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1. 发明授权

US08707893B2 Substrate treatment system, substrate treatment method, and non-transitory computer storage medium 有权
标题翻译：底物处理系统，底物处理方法和非暂时计算机存储介质
公开(公告)号：US08707893B2
公开(公告)日：2014-04-29
申请号：US13300114
申请日：2011-11-18
申请人： Masatoshi Deguchi , Hideo Funakoshi , Toshichika Takei , Norifumi Sato , Wataru Kiyota , Daisuke Ishimaru , Shinichi Machidori , Ikuo Sunaka , Shigenori Kamei
发明人： Masatoshi Deguchi , Hideo Funakoshi , Toshichika Takei , Norifumi Sato , Wataru Kiyota , Daisuke Ishimaru , Shinichi Machidori , Ikuo Sunaka , Shigenori Kamei
IPC分类号： B05C13/00 , B05C13/02 , B05C21/00 , B65H1/00
CPC分类号： H01L21/67178 , H01L21/6708 , H01L21/6715 , H01L21/6719 , H01L21/67259 , H01L21/681 , H01L21/68707
摘要： A substrate treatment system includes a plurality of treatment apparatuses, a position adjustment apparatus adjusting a center position of the substrate, a substrate transfer apparatus transferring the substrate to the treatment apparatuses and the position adjustment apparatus, and a control unit controlling operations of the apparatuses. The substrate transfer apparatus includes an arm part curved along a peripheral edge portion of the substrate with a radius of curvature larger than a radius of the substrate, and a holding part projecting inward from the arm part and holding a rear surface of the substrate. The position adjustment apparatus includes a mounting table which holds a central portion of the rear surface of the substrate and is rotatable and horizontally movable. The control unit controls the mounting table such that the center position of the substrate held on the mounting table is aligned with a center position of the arm part.
摘要翻译：基板处理系统包括多个处理装置，调整基板的中心位置的位置调整装置，将基板传送到处理装置和位置调整装置的基板输送装置，以及控制装置的动作的控制部。该基片传送装置包括：沿着基片周边部分弯曲的臂部分，其曲率半径大于基片的半径;以及保持部分，其从臂部向内突出并保持基片的后表面。位置调整装置包括安装台，该安装台保持基板后表面的中心部分并且可旋转和水平移动。控制单元控制安装台，使得保持在安装台上的基板的中心位置与臂部的中心位置对准。

2. 发明申请

US20120135148A1 SUBSTRATE TREATMENT SYSTEM, SUBSTRATE TREATMENT METHOD, AND NON-TRANSITORY COMPUTER STORAGE MEDIUM 有权
标题翻译：基板处理系统，基板处理方法和非终端计算机存储介质
公开(公告)号：US20120135148A1
公开(公告)日：2012-05-31
申请号：US13300114
申请日：2011-11-18
申请人： Masatoshi Deguchi , Hideo Funakoshi , Toshichika Takei , Norifumi Sato , Wataru Kiyota , Daisuke Ishimaru , Shinichi Machidori , Ikuo Sunaka , Shigenori Kamei
发明人： Masatoshi Deguchi , Hideo Funakoshi , Toshichika Takei , Norifumi Sato , Wataru Kiyota , Daisuke Ishimaru , Shinichi Machidori , Ikuo Sunaka , Shigenori Kamei
IPC分类号： H01L21/68 , B05D1/02 , G06F19/00 , B05C11/00 , H01L21/677 , B05C9/14 , B05D3/02
CPC分类号： H01L21/67178 , H01L21/6708 , H01L21/6715 , H01L21/6719 , H01L21/67259 , H01L21/681 , H01L21/68707
摘要： A substrate treatment system includes a plurality of treatment apparatuses, a position adjustment apparatus adjusting a center position of the substrate, a substrate transfer apparatus transferring the substrate to the treatment apparatuses and the position adjustment apparatus, and a control unit controlling operations of the apparatuses. The substrate transfer apparatus includes an arm part curved along a peripheral edge portion of the substrate with a radius of curvature larger than a radius of the substrate, and a holding part projecting inward from the arm part and holding a rear surface of the substrate. The position adjustment apparatus includes a mounting table which holds a central portion of the rear surface of the substrate and is rotatable and horizontally movable. The control unit controls the mounting table such that the center position of the substrate held on the mounting table is aligned with a center position of the arm part.
摘要翻译：基板处理系统包括多个处理装置，调整基板的中心位置的位置调整装置，将基板传送到处理装置和位置调整装置的基板输送装置，以及控制装置的动作的控制部。该基片传送装置包括：沿着基片周边部分弯曲的臂部分，其曲率半径大于基片的半径;以及保持部分，其从臂部向内突出并保持基片的后表面。位置调整装置包括安装台，该安装台保持基板后表面的中心部分并且可旋转和水平移动。控制单元控制安装台，使得保持在安装台上的基板的中心位置与臂部的中心位置对准。

