区域到栅极的距离比从第二连接区域到栅极的距离长。 在第一晶体管的一个扩散层的栅极和第一连接区域之间设置有宽度比第一连接区域窄的中点区域。
    • 8. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110309422A1
    • 2011-12-22
    • US13051516
    • 2011-03-18
    • Masato ENDOMitsuhiro Noguchi
    • Masato ENDOMitsuhiro Noguchi
    • H01L29/78
    • H01L27/105H01L27/0629H01L27/11531H01L28/20
    • According to one embodiment, a semiconductor device includes a first resistance element including a first conductive material, an inter-gate insulation film formed on both ends of the first conductive material in a first direction, and a second conductive material formed above the first conductive material and configured to connect with the first conductive material via a first connection region from which the inter-gate insulation film is removed, and a second resistance element including a third conductive material, the inter-gate insulation film formed on both ends of the third conductive material in the first direction, and a fourth conductive material formed above the third conductive material and configured to connect with the third conductive material via a second connection region from which the inter-gate insulation film is removed, wherein a length of the second connection region is greater than a length of the first connection region in the first direction.
    • 根据一个实施例,半导体器件包括第一电阻元件,第一电阻元件包括第一导电材料,在第一方向上形成在第一导电材料的两端上的栅极间绝缘膜和形成在第一导电材料上方的第二导电材料 并且被配置为经由去除所述栅极间绝缘膜的第一连接区域与所述第一导电材料连接,以及包括第三导电材料的第二电阻元件,所述栅极间绝缘膜形成在所述第三导电 材料在第一方向上形成,第四导电材料形成在第三导电材料之上,并被配置为经由去除栅间绝缘膜的第二连接区域与第三导电材料连接,其中第二连接区域 大于第一方向上的第一连接区域的长度。