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    • 2. 发明申请
    • TRANSISTOR AND DISPLAY DEVICE USING THE SAME
    • 使用相同的晶体管和显示器件
    • US20110204368A1
    • 2011-08-25
    • US13026511
    • 2011-02-14
    • Masashi TSUBUKUKosei NODA
    • Masashi TSUBUKUKosei NODA
    • H01L29/786
    • H01L29/7869H01L27/1225H01L27/156
    • The band tail state and defects in the band gap are reduced as much as possible, whereby optical absorption of energy which is in the vicinity of the band gap or less than or equal to the band gap is reduced. In that case, not by merely optimizing conditions of manufacturing an oxide semiconductor film, but by making an oxide semiconductor to be a substantially intrinsic semiconductor or extremely close to an intrinsic semiconductor, defects on which irradiation light acts are reduced and the effect of light irradiation is reduced essentially. That is, even in the case where light with a wavelength of 350 nm is delivered at 1×1013 photons/cm2·sec, a channel region of a transistor is formed using an oxide semiconductor, in which the absolute value of the amount of the variation in the threshold voltage is less than or equal to 0.65 V.
    • 频带尾部状态和带隙中的缺陷尽可能地减小,由此减小了在带隙附近或小于或等于带隙的能量的光吸收。 在这种情况下,不是仅通过优化氧化物半导体膜的制造条件,而是通过使氧化物半导体成为本质上的本征半导体,或者非常接近本征半导体,减少照射光的作用的缺陷和光照射 基本上减少了。 也就是说,即使在以1×1013个光子/ cm 2·sec传递波长为350nm的光的情况下,也可以使用氧化物半导体形成晶体管的沟道区域,其中, 阈值电压的变化小于或等于0.65 V.
    • 5. 发明申请
    • LOGIC CIRCUIT AND SEMICONDUCTOR DEVICE
    • 逻辑电路和半导体器件
    • US20110089975A1
    • 2011-04-21
    • US12901057
    • 2010-10-08
    • Shunpei YAMAZAKIJun KOYAMAMasashi TSUBUKUKosei NODA
    • Shunpei YAMAZAKIJun KOYAMAMasashi TSUBUKUKosei NODA
    • H03K19/08H01L29/12
    • H01L29/7869H01L22/34H01L27/0207H01L27/1225H01L29/78696H01L2924/0002H01L2924/00
    • A logic circuit includes a thin film transistor having a channel formation region formed using an oxide semiconductor, and a capacitor having terminals one of which is brought into a floating state by turning off the thin film transistor. The oxide semiconductor has a hydrogen concentration of 5×1019 (atoms/cm3) or less and thus substantially serves as an insulator in a state where an electric field is not generated. Therefore, off-state current of a thin film transistor can be reduced, leading to suppressing the leakage of electric charge stored in a capacitor, through the thin film transistor. Accordingly, a malfunction of the logic circuit can be prevented. Further, the excessive amount of current which flows in the logic circuit can be reduced through the reduction of off-state current of the thin film transistor, resulting in low power consumption of the logic circuit.
    • 逻辑电路包括具有使用氧化物半导体形成的沟道形成区域的薄膜晶体管,以及通过关闭薄膜晶体管而使端子中的一个成为浮置状态的电容器。 氧化物半导体的氢浓度为5×1019(原子/ cm3)以下,因此在不产生电场的状态下基本上用作绝缘体。 因此,可以减小薄膜晶体管的截止电流,从而通过薄膜晶体管抑制存储在电容器中的电荷的泄漏。 因此,可以防止逻辑电路的故障。 此外,可以通过减小薄膜晶体管的截止电流来降低在逻辑电路中流动的过量的电流,导致逻辑电路的低功耗。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20120248432A1
    • 2012-10-04
    • US13423468
    • 2012-03-19
    • Kosei NODANoriyoshi SUZUKI
    • Kosei NODANoriyoshi SUZUKI
    • H01L29/786H01L21/36
    • H01L29/7869H01L21/02472H01L21/02483H01L21/02554H01L21/02565H01L21/02631H01L21/02664H01L29/42384H01L29/66969
    • A highly reliable semiconductor device having stable electric characteristics is provided by suppressing, in a transistor including an oxide semiconductor film, diffusion of indium into an insulating film in contact with the oxide semiconductor film and improving the characteristics of the interface between the oxide semiconductor film and the insulating film. In an oxide semiconductor film containing indium, the indium concentration at a surface is decreased, thereby preventing diffusion of indium into an insulating film on and in contact with the oxide semiconductor film. By decreasing the indium concentration at the surface of the oxide semiconductor film, a layer which does not substantially contain indium can be formed at the surface. By using this layer as part of the insulating film, the characteristics of the interface between the oxide semiconductor film and the insulating film in contact with the oxide semiconductor film are improved.
