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    • 6. 发明授权
    • Reflow soldering apparatus
    • 回流焊接装置
    • US5358166A
    • 1994-10-25
    • US43908
    • 1993-04-07
    • Haruo MishinaMasato Itagaki
    • Haruo MishinaMasato Itagaki
    • B23K1/008B23K3/04B23K101/42H05K3/34B23K1/012
    • B23K1/008B23K2201/36
    • A reflow soldering apparatus comprises a preheating chamber and a reflow chamber, both of which are furnished with a plurality of means for circulating a hot gas being composed of a cross flow blower, a divergent nozzle, a heater, a temperature sensor, a temperature controller, and a power regulator etc. The cross-flow blowers above a conveyer are arranged in a back to back manner and the blowers beneath the conveyer are arranged in a face to face manner, and soldering is performed by impinging the hot gas upon a circuit substrate being transferred by the conveyer.A reflow soldering apparatus having a small temperature fluctuation in the preheating chamber and the reflow chamber, high reliability in the soldering by maintaining a desired temperature profile, and preferable economy is provided.
    • 回流焊接装置包括预热室和回流室,它们都配备有多个用于循环由横流鼓风机,发散喷嘴,加热器,温度传感器,温度控制器 和动力调节器等。输送机上方的交叉流动鼓风机以背靠背的方式布置,输送机下面的鼓风机以面对面的方式布置,并且通过将热气体撞击在电路上来进行焊接 基板由输送机传送。 提供了一种在预热室和回流室中具有小的温度波动的回流焊接装置,通过保持期望的温度曲线在焊接中的高可靠性以及优选的经济性。
    • 8. 发明授权
    • Reflow soldering apparatus
    • 回流焊接装置
    • US5163599A
    • 1992-11-17
    • US592058
    • 1990-10-02
    • Haruo MishinaMasato ItagakiMasahumi Wada
    • Haruo MishinaMasato ItagakiMasahumi Wada
    • B23K1/012B23K1/008B23K31/02H05K3/34
    • B23K1/008
    • A reflow soldering apparatus having a pre-heating chamber and a reflow chamber, wherein a hot gas recirculation system including a cross-flow blower, a diverging nozzle and a heater is provided in the reflow chamber or both in the pre-heating chamber and the reflow chamber, so that a hot gas such as heated air is uniformly applied to the object such as a combination of a substrate and an electronic parts carried by the substrate, whereby uniform distributions of temperature and flow velocity of the hot gas are attained. The hot gas recirculation means may be arranged so as to vary the angle at which the hot gas impinges upon the substrate and the breadth over which the hot gas is applied.
    • 一种具有预热室和回流室的回流焊接装置,其中包括横流鼓风机,发散喷嘴和加热器的热气体再循环系统设置在回流室中,或者在预热室和 使得诸如加热空气的热气体均匀地施加到诸如基板和由基板承载的电子部件的组合的物体上,由此获得热气体的温度和流速的均匀分布。 热气体循环装置可以被布置成改变热气体撞击到基底上的角度以及施加热气体的宽度。