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1. 发明授权

US07890203B2 Wiring forming system and wiring forming method for forming wiring on wiring board 有权
公开(公告)号：US07890203B2
公开(公告)日：2011-02-15
申请号：US10444974
申请日：2003-05-27
申请人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
发明人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
IPC分类号： G06F19/00 , G03F9/00 , G03F1/00 , G03F7/20 , G03C5/00
CPC分类号： H05K1/0269 , H01L2924/0002 , H05K3/0005 , H05K3/0082 , H05K3/064 , H05K3/125 , H05K2203/013 , H05K2203/107 , H05K2203/162 , H01L2924/00
摘要： A wiring forming system comprises: maskless exposure unit which directly exposes an unexposed board by using exposure data generated based on design data relating to an wiring board; post-development inspect unit which tests the board after development, by using the exposure data and the image data of the board exposed and developed by the maskless exposure unit; etching unit which etches the developed board; and post-etching inspect unit which tests an etching pattern formed on the etched board, by using etching inspect data generated based on the design data and the image data of the board etched by the etching unit.

2. 发明授权

US07793412B2 Component-embedded board fabrication method 有权
标题翻译：组件嵌入式板制造方法
公开(公告)号：US07793412B2
公开(公告)日：2010-09-14
申请号：US10612222
申请日：2003-07-03
申请人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
发明人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
IPC分类号： H05K3/30
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/24011 , H01L2224/2402 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/8203 , H01L2224/82102 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01056 , H01L2924/01073 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H05K1/185 , Y10T29/49004 , Y10T29/49117 , Y10T29/49126 , Y10T29/49131 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/532 , H01L2224/82 , H01L2924/00
摘要： A component-embedded board fabrication method includes detecting, before the board is covered with a first insulating layer, the actual position of a first electronic component formed on a surface of the board, calculating a displacement between the design position of the first electronic component on the surface of the board and holding the displacement as first displacement data, and correcting, based on the first displacement data, design data to be used for processing the board after the board is covered with the first insulating layer.
摘要翻译：组件嵌入式板的制造方法包括在板被第一绝缘层覆盖之前，检测形成在板的表面上的第一电子部件的实际位置，计算第一电子部件的设计位置之间的位移，将所述板的表面保持位移作为第一位移数据，并且基于所述第一位移数据，校正在所述板被所述第一绝缘层覆盖之后用于处理所述板的设计数据。

3. 发明授权

US07707713B2 Component-embedded circuit board fabrication method 有权
标题翻译：组件嵌入式电路板制造方法
公开(公告)号：US07707713B2
公开(公告)日：2010-05-04
申请号：US12004431
申请日：2007-12-21
申请人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
发明人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
IPC分类号： H05K3/30
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/24011 , H01L2224/2402 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/8203 , H01L2224/82102 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01056 , H01L2924/01073 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H05K1/185 , Y10T29/49004 , Y10T29/49117 , Y10T29/49126 , Y10T29/49131 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/532 , H01L2224/82 , H01L2924/00
摘要： A method of fabricating a component-embedded board including detecting, before the board is covered with an insulating layer, the actual position of an electronic component formed on the surface of the board, calculating a displacement between the design position of the electronic component and the actual position of the electronic component on the surface of the board, and for holding the displacement as displacement data, and correcting, based on the displacement data, design data to be used for processing the board after the board is covered with the insulating layer.
摘要翻译：一种制造部件嵌入式基板的方法，包括在板被绝缘层覆盖之前检测形成在电路板表面上的电子部件的实际位置，计算电子部件的设计位置和电子部件在板的表面上的实际位置，并将位移保持为位移数据，并且基于位移数据，校正在板被绝缘层覆盖之后用于处理板的设计数据。

4. 发明申请

US20080110021A1 Component-embedded board fabrication method and apparatus for high-precision and easy fabrication of component-embedded board with electronic components embedded in wiring board 有权
标题翻译：组件嵌入式板制造方法和装置，用于高精度和容易地制造嵌入在电路板中的电子部件的部件嵌入式板
公开(公告)号：US20080110021A1
公开(公告)日：2008-05-15
申请号：US12004431
申请日：2007-12-21
申请人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
发明人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
IPC分类号： H01K3/10 , G06F19/00
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/24011 , H01L2224/2402 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/8203 , H01L2224/82102 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01056 , H01L2924/01073 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H05K1/185 , Y10T29/49004 , Y10T29/49117 , Y10T29/49126 , Y10T29/49131 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/532 , H01L2224/82 , H01L2924/00
摘要： An apparatus 1 for fabricating a component-embedded board according to the present invention comprises: a detecting unit 11 for detecting, before the board 21 is covered with an insulating layer 23, the actual position of an electronic component 22 formed on the surface of the board 21; a holding unit 12 for calculating a displacement between the design position of the electronic component 22 and the actual position of the electronic component 22 on the surface of the board 21, and for holding the displacement as displacement data; and a correcting unit 13 for correcting, based on the displacement data, design data to be used for processing the board 21 after the board 21 is covered with the insulating layer 23.
摘要翻译：根据本发明的用于制造部件嵌入式基板的装置1包括：检测单元11，用于在板21被绝缘层23覆盖之前检测形成在该表面上的电子部件22的实际位置板21; 用于计算电子部件22的设计位置与电子部件22在电路板21的表面上的实际位置之间的位移并保持位移作为位移数据的保持单元12; 以及校正单元13，用于基于位移数据，校正板21被绝缘层23覆盖之后用于处理板21的设计数据。

