专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5187565A Liquid sealed semiconductor device and method of assembling the same 失效
标题翻译：液体密封半导体器件及其组装方法
公开(公告)号：US5187565A
公开(公告)日：1993-02-16
申请号：US717069
申请日：1991-06-18
申请人： Masataka Kawai , Seiji Takemura
发明人： Masataka Kawai , Seiji Takemura
IPC分类号： G01P15/12 , G01P1/00 , G01P15/08 , G01R9/04 , H01L23/22
CPC分类号： G01P1/003 , G01P2015/0828 , H01L2224/45124 , H01L2224/48091
摘要： A liquid sealed semiconductor device comprises a base, semiconductor elements which are mounted to the base, a leading pin passing through the base and protruding to the outside of a package, a cap which is jointed to the base and covers the semiconductor elements, liquid filling the package, a sponge provided within the package and an internal cap for fastening the sponge to the inner wall of the package.The sponge absorbs the pressure change due to the expansion or the contraction of the internal liquid so as to prevent the liquid from leaking out of the package and to protect the package from being deformed. Furthermore, the internal cap eliminates the possibility that the sponge would drop down.
摘要翻译：一种液体密封半导体器件，包括：基座，安装到基座的半导体元件，穿过基座并突出到封装外部的引导引脚，盖子连接到基座并覆盖半导体元件，液体填充所述包装件，设置在所述包装内的海绵和用于将所述海绵紧固到所述包装的内壁的内部盖。海绵由于内部液体的膨胀或收缩而吸收压力变化，以防止液体从包装中泄漏出来并且防止包装件变形。此外，内盖消除了海绵掉落的可能性。

2. 发明授权

US5324985A Packaged semiconductor device 失效
标题翻译：封装半导体器件
公开(公告)号：US5324985A
公开(公告)日：1994-06-28
申请号：US877194
申请日：1992-05-01
申请人： Tomomi Hamada , Seiji Takemura , Masataka Kawai , Takaaki Okidono
发明人： Tomomi Hamada , Seiji Takemura , Masataka Kawai , Takaaki Okidono
IPC分类号： H01L23/12 , H01L23/498 , H01L23/50 , H01L23/02
CPC分类号： H01L23/49838 , H01L23/49811 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01079 , H01L2924/14
摘要： A semiconductor element such as an encapsulated or non-encapsulated semiconductor chip having a multitude of terminals is mounted on one surface of a quadrate substrate. A multitude of connector pins extend from the other surface of the substrate. A plurality of connector lands are formed on a surface of the substrate and electrically connected to the corresponding terminals of the semiconductor element. The connector lands are electrically connected to the connector pins through wiring. The connector pins have a pitch that is larger near the connector lands than at locations farther away from the lands. The pitch between adjacent connector pins is made larger as necessary or desired so as to allow the passage of an increased number of connecting wires between the adjacent connector pins, thus ensuring high density wiring with improved efficiency.
摘要翻译：诸如具有多个端子的封装或未封装的半导体芯片的半导体元件安装在方形衬底的一个表面上。多个连接器引脚从基板的另一个表面延伸。多个连接器平台形成在基板的表面上并与半导体元件的相应端子电连接。连接器焊盘通过布线电连接到连接器引脚。连接器引脚在连接器平台附近具有的距离远远高于距离焊盘更远的位置。根据需要或期望相邻连接器引脚之间的间距变得更大，以便允许在相邻的连接器引脚之间通过更多数量的连接线，从而确保高密度布线并提高效率。