3. 发明授权

US06932868B2 Coating film forming apparatus 失效
标题翻译：涂膜成膜装置
公开(公告)号：US06932868B2
公开(公告)日：2005-08-23
申请号：US10950411
申请日：2004-09-28
申请人： Takahiro Kitano , Norihisa Koga , Toshichika Takei , Yoshiyuki Kawafuchi
发明人： Takahiro Kitano , Norihisa Koga , Toshichika Takei , Yoshiyuki Kawafuchi
IPC分类号： H01L21/30 , B05B13/04 , B05C5/02 , B05C11/10 , H01L21/00
CPC分类号： H01L21/6715 , B05B13/041 , B05C5/0208 , B05C11/1013
摘要： A substrate is horizontally held by a substrate holding portion freely movable in the Y-direction, and a nozzle portion is provided above and opposing the substrate, and movable in X-direction corresponding to the coating liquid feeding region of the substrate. A discharge opening is formed at a lower end of the nozzle portion, and a channel connecting the discharge opening with a coating liquid feed tube coupled to an upper end of the nozzle portion is formed within the discharge opening. At the mid-stream of the channel, a liquid pool portion larger in diameter than the discharge opening is formed, the inside of which is provided with a filtering member formed by porous bodies blocking the channel. The filtering member forms a pressure loss portion, which absorbs pulsation occurring at the coating liquid feed tube before it reaches the discharge opening.
摘要翻译：基板由能够沿Y方向自由移动的基板保持部水平保持，并且在基板的上方并且与基板相对设置有喷嘴部，并且能够在与基板的涂布液供给区域对应的X方向上移动。在喷嘴部的下端形成有排出口，在喷出口内形成有将排出口与与喷嘴部的上端连结的涂液供给管连结的流路。在通道的中间部分，形成直径大于排出口的液体池部分，其内部设置有由堵塞通道的多孔体形成的过滤构件。过滤构件形成压力损失部分，其在到达排出口之前吸收在涂液供给管处发生的脉动。

4. 发明申请

US20050109274A1 COATING FILM FORMING APPARATUS 失效
标题翻译：涂膜成型设备
公开(公告)号：US20050109274A1
公开(公告)日：2005-05-26
申请号：US10950411
申请日：2004-09-28
申请人： Takahiro Kitano , Norihisa Koga , Toshichika Takei , Yoshiyuki Kawafuchi
发明人： Takahiro Kitano , Norihisa Koga , Toshichika Takei , Yoshiyuki Kawafuchi
IPC分类号： H01L21/30 , B05B13/04 , B05C5/02 , B05C11/10 , H01L21/00 , B05B9/06 , B05C11/00
CPC分类号： H01L21/6715 , B05B13/041 , B05C5/0208 , B05C11/1013
摘要： A substrate is horizontally held by a substrate holding portion freely movable in the Y-direction, and a nozzle portion is provided above and opposing the substrate, and movable in X-direction corresponding to the coating liquid feeding region of the substrate. A discharge opening is formed at a lower end of the nozzle portion, and a channel connecting the discharge opening with a coating liquid feed tube coupled to an upper end of the nozzle portion is formed within the discharge opening. At the mid-stream of the channel, a liquid pool portion larger in diameter than the discharge opening is formed, the inside of which is provided with a filtering member formed by porous bodies blocking the channel. The filtering member forms a pressure loss portion, which absorbs pulsation occurring at the coating liquid feed tube before it reaches the discharge opening.
摘要翻译：基板由能够沿Y方向自由移动的基板保持部水平保持，并且在基板的上方并且与基板相对设置有喷嘴部，并且能够在与基板的涂布液供给区域对应的X方向上移动。在喷嘴部的下端形成有排出口，在喷出口内形成有将排出口与与喷嘴部的上端连结的涂液供给管连结的流路。在通道的中间部分，形成直径大于排出口的液体池部分，其内部设有由堵塞通道的多孔体形成的过滤构件。过滤构件形成压力损失部分，其在到达排出口之前吸收在涂液供给管处发生的脉动。