5. 发明授权

US09051907B2 Vehicle fuel supply device 有权
标题翻译：车辆燃料供应装置
公开(公告)号：US09051907B2
公开(公告)日：2015-06-09
申请号：US13227501
申请日：2011-09-08
申请人： Shinichi Wakabayashi , Yuichi Kato , Shigeru Kita , Tomoyuki Okamoto , Masaya Adachi
发明人： Shinichi Wakabayashi , Yuichi Kato , Shigeru Kita , Tomoyuki Okamoto , Masaya Adachi
IPC分类号： F02M37/04 , F02M37/10 , F02M37/00 , F02M37/20 , F02M37/22 , F02B61/02
CPC分类号： F02M37/103 , F02B61/02 , F02M37/007 , F02M37/20 , F02M37/22
摘要： In an upright state where a vehicle is supported by a main stand, or and a tilted state where the vehicle is supported by a side stand, an inflow port of a fuel filter unit is located at a position higher than an outflow port. The fuel filter unit and the upstream side filter pipe are installed in the vehicle so that the upstream side filter pipe is arranged at a higher position as it goes toward the upstream side.
摘要翻译：在车辆由主车架支撑的直立状态下，或者车辆由侧架支撑的倾斜状态下，燃料过滤器单元的流入口位于比流出口高的位置。燃料过滤器单元和上游侧过滤管安装在车辆中，使得上游侧过滤管在向上游侧布置在更高的位置。

6. 发明申请

US20140263968A1 COLOR IMAGING DEVICE 有权
标题翻译：彩色成像装置
公开(公告)号：US20140263968A1
公开(公告)日：2014-09-18
申请号：US14353113
申请日：2012-06-04
申请人： Tatsuya Nakamura , Seiji Nishiwaki , Shinichi Wakabayashi
发明人： Tatsuya Nakamura , Seiji Nishiwaki , Shinichi Wakabayashi
IPC分类号： H01L27/146
CPC分类号： H01L27/14625 , H01L27/14623 , H01L27/14645 , H04N9/045 , H04N9/097
摘要： An imaging apparatus 10 according to one implementation of the present invention includes: a plurality of photodetectors 5a and 5b; a transparent layer 2 provided at the side of a light-receiving surface 15a, 15b of the photodetectors 5a and 5b; a plurality of spectroscopic portions 3 provided between a light-entering surface 2a of the transparent layer 2 and the photodetectors 5a and 5b; and a plurality of high refractive index transparent members 6 provided closer to the photodetectors 5a and 5b than are the spectroscopic portions 3. The high refractive index transparent members 6 have a higher refractive index than does the transparent layer 2.
摘要翻译：根据本发明的一个实施例的成像装置10包括：多个光电检测器5a和5b; 设置在光电检测器5a和5b的受光面15a，15b侧的透明层2; 设置在透明层2的光入射面2a与光检测器5a，5b之间的多个分光部3; 以及比分光部3更靠近光电探测器5a和5b设置的多个高折射率透明构件6.高折射率透明构件6具有比透明层2更高的折射率。

7. 发明授权

US08591043B2 Light modulation device and projector 有权
标题翻译：调光装置和投影机
公开(公告)号：US08591043B2
公开(公告)日：2013-11-26
申请号：US13165320
申请日：2011-06-21
申请人： Shinichi Wakabayashi , Yoshitaka Hama
发明人： Shinichi Wakabayashi , Yoshitaka Hama
IPC分类号： G03B21/14
CPC分类号： H04N9/3144 , G02F1/133308 , G02F1/133385 , G02F2001/13332 , G03B21/16 , G03B21/208
摘要： A light modulation device includes: a reflective light modulation element which modulates an incident light; a holding section which holds the reflective light modulation element; and a light blocking plate disposed on an incident side which incidents the incident light to the reflective light modulation element, and fixed to the holding section, wherein a thermal conductivity of the light blocking plate is equal to or higher than a thermal conductivity of the holding section.
摘要翻译：光调制装置包括：对入射光进行调制的反射光调制元件; 保持部，其保持反射光调制元件; 以及遮光板，其设置在入射侧，将入射光入射到所述反射光调制元件，并且固定到所述保持部，其中所述遮光板的导热率等于或高于所述保持部的热导率部分。

