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    • 10. 发明授权
    • Adhesive composition and adhesive film
    • 粘合剂组合物和粘合剂膜
    • US08426543B2
    • 2013-04-23
    • US12516363
    • 2007-09-27
    • Takahiro AsaiKoichi MisumiAtsushi MiyanariYoshihiro InaoAkihiko Nakamura
    • Takahiro AsaiKoichi MisumiAtsushi MiyanariYoshihiro InaoAkihiko Nakamura
    • C08F20/10
    • C09J133/04C09J7/381C09J125/14C09J135/06C09J2203/326C09J2205/114C09J2425/00C09J2433/00H01L21/6835H01L2221/6834H01L2924/30105Y10T428/2852Y10T428/2891
    • An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.
    • 作为主要成分,本发明的粘合剂组合物包含通过使包含苯乙烯的单体组合物共聚而制造的聚合物, 具有链结构的(甲基)丙烯酸烷基酯; 具有脂肪族环的(甲基)丙烯酸酯; 和具有芳香环的(甲基)丙烯酸酯,其中:所述苯乙烯的含量为40〜69质量份; 具有链结构的(甲基)丙烯酸烷基酯的含量为20〜30质量份; 具有脂肪族环的(甲基)丙烯酸酯的含量为10〜25质量份; 具有芳环的(甲基)丙烯酸酯的含量为1〜5质量份,上述成分的总量为100质量份。 这允许在高温环境下提供具有高粘合强度的粘合剂组合物,以及即使在高温处理之后也具有高耐热性,高耐碱性和从半导体晶片等剥离的容易性。