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    • 2. 发明授权
    • Motor drive system
    • 电机驱动系统
    • US07893637B2
    • 2011-02-22
    • US12091892
    • 2006-10-26
    • Masayoshi SuhamaMasaki OkamuraEiji Sato
    • Masayoshi SuhamaMasaki OkamuraEiji Sato
    • H02P3/14
    • H02P21/06B60L7/16B60L11/08B60L11/12B60L15/02B60L15/025B60L2210/20H02P3/18H02P21/00H02P21/20H02P29/0241H02P2201/09H02P2205/05Y02T10/643Y02T10/646Y02T10/7077Y02T10/725
    • In a drive system of an AC motor in which a motor current is feedback-controlled, a motor current command is produced in a normal operation according to a torque command value on an optimum efficiency characteristic line so as to select an optimum current phase maximizing an output torque with a constant motor current amplitude. Conversely, when the AC motor produces an excessively generated power exceeding a regeneratable power quantity of the AC motor, a consuming operation is performed for intentionally increasing the power loss in the AC motor. In the consuming operation, the motor current command is produced according to the torque command value on a loss increase characteristic line to change the current phase from the above optimum value. Thereby, the power loss in the AC motor can be increased to consume the surplus power without causing instability in the motor control.
    • 在电动机电流被反馈控制的交流电动机的驱动系统中,根据最佳效率特性线上的转矩指令值,在正常运行中产生电动机电流指令,以选择最佳化电流相位 输出转矩与电动机恒定电流幅度恒定。 相反,当交流电动机产生超过交流电动机的再生电力的过度产生的功率时,进行有意增加交流电动机的功率损耗的消耗操作。 在消耗操作中,根据损耗增加特性线上的转矩指令值产生电动机电流指令,以从上述最佳值改变电流相位。 因此,可以增加AC电动机的功率损耗以消耗剩余功率,而不会导致电动机控制中的不稳定性。
    • 9. 发明申请
    • SEMICONDUCTOR DEVICE HAVING THROUGH-SUBSTRATE VIA
    • 具有通过基底的半导体器件
    • US20130181349A1
    • 2013-07-18
    • US13599041
    • 2012-08-30
    • Chie KOYAMASatoyuki MiyakoEiji Sato
    • Chie KOYAMASatoyuki MiyakoEiji Sato
    • H01L23/498
    • H01L23/481H01L21/76224H01L23/5225H01L23/5286H01L27/14618H01L27/14636H01L2924/0002H01L2924/00
    • According to an embodiment, a semiconductor device includes a first circuit block, a first through-substrate via, and a back surface wiring. The first circuit block is provided on a surface side of a semiconductor substrate. The first through-substrate via is provided along a circumference of the first circuit block so as to separate the first circuit block from other circuit blocks. The first circuit block is provided so as to penetrate the surface of the semiconductor substrate. The first circuit block is isolated from the surroundings. The first circuit block has conductivity. The back surface wiring is provided on the back surface side of the semiconductor substrate. The back surface wiring is connected to the first through-substrate via. The back surface wiring connects the first through-substrate via to a power supply terminal or a shield potential terminal.
    • 根据实施例,半导体器件包括第一电路块,第一贯穿衬底通孔和背面布线。 第一电路块设置在半导体衬底的表面侧。 沿着第一电路块的圆周设置第一贯穿衬底通孔,以将第一电路块与其它电路块分离。 第一电路块被设置为穿透半导体衬底的表面。 第一个电路块与周围环境隔绝。 第一个电路块具有导电性。 背面布线设置在半导体基板的背面侧。 背面布线连接到第一贯穿基板通孔。 背面布线将第一贯穿基板通孔连接到电源端子或屏蔽电位端子。