8. 发明授权

US07402232B2 Silver electroplating solution 有权
标题翻译：银电镀液
公开(公告)号：US07402232B2
公开(公告)日：2008-07-22
申请号：US10512632
申请日：2003-10-30
申请人： Yoko Ogihara , Shinichi Wakabayashi , Masao Nakazawa
发明人： Yoko Ogihara , Shinichi Wakabayashi , Masao Nakazawa
IPC分类号： C25D3/46 , B22F7/00
CPC分类号： C25D3/46
摘要： A silver electroplating solution containing a cyanide as a silver source, said silver electroplating solution characterized by containing at least one type of compound of As, Tl, Se, and Te as a brightener and a brightness adjuster having a benzothiazole skeleton or benzoxazole skeleton. This plating solution utilizes the high speed property of gloss agents to the maximum, does not have an effect on the current density, gives stable non- or semi-gloss plating appearance, and facilitates control.
摘要翻译：含有氰化物作为银源的银电镀溶液，所述银电镀溶液的特征在于含有至少一种As，Tl，Se和Te化合物作为增白剂和具有苯并噻唑骨架或苯并恶唑骨架的亮度调节剂。该镀液最大限度地利用光泽剂的高速特性，不会对电流密度产生影响，提供稳定的非光泽或半光泽的电镀外观，便于控制。

9. 发明授权

US07388293B2 Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions 有权
标题翻译：其制造方法是使用具有不同构造的两部分的半导体装置
公开(公告)号：US07388293B2
公开(公告)日：2008-06-17
申请号：US11151193
申请日：2005-06-14
申请人： Katsuya Fukase , Shinichi Wakabayashi
发明人： Katsuya Fukase , Shinichi Wakabayashi
IPC分类号： H01L23/52 , H01L23/48
CPC分类号： H01L23/147 , H01L21/6835 , H01L23/14 , H01L23/3677 , H01L23/492 , H01L23/49827 , H01L25/0657 , H01L2224/16225 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/3511 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/0401
摘要： An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided around the foregoing interposer portion integrally therewith. On both surfaces of the interposer portions, wiring patterns are formed via insulating layers. The wiring patterns are electrically connected via through holes formed at required positions in the interposer portions. The outer interposer portion is made of an insulator or a metal body. Further, external connection terminals are bonded to one surface of the interposer.
摘要翻译：插入在要安装在其上的半导体芯片与封装板之间的插入器具有由半导体材料制成的插入件部分和与其整体设置在所述插入件部分周围的插入部分。在内插器部分的两个表面上，经由绝缘层形成布线图案。布线图案通过形成在插入件部分中的所需位置的通孔电连接。外部插入部由绝缘体或金属体构成。此外，外部连接端子被接合到插入器的一个表面。

10. 发明授权

US07050676B2 Optical signal encoding apparatus and decoding apparatus 有权
标题翻译：光信号编码装置及解码装置
公开(公告)号：US07050676B2
公开(公告)日：2006-05-23
申请号：US11262954
申请日：2005-11-01
申请人： Jingo Adachi , Shinichi Wakabayashi , Akihiro Itoh
发明人： Jingo Adachi , Shinichi Wakabayashi , Akihiro Itoh
IPC分类号： G02B6/34 , H04J14/00
CPC分类号： H04J14/005 , G02B6/02204 , G02B6/2932 , H04J14/0227 , H04J14/0241
摘要： There is provided an apparatus for performing, by optical code division multiplex access, at least one of encoding and decoding of wavelength-division-multiplexed light. The apparatus includes: an optical input/output section 203 for handling input/output of the wavelength-division-multiplexed light; and N fiber gratings (where N is an integer equal to or greater than two) 101 to 103, which are in a series connection to the optical input/output section 203. Each of the N fiber gratings has a sampled grating structure having an alternating array of first regions (11 to 14; 21 to 24; and 31 to 34) which provide a refractive index modulation with a relatively large amplitude and second regions (201) which provide a refractive index modulation with a relatively small amplitude, the first and second regions being disposed with a constant period P. Each sampled grating structure defines a plurality of reflection wavelength bands which are replicated with a period that is equal to the interval (ΔT) between the central wavelengths of wavelength bands contained in the wavelength-division-multiplexed light. The central values of the respective reflection wavelength bands differ from one fiber grating to another at least during operation.
摘要翻译：提供了一种用于通过光码分多路复用访问来执行波分复用光的编码和解码中的至少一种的装置。该装置包括：用于处理波分复用光的输入/输出的光输入/输出部分203; 和N个光纤光栅（其中N是等于或大于2的整数）101到103，它们与光输入/输出部分203串联连接。每个N个光纤光栅具有采样光栅结构，该采样光栅结构具有第一区域（11至14; 21至24;和31至34）的交替阵列，其提供具有相对较大幅度的折射率调制和第二区域（201）提供具有相对小幅度的折射率调制，第一和第二区域以恒定周期P布置。每个采样的光栅结构限定多个反射波长带，其被复制为等于间隔（DeltaT）的周期，在波分复用光中包含的波长带的中心波长之间。至少在操作期间，各个反射波长带的中心值与一个光纤光栅不同。

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