    • 通过在包括氧化物半导体膜的晶体管中抑制铟扩散到与氧化物半导体膜接触的绝缘膜中,提高了具有稳定电特性的高度可靠的半导体器件,并且改善了氧化物半导体膜与氧化物半导体膜之间的界面的特性 绝缘膜。 在含有铟的氧化物半导体膜中,表面的铟浓度降低,从而防止铟在氧化物半导体膜上与绝缘膜的扩散接触。 通过降低氧化物半导体膜表面的铟浓度,可以在表面形成实质上不含有铟的层。 通过使用该层作为绝缘膜的一部分,改善了与氧化物半导体膜接触的氧化物半导体膜与绝缘膜之间的界面的特性。
    • 7. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20120228605A1
    • 2012-09-13
    • US13410604
    • 2012-03-02
    • Kosei NODA
    • Kosei NODA
    • H01L29/786H01L29/22H01L21/44
    • H01L29/66742H01L27/1156H01L27/1207H01L29/66969H01L29/78618H01L29/7869H01L29/78696
    • A semiconductor device includes an oxide semiconductor film including a pair of first regions, a pair of second regions, and a third region; a pair of electrodes in contact with the oxide semiconductor film; a gate insulating film over the oxide semiconductor film; and a gate electrode provided between the pair of electrodes with the gate insulating film interposed therebetween. The pair of first regions overlap with the pair of electrodes, the third region overlaps with the gate electrode, and the pair of second regions are formed between the pair of first regions and the third region. The pair of second regions and the third region each contain nitrogen, phosphorus, or arsenic. The pair of second regions have a higher element concentration than the third region.
    • 半导体器件包括包括一对第一区域,一对第二区域和第三区域的氧化物半导体膜; 与氧化物半导体膜接触的一对电极; 氧化物半导体膜上的栅极绝缘膜; 以及设置在所述一对电极之间的栅电极,其间插入有所述栅极绝缘膜。 所述一对第一区域与所述一对电极重叠,所述第三区域与所述栅电极重叠,并且所述一对第二区域形成在所述一对第一区域与所述第三区域之间。 一对第二区域和第三区域各自含有氮,磷或砷。 一对第二区域具有比第三区域更高的元件浓度。
    • 9. 发明申请
    • METHOD FOR MANUFACTURING SOI SUBSTRATE AND SEMICONDUCTOR DEVICE
    • 制造SOI衬底和半导体器件的方法
    • US20100184269A1
    • 2010-07-22
    • US12684269
    • 2010-01-08
    • Kosei NODA
    • Kosei NODA
    • H01L21/762
    • H01L21/76254
    • To provide a method for manufacturing a semiconductor substrate provided with a single crystal semiconductor layer which can be used practically even when a substrate with a low upper temperature limit, such as a glass substrate, is used. An oxide film is formed on a single crystal semiconductor substrate; accelerated ions are introduced into the single crystal semiconductor substrate through the oxide film to form an embrittled region in the single crystal semiconductor substrate; a supporting substrate is bonded such that the supporting substrate and the single crystal semiconductor substrate face each other with the oxide film interposed therebetween; separation is performed at the embrittled region into the supporting substrate to which a single crystal semiconductor layer is bonded and part of the single crystal semiconductor substrate by heating of the single crystal semiconductor substrate; first etching is performed on a surface of the single crystal semiconductor layer bonded to the supporting substrate with a substrate bias applied; the single crystal semiconductor layer is irradiated with a laser beam and at least part of the surface of the single crystal semiconductor layer is melted and solidified; and second etching is performed on the surface of the single crystal semiconductor layer with no substrate bias applied.
    • 为了提供一种制造具有单晶半导体层的半导体衬底的方法,即使使用诸如玻璃衬底的上限温度低的衬底也可以实际使用。 在单晶半导体基板上形成氧化膜; 加速离子通过氧化膜被引入到单晶半导体衬底中,以在单晶半导体衬底中形成脆化区; 支撑基板被接合,使得支撑基板和单晶半导体基板彼此面对,氧化膜插入其间; 通过单晶半导体衬底的加热,在脆化区域进行与单晶半导体层接合的支撑衬底和部分单晶半导体衬底的分离; 在施加了衬底偏压的情况下,在结合到支撑衬底的单晶半导体层的表面上进行第一蚀刻; 用激光束照射单晶半导体层,并且使单晶半导体层的表面的至少一部分熔融固化; 并且在不施加衬底偏压的情况下对单晶半导体层的表面进行第二蚀刻。