5. 发明授权

US07151239B2 Heat treating apparatus and heat treating method 有权
标题翻译：热处理装置及热处理方法
公开(公告)号：US07151239B2
公开(公告)日：2006-12-19
申请号：US11134451
申请日：2005-05-23
申请人： Toshichika Takei , Masatoshi Kaneda
发明人： Toshichika Takei , Masatoshi Kaneda
IPC分类号： H05B3/68 , H05B1/02
CPC分类号： H01L21/67248 , G05D23/1935 , G05D23/22 , H01L21/67109
摘要： A heat treating apparatus is provided to apply a heat treatment on a substrate. Prior to the heat treatment, an exclusive transfer mechanism transfers the substrate from a cooling plate onto a heating plate for heating the substrate. Before mounting the substrate on the heating plate, the control mode for heater modules for heating the heating plate on power supply module is switched from a PID control by a regulating part in a controller of the apparatus to a MV control by a fixed-pattern output part in the controller. Next, at a predetermined timing since the substrate has been mounted on the heating plate, the MV control is switched to the PID control. Consequently, it becomes possible to quickly restore a reduce temperature of the heating plate prior to the mounting of substrate on the heating plate and also possible to quickly stabilize a so-raised temperature of the heating plate, accomplishing a heating process with high accuracy and shirt time. Accordingly, when it is required to perform a designated heat treatment on condition that a substrate is mounted on the heating plate whose temperature is stabilized to a processing temperature as a target, the heat treatment with high accuracy can be accomplished in a short time.
摘要翻译：提供热处理装置以在基板上进行热处理。在热处理之前，专用转印机构将基板从冷却板转移到用于加热基板的加热板上。在将基板安装在加热板上之前，用于加热电源模块上的加热板的加热器模块的控制模式从设备的控制器中的调节部分的PID控制切换到通过固定模式输出的MV控制部分在控制器。接下来，由于将基板安装在加热板上的预定定时，MV控制切换到PID控制。因此，可以在将基板安装在加热板上之前快速恢复加热板的降低温度，并且还可以快速地稳定加热板的升高的温度，以高精度完成加热处理和衬衫时间。因此，当要求将基板安装在温度稳定在加热温度的加热板作为目标的条件下进行指定的热处理时，可以在短时间内实现高精度的热处理。

