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    • 5. 发明授权
    • Semiconductor memory device having stacked-capacitor type memory cells
    • 具有堆叠电容器型存储单元的半导体存储器件
    • US4754313A
    • 1988-06-28
    • US93128
    • 1987-09-02
    • Yoshihiro TakemaeTomio NakanoMasao NakanoKimiaki Sato
    • Yoshihiro TakemaeTomio NakanoMasao NakanoKimiaki Sato
    • G11C11/401G11C11/404H01L21/822H01L21/8242H01L27/10H01L27/108H01L27/02H01L29/04H01L29/78
    • G11C11/404H01L21/8221H01L27/10808
    • A semiconductor memory device including: a substrate; a plurality of word lines; a plurality of bit lines; and a plurality of memory cells, each positioned at an intersection defined by one of the word lines and one of the bit lines and including a transfer transistor and a capacitor. Each of the memory cells has a first insulating layer covering a gate of the transfer transistor. The capacitor in each memory cell includes a second conductive layer which contacts one of source and drain regions of the transfer transistor in the memory cell, through the first insulating layer, and extends over the gate of the transfer transistor, a second insulating layer formed on the first conductive layer, and a second conductive layer extending over the second insulating layer. The semiconductor memory device further includes an additional conductive layer directly connected to the other of the source and drain regions of the transfer transistor in the memory cell, through the first insulating layer covering same, and extending over the gate of the adjoining transfer transistors. Each bit line is connected to the other of the source and drain regions through the additional conductive layer. A method for manufacturing a semiconductor memory device having the above construction.
    • 一种半导体存储器件,包括:衬底; 多个字线; 多个位线; 以及多个存储单元,每个存储单元位于由字线之一和一个位线限定的交点处,并且包括转移晶体管和电容器。 每个存储单元具有覆盖转移晶体管的栅极的第一绝缘层。 每个存储单元中的电容器包括第二导电层,其通过第一绝缘层接触存储单元中的转移晶体管的源区和漏区之一,并延伸在转移晶体管的栅极上,第二绝缘层形成在 第一导电层和在第二绝缘层上延伸的第二导电层。 半导体存储器件还包括通过覆盖其的第一绝缘层直接连接到存储单元中的传输晶体管的源极和漏极区域中的另一个的另外的导电层,并且在相邻的转移晶体管的栅极上延伸。 每个位线通过附加导电层连接到另一个源极和漏极区域。 一种具有上述结构的半导体存储器件的制造方法。
    • 9. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US4511997A
    • 1985-04-16
    • US439507
    • 1982-11-05
    • Shigeki NozakiYoshihiro TakemaeTomio Nakano
    • Shigeki NozakiYoshihiro TakemaeTomio Nakano
    • G11C11/419G11C11/34G11C11/401G11C11/408G11C11/4096G11C11/40
    • G11C11/4096
    • A metal-insulator semiconductor dynamic memory device including sense amplifiers arrayed on a semiconductor substrate and divided into a plurality of sense amplifier groups. Column decoders are provided, one decoder for each sense amplifier group, each sense amplifier group being selected by the column decoder. One or more control signal lines for simultaneously selecting the output signals of at least two sense amplifiers in the sense amplifier group selected by the column decoder, a plurality of data buses for transferring the output signals of at least two sense amplifiers selected by one or more control signal lines, are included in the memory device. All of the sense amplifiers have the control signal lines and the data buses in common.
    • 一种金属绝缘体半导体动态存储器件,包括排列在半导体衬底上并分成多个读出放大器组的读出放大器。 提供列解码器,每个读出放大器组的一个解码器,每个读出放大器组由列解码器选择。 一个或多个控制信号线,用于同时选择由列解码器选择的读出放大器组中的至少两个读出放大器的输出信号;多个数据总线,用于传送由一个或多个选择的至少两个读出放大器的输出信号 控制信号线被包括在存储器件中。 所有的读出放大器都具有控制信号线和数据总线。