3. 发明授权

US5251107A Semiconductor package 失效
标题翻译：半导体封装
公开(公告)号：US5251107A
公开(公告)日：1993-10-05
申请号：US798737
申请日：1991-11-27
申请人： Seiji Takemura , Masataka Kawai
发明人： Seiji Takemura , Masataka Kawai
IPC分类号： H01L23/12 , H01L23/498 , H05K7/02
CPC分类号： H01L23/49811 , H01L23/49838 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/15312 , H01L2924/16195
摘要： A quadrate semiconductor element in the form of a quad flat package, a bare chip, and the like mounted on a substrate has a plurality of first terminals electrically connected through connecting wires to corresponding second terminals which are disposed on the substrate around the semiconductor element. The second terminals are disposed on the substrate such that the number of second terminals per unit area is less at locations near the corners of the quadrate semiconductor element than at the other portions of the substrate. This arrangement enlarges the effective wiring area for the connecting wires at the corners, thus greatly improving wiring efficiency.
摘要翻译：安装在基板上的四边形扁平封装，裸芯片等形式的正方形半导体元件具有通过连接线电连接到相应的第二端子的多个第一端子，所述第二端子设置在半导体元件周围的基板上。第二端子设置在基板上，使得每个单位面积的第二端子的数量在方形半导体元件的角部附近比在基板的其它部分处更少。这样可以增加角落处的连接线的有效接线面积，大大提高布线效率。

4. 发明申请

US20110266822A1 CARGO NET DEVICE 有权
标题翻译：货物网络设备
公开(公告)号：US20110266822A1
公开(公告)日：2011-11-03
申请号：US13143028
申请日：2010-01-20
申请人： Seiji Takemura
发明人： Seiji Takemura
IPC分类号： B60R5/04
CPC分类号： B60R21/06
摘要： A pair of parallel pins abutting against the inner peripheral surface of a hollow shaft are provided to a first arm part of a shank at a predetermined spacing in the longitudinal direction. This prevents the shank from tilting or rattling. Further, an insertion hole of the retaining cap and the cross section of the first arm part each have an elliptical shape, and thus the rotation of the shank with respect to the hollow shaft is restricted and the position of the shank is kept such that the interlocking part points upward.
摘要翻译：一对与中空轴的内周面抵接的平行销以长度方向以预定的间隔设置在柄的第一臂部。这样可防止柄倾斜或摇晃。此外，保持帽的插入孔和第一臂部的横截面各自具有椭圆形状，因此柄相对于空心轴的旋转受到限制，并且保持柄的位置，使得联锁部分向上。

5. 发明申请

US20110315731A1 CARGO RETAINER DEVICE FOR VEHICLE 审中-公开
标题翻译：用于车辆的货物保留装置
公开(公告)号：US20110315731A1
公开(公告)日：2011-12-29
申请号：US13201088
申请日：2010-03-12
申请人： Seiji Takemura , Hideo Chinzei
发明人： Seiji Takemura , Hideo Chinzei
IPC分类号： B60R11/00
CPC分类号： B60P7/0815
摘要： A cargo retaining device for a vehicle includes: a pedestal part having an abutting part configured to be located so as to straddle a pair of guide pieces; an interlocking part provided on the pedestal part for retaining a cargo; a shaft body supported movably along an axis direction by the pedestal part; and a locking part formed into an elongated shape having a width dimension smaller than a width dimension of a slit between the pair of guide pieces and a length dimension larger than the width dimension of the slit, and supported by one end of the shaft body. Further, the cargo retaining device includes a locking lever supported by the other end of the shaft body, and configured so as to change a position between a locked position for pulling the locking part up to the pedestal part side and an unlocked position for causing the locking part to be apart from the pedestal part.
摘要翻译：一种用于车辆的货物保持装置，包括：具有邻接部件的基座部件，其构造成跨越一对引导件定位; 设置在基座部上用于保持货物的互锁部分; 轴体，其通过所述基座部沿着轴线方向可移动地支撑; 以及形成为细长形状的锁定部件，其宽度尺寸小于所述一对引导件之间的狭缝的宽度尺寸，并且长度尺寸大于所述狭缝的宽度尺寸，并由所述轴体的一端支撑。此外，货物保持装置包括由轴体的另一端支撑的锁定杆，并且被构造成改变用于将锁定部分拉到基座部分侧的锁定位置和用于使锁定部分的锁定位置之间的位置，锁定部分与基座部分分开。