6. 发明申请

US20050258165A1 Heat treating apparatus and heat treating method 有权
标题翻译：热处理装置及热处理方法
公开(公告)号：US20050258165A1
公开(公告)日：2005-11-24
申请号：US11134451
申请日：2005-05-23
申请人： Toshichika Takei , Masatoshi Kaneda
发明人： Toshichika Takei , Masatoshi Kaneda
IPC分类号： G03F1/68 , G03F1/82 , G05D23/22 , H01L21/00 , H01L21/027 , H01L21/68 , H01L21/683 , H05B3/00 , H05B3/02 , H05B3/10 , H05B3/74
CPC分类号： H01L21/67248 , G05D23/1935 , G05D23/22 , H01L21/67109
摘要： A heat treating apparatus is provided to apply a heat treatment on a substrate. Prior to the heat treatment, an exclusive transfer mechanism transfers the substrate from a cooling plate onto a heating plate for heating the substrate. Before mounting the substrate on the heating plate, the control mode for heater modules for heating the heating plate on power supply module is switched from a PID control by a regulating part in a controller of the apparatus to a MV control by a fixed-pattern output part in the controller. Next, at a predetermined timing since the substrate has been mounted on the heating plate, the MV control is switched to the PID control. Consequently, it becomes possible to quickly restore a reduce temperature of the heating plate prior to the mounting of substrate on the heating plate and also possible to quickly stabilize a so-raised temperature of the heating plate, accomplishing a heating process with high accuracy and shirt time. Accordingly, when it is required to perform a designated heat treatment on condition that a substrate is mounted on the heating plate whose temperature is stabilized to a processing temperature as a target, the heat treatment with high accuracy can be accomplished in a short time.
摘要翻译：提供热处理装置以在基板上进行热处理。在热处理之前，专用转印机构将基板从冷却板转移到用于加热基板的加热板上。在将基板安装在加热板上之前，用于加热电源模块上的加热板的加热器模块的控制模式从设备的控制器中的调节部分的PID控制切换到通过固定模式输出的MV控制部分在控制器。接下来，由于将基板安装在加热板上的预定定时，MV控制切换到PID控制。因此，可以在将基板安装在加热板上之前快速恢复加热板的降低温度，并且还可以快速地稳定加热板的升高的温度，以高精度完成加热处理和衬衫时间。因此，当要求将基板安装在温度稳定在加热温度的加热板作为目标的条件下进行指定的热处理时，可以在短时间内实现高精度的热处理。

7. 发明授权

US06811613B2 Coating film forming apparatus 失效
标题翻译：涂膜成膜装置
公开(公告)号：US06811613B2
公开(公告)日：2004-11-02
申请号：US10298932
申请日：2002-11-19
申请人： Takahiro Kitano , Norihisa Koga , Toshichika Takei , Yoshiyuki Kawafuchi
发明人： Takahiro Kitano , Norihisa Koga , Toshichika Takei , Yoshiyuki Kawafuchi
IPC分类号： B05B1100
CPC分类号： H01L21/6715 , B05B13/041 , B05C5/0208 , B05C11/1013
摘要： A substrate is horizontally held by a substrate holding portion freely movable in the Y-direction, and a nozzle portion is provided above and opposing the substrate, and movable in X-direction corresponding to the coating liquid feeding region of the substrate. A discharge opening is formed at a lower end of the nozzle portion, and a channel connecting the discharge opening with a coating liquid feed tube coupled to an upper end of the nozzle portion is formed within the discharge opening. At the midstream of the channel, a liquid pool portion larger in diameter than the discharge opening is formed, the inside of which is provided with a filtering member formed by porous bodies blocking the channel. The filtering member forms a pressure loss portion, which absorbs pulsation occurring at the coating liquid feed tube before it reaches the discharge opening.
摘要翻译：基板由能够沿Y方向自由移动的基板保持部水平保持，并且在基板的上方并且与基板相对设置有喷嘴部，并且能够在与基板的涂布液供给区域对应的X方向上移动。在喷嘴部的下端形成有排出口，在喷出口内形成有将排出口与与喷嘴部的上端连结的涂液供给管连结的流路。在通道的中部，形成直径大于排出口的液体池部分，其内部设置有由堵塞通道的多孔体形成的过滤构件。过滤构件形成压力损失部分，其在到达排出口之前吸收在涂液供给管处发生的脉动。

