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    • 3. 发明授权
    • Nonvolatile memory element comprising a resistance variable element and a diode
    • 非易失性存储元件包括电阻可变元件和二极管
    • US08796660B2
    • 2014-08-05
    • US12375881
    • 2007-09-21
    • Takeshi TakagiTakumi Mikawa
    • Takeshi TakagiTakumi Mikawa
    • H01L29/02H01L47/00H01L29/04H01L29/06H01L29/08H01L31/0352H01L45/00H01L27/24H01L27/10H01L21/00G11C11/00
    • H01L45/04H01L27/101H01L27/2409H01L27/2418H01L27/2463H01L45/1233H01L45/1273H01L45/146H01L45/1683
    • A nonvolatile memory element (20) of the present invention comprises a resistance variable element (14) and a diode (18) which are formed on a substrate (10) such that the resistance variable element (14) has a resistance variable layer (11) sandwiched between a lower electrode (12) and an upper electrode (13), and the diode (18) which is connected in series with the resistance variable element (14) in the laminating direction and has an insulating layer or semiconductor layer (15) sandwiched between a first electrode (16) at the lower side and a second electrode (17) at the upper side. The resistance variable layer (11) is embedded in a first contact hole (21) formed on the lower electrode (12). A first area (22) where insulating layer or semiconductor layer (15) of the diode (18) is in contact with a first electrode (16) of the diode (18) is larger than at least one of a second area (23) where the resistance variable layer (11) is in contact with the upper electrode (13) and a third area (24) where the resistance variable layer (11) is in contact with the lower electrode (12).
    • 本发明的非易失性存储元件(20)包括形成在基板(10)上的电阻可变元件(14)和二极管(18),使得电阻可变元件(14)具有电阻变化层(11 )和位于下电极(12)和上电极(13)之间的二极管(18),以及与电阻可变元件(14)在层叠方向上串联连接并具有绝缘层或半导体层(15)的二极管 )夹在下侧的第一电极(16)和上侧的第二电极(17)之间。 电阻变化层(11)嵌入形成在下电极(12)上的第一接触孔(21)中。 二极管(18)的绝缘层或半导体层(15)与二极管(18)的第一电极(16)接触的第一区域(22)大于第二区域(23)中的至少一个, 其中电阻变化层(11)与上电极(13)接触,电阻变化层(11)与下电极(12)接触的第三区域(24)。
    • 10. 发明授权
    • Method of programming variable resistance element, method of initializing variable resistance element, and nonvolatile storage device
    • 编程可变电阻元件的方法,初始化可变电阻元件的方法和非易失性存储器件
    • US08432721B2
    • 2013-04-30
    • US13201890
    • 2011-02-01
    • Mitsuteru IijimaTakeshi Takagi
    • Mitsuteru IijimaTakeshi Takagi
    • G11C11/00
    • G11C13/0069G11C13/0007G11C13/0097G11C2013/0073G11C2013/0083G11C2213/32G11C2213/72G11C2213/79H01L45/08H01L45/146
    • Programming a variable resistance element includes: a writing step of applying a writing voltage pulse to transition metal oxide comprising two stacked metal oxide layers to decrease resistance of the metal oxide, each metal oxide layer having different oxygen deficiency; and an erasing step of applying an erasing voltage pulse, of different polarity than the writing pulse, to the metal oxide to increase resistance of the metal oxide. |Vw1|>|Vw2|, Vw1 representing voltage of the writing pulse for first to N-th writing steps, and Vw2 representing voltage of the writing pulse for (N+1)-th and subsequent writing steps, N being at least equal to 1, te1>te2, te1 representing pulse width of the erasing pulse for first to M-th erasing steps, and te2 representing pulse width of the erasing pulse for (M+1)-th and subsequent erasing steps. M>1. The (N+1)-th writing step follows the M-th erasing step.
    • 编程可变电阻元件包括:写入步骤,对包含两个堆叠的金属氧化物层的过渡金属氧化物施加写入电压脉冲,以降低金属氧化物的电阻,每个金属氧化物层具有不同的氧缺乏; 以及将与写入脉冲不同的擦除电压脉冲施加到金属氧化物以增加金属氧化物的电阻的擦除步骤。 | Vw1 |> | Vw2 |,表示第一至第N写入步骤的写入脉冲的电压的Vw1,以及表示第(N + 1)个和后续写入步骤的写入脉冲的电压的Vw2,N至少相等 到1,te1> te2,te1表示第一到第M擦除步骤的擦除脉冲的脉冲宽度,te2表示用于(M + 1)个和随后的擦除步骤的擦除脉冲的脉冲宽度。 M> 1。 第(N + 1)个写入步骤在第M擦除步骤之后。