6. 发明申请

US20110260484A1 CARGO NET DEVICE 有权
标题翻译：货物网络设备
公开(公告)号：US20110260484A1
公开(公告)日：2011-10-27
申请号：US13141580
申请日：2010-01-20
申请人： Seiji Takemura
发明人： Seiji Takemura
IPC分类号： B60R7/00
CPC分类号： B60R21/06 , B60R5/047 , B60R2021/065
摘要： A pair of parallel pins abutting against the inner peripheral surface of a hollow shaft are provided to a first arm part of a shank at a predetermined spacing in the longitudinal direction. This prevents the shank from tilting or rattling. Further, a coil spring restricts the rotation of the shank around the first arm part and keeps the position of the shank such that an interlocking part points upward.
摘要翻译：一对与中空轴的内周面抵接的平行销以长度方向以预定的间隔设置在柄的第一臂部。这样可防止柄倾斜或摇晃。此外，螺旋弹簧限制柄部围绕第一臂部的旋转并且保持柄部的位置使得互锁部分向上指向。

7. 发明授权

US4065233A Electric blower assembly having volute passages to direct air into motor housing 失效
标题翻译：电动鼓风机组件具有蜗壳以将空气引导到电动机壳体中
公开(公告)号：US4065233A
公开(公告)日：1977-12-27
申请号：US595421
申请日：1975-07-14
申请人： Masao Torigoe , Kunihito Mori , Mitsuru Tsuchiya , Seiji Takemura
发明人： Masao Torigoe , Kunihito Mori , Mitsuru Tsuchiya , Seiji Takemura
IPC分类号： F04D25/08 , F04D29/44 , F04B35/04 , F04B39/06
CPC分类号： F04D25/082 , F04D29/441
摘要： There is disclosed an electric blower assembly provided with an air guide structure designed such that the current of air expelled from a rotating impeller under the influence of centrifugal force is guided to the body of an electric motor while being accelerated. The air guide structure comprises an air guide block having front and rear compartments. The front compartment includes a plurality of volute chambers designed such that, during flow of air within the volute chambers, the dynamic pressure can be converted into static pressure. The flow of air under the static pressure is subsequently guided at a relatively low pneumatic velocity into the rear compartment and then into the body of the motor to cool the latter. The air used to cool the motor is thereafter exhausted to the outside of the motor.
摘要翻译：公开了一种设置有导风结构的电动鼓风机组件，其设计成使得在受到离心力的影响下从旋转叶轮排出的空气的电流在加速时被引导到电动机的主体。空气引导结构包括具有前隔室和后隔间的空气引导块。前隔室包括多个蜗壳室，其设计成使得在蜗壳腔内的空气流动期间，动压可以转换成静压。然后在静压下的空气流以相对低的气动速度被引导到后隔室中，然后进入电机的主体以冷却。然后用于冷却电动机的空气被排出到电动机的外部。

8. 发明授权

US08419102B2 Cargo net device 有权
标题翻译：货网装置
公开(公告)号：US08419102B2
公开(公告)日：2013-04-16
申请号：US13141580
申请日：2010-01-20
申请人： Seiji Takemura
发明人： Seiji Takemura
IPC分类号： B60R21/06
CPC分类号： B60R21/06 , B60R5/047 , B60R2021/065
摘要： A pair of parallel pins abutting against the inner peripheral surface of a hollow shaft are provided to a first arm part of a shank at a predetermined spacing in the longitudinal direction. This prevents the shank from tilting or rattling. Further, a coil spring restricts the rotation of the shank around the first arm part and keeps the position of the shank such that an interlocking part points upward.
摘要翻译：一对与中空轴的内周面抵接的平行销以长度方向以预定的间隔设置在柄的第一臂部。这样可防止柄倾斜或摇晃。此外，螺旋弹簧限制柄部围绕第一臂部的旋转并且保持柄部的位置使得互锁部分向上指向。