8. 发明授权

US06761125B2 Coating film forming system 失效
标题翻译：涂膜成型系统
公开(公告)号：US06761125B2
公开(公告)日：2004-07-13
申请号：US10242711
申请日：2002-09-13
申请人： Takahiro Kitano , Yoshiyuki Kawafuchi , Norihisa Koga , Toshichika Takei
发明人： Takahiro Kitano , Yoshiyuki Kawafuchi , Norihisa Koga , Toshichika Takei
IPC分类号： B05B1504
CPC分类号： H01L21/6715
摘要： A system for supplying a chemical to a substrate to form a liquid film of the chemical on the substrate. The system includes a plate having a slit between a nozzle portion movable in lateral directions, and a substrate held by a substrate holding portion movable in longitudinal directions. Shock eliminating portions, provided at left and right ends of the slit, inhibit mist from being produced from a coating liquid supplied outside of the slit. A pair of shutters are capable of washing the coating liquid received by the surfaces of the shock eliminating portions. In the vicinity of the slit, a suction port is provided over a range corresponding to a movable region of the nozzle for sucking mist produced when the nozzle is scanned to carry out coating. The plate has a slit for dispersing a downward flow outside of the slit.
摘要翻译：一种用于向基板供应化学品以在基板上形成化学品的液膜的系统。该系统包括在横向可移动的喷嘴部分之间具有狭缝的板，以及由可在纵向方向上移动的基板保持部分保持的基板。设置在狭缝的左右两端的冲击消除部防止了从供给到狭缝外部的涂布液产生雾。一对百叶窗能够清洗由冲击消除部分的表面接收的涂布液。在狭缝附近，在与喷嘴的可动区域对应的范围内设置有吸入口，用于吸引喷嘴被扫描时产生的雾以进行涂布。该板具有用于在狭缝之外分散向下流动的狭缝。

9. 发明授权

US06474986B2 Hot plate cooling method and heat processing apparatus 有权
标题翻译：热板冷却方法和热处理装置
公开(公告)号：US06474986B2
公开(公告)日：2002-11-05
申请号：US09832909
申请日：2001-04-12
申请人： Tetsuya Oda , Mitsuhiro Tanoue , Toshichika Takei , Eiichi Shirakawa
发明人： Tetsuya Oda , Mitsuhiro Tanoue , Toshichika Takei , Eiichi Shirakawa
IPC分类号： F27D1502
CPC分类号： H01L21/67109 , F27D9/00
摘要： In a heat processing apparatus structured to heat a wafer on a hot plate, a black plate at least the rear face of which practically has a color with a JIS lightness of 0V to 4V is positioned above the hot plate. Moreover, cooling air is blown out from nozzles onto the rear face of the hot plate. Thus, the temperature of the hot plate can be cooled rapidly.
摘要翻译：在构成为对热板上的晶片进行加热的热处理装置中，至少其背面实际上具有JIS亮度为0V〜4V的颜色的黑板位于热板上方。此外，冷却空气从喷嘴吹出到热板的后表面上。因此，可以快速冷却热板的温度。

10. 发明授权

US07431584B2 Heat processing apparatus and heat processing method 有权
标题翻译：热处理设备和热处理方法
公开(公告)号：US07431584B2
公开(公告)日：2008-10-07
申请号：US10774419
申请日：2004-02-10
申请人： Toshichika Takei , Masatoshi Kaneda
发明人： Toshichika Takei , Masatoshi Kaneda
IPC分类号： B05C11/02 , B05C13/00 , B05C13/02 , B05C11/00 , F27D3/00
CPC分类号： H01L21/67109 , G03F7/168
摘要： A heat processing apparatus for heating a mask substrate is disclosed. A mask substrate on which a coating solution has been coated is placed on a heating plate that heats the substrate. A frame member is disposed on the heating plate so that the frame member faces a side surface of the mask substrate placed on the heating plate when the frame member is attached to the heating plate and that a clearance is formed between the frame member and the heating plate when the frame member is attached to the heating plate. The frame member suppresses heat radiated from the side surface of the substrate. As a result, the temperature uniformity of the surface of the substrate can be improved. In addition, since the clearance is formed between the frame member and the heating plate, particles do not accumulate in the region. Thus, adhesion of particles to the substrate can be suppressed.
摘要翻译：公开了一种用于加热掩模基板的热处理设备。将涂布有涂布液的掩模基板放置在加热基板的加热板上。框架构件设置在加热板上，使得当框架构件附接到加热板时框架构件面对放置在加热板上的掩模基板的侧表面，并且在框架构件和加热板之间形成间隙当框架构件附接到加热板时，板。框架构件抑制从基板的侧表面辐射的热量。结果，可以提高基板表面的温度均匀性。此外，由于在框架构件和加热板之间形成间隙，颗粒不会积聚在该区域中。因此，可以抑制颗粒附着到基板上。

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