9. 发明授权

US5333505A Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same 失效
标题翻译：用于高温和高压的半导体压力传感器及其制造方法
公开(公告)号：US5333505A
公开(公告)日：1994-08-02
申请号：US3437
申请日：1993-01-12
申请人： Yoshiharu Takahashi , Tetsuya Hirose , Hiroshi Otani , Seiji Takemura
发明人： Yoshiharu Takahashi , Tetsuya Hirose , Hiroshi Otani , Seiji Takemura
IPC分类号： G01L9/00 , G01L9/06 , G01L9/08
CPC分类号： G01L19/0084 , G01L19/147 , H01L2224/48091 , H01L2224/48247 , H01L2924/10155 , H01L2924/1815 , Y10T29/49103
摘要： In a semiconductor pressure sensor, a dam which prevents a sheathing resin from flowing into a diaphragm portion during the molding of the sheathing resin is disposed on the outer periphery of piezoresistors and the diaphragm portion on the surface of a semiconductor pressure sensor chip. The volume of the base and that of the semiconductor pressure sensor chip are adjusted so that a tensile force exerted upon the semiconductor pressure sensor chip by the base cancels a compressive force exerted upon the semiconductor pressure sensor by the sheathing resin when the temperature of the semiconductor pressure sensor returns to an ordinary room temperature from a high temperature. As a result, strain is not caused in the semiconductor pressure sensor chip, and therefore measurements of pressure with a high degree of accuracy can be performed.
摘要翻译：在半导体压力传感器中，在压电电阻器的外周和半导体压力传感器芯片的表面上的隔膜部分设置防止护套树脂在护套树脂成型期间流入隔膜部分的堤坝。调整基座的体积和半导体压力传感器芯片的体积，使得由基座施加到半导体压力传感器芯片上的张力在半导体器件的温度下抵消由护套树脂施加在半导体压力传感器上的压缩力压力传感器从高温回到普通室温。结果，在半导体压力传感器芯片中不会引起应变，因此能够高精度地测量压力。

10. 发明授权

US5196917A Carrier tape 失效
标题翻译：载带
公开(公告)号：US5196917A
公开(公告)日：1993-03-23
申请号：US444973
申请日：1989-12-04
申请人： Tetsuya Ueda , Kou Shimomura , Osamu Nakagawa , Seiji Takemura , Kazunari Michii
发明人： Tetsuya Ueda , Kou Shimomura , Osamu Nakagawa , Seiji Takemura , Kazunari Michii
IPC分类号： H01L21/56 , H01L21/60 , H01L23/48
CPC分类号： H01L23/48 , H01L2224/16
摘要： A carrier tape includes an insulating film supporting a plurality of leads. The film has a center device hole for receiving a semiconductor chip therein, a plurality of outer lead holes formed at the periphery of the center device hole, a lead supporting portion positioned between the center device hole and the outer lead holes, and a link portion positioned between a pair of adjacent outer lead holes and connected to the lead supporting portion for directing the flow of molten resin during encapsulation of the semiconductor chip. The link portion includes an opening or recess. The plurality of leads of the carrier tape are supported on the lead supporting of the film, with one end portion of each lead projecting into the center device hole of the film. During manufacture, a semiconductor chip having a plurality of electrodes is positioned within the center device hole, and the leads are electrically connected to respective electrodes of the semiconductor chip. The resultant chip is placed within a cavity of a mold, and a molten resin is injected into the cavity through the opening or recess passage formed in the link portion of the film.
摘要翻译：载带包括支撑多根引线的绝缘膜。薄膜具有用于容纳半导体芯片的中心装置孔，形成在中心装置孔周边的多个外部引线孔，位于中心装置孔和外部引线孔之间的引线支承部分，以及连接部分定位在一对相邻的外引线孔之间并连接到引线支撑部分，用于在半导体芯片封装期间引导熔融树脂的流动。连杆部分包括开口或凹槽。载带的多个引线被支撑在膜的引线支撑上，每个引线的一个端部突出到膜的中心装置孔中。在制造过程中，具有多个电极的半导体芯片位于中心器件孔内，引线与半导体芯片的各个电极电连接。将所得的芯片放置在模具的空腔内，并且通过形成在薄膜的连接部分中的开口或凹槽通道将熔融树脂注入空腔中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式