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    • 3. 发明授权
    • Semiconductor memory device and method relieving defect of semiconductor
memory device
    • 半导体存储器件和解决半导体存储器件缺陷的方法
    • US6018488A
    • 2000-01-25
    • US104626
    • 1998-06-25
    • Akihiro MishimaYoichi SuzukiYasumitsu NozawaMasami Masuda
    • Akihiro MishimaYoichi SuzukiYasumitsu NozawaMasami Masuda
    • G11C7/00
    • G11C7/00
    • A semiconductor memory device includes bit lines and word lines arranged lengthwise and breadthwise, memory cells 1 capable of reading out and writing in, MOS transistors Q1 and Q2 for pre-charge, MOS transistors Q3 for short-circuiting, and transistors Q4 and Q5 for setting voltage level. The bit lines are provided two pieces at each bit. Between the MOS transistors Q1, Q2 for pre-charge and the bit lines driving power supply terminal Vcc, three pieces of the fuses F1-F3 are connected at each column. When the leak defect occurs to the bit lines, all of the fuses F1-F3 connected to the bit lines are cut. Further, a semiconductor memory device includes a plurality of section regions, a redundancy circuit RD1 which replaces a defective cell at each section region, a redundancy circuit RD2 which replaces the defective cell at each row address. The section regions are provided at each address in the column direction. In each section region, cell ground power supply lines Vss are formed circularly. Outside each section region a pad ground power supply line Vss' are formed. Each of the cell ground power supply lines Vss and the pad ground power supply line Vss' are connected via a plurality of fuses F connected in parallel.
    • 半导体存储器件包括纵向和纵向布置的位线和字线,能够读出和写入的用于预充电的MOS晶体管Q1和Q2,用于短路的MOS晶体管Q3和用于短路的MOS晶体管Q3的晶体管Q4和Q5 设置电压电平。 位线在每个位都提供两段。 在用于预充电的MOS晶体管Q1,Q2和位线驱动电源端子Vcc之间,在每列连接三个保险丝F1-F3。 当位线发生泄漏故障时,连接到位线的所有保险丝F1-F3被切断。 此外,半导体存储器件包括多个部分区域,替换每个部分区域的有缺陷的单元的冗余电路RD1,替代每个行地址处的有缺陷单元的冗余电路RD2。 在列方向的每个地址处设置区域区域。 在每个区域中,单元地电源线Vss是循环形成的。 在每个区域区域之外形成焊盘接地电源线Vss'。 单元接地电源线Vss和焊盘接地电源线Vss'中的每一个通过并联连接的多个保险丝F连接。
    • 4. 发明授权
    • Data read circuit for semiconductor storage device
    • 半导体存储器件的数据读取电路
    • US5068831A
    • 1991-11-26
    • US550025
    • 1990-07-09
    • Satoru HoshiMasami MasudaTakayuki Kawaguchi
    • Satoru HoshiMasami MasudaTakayuki Kawaguchi
    • G11C11/41G11C7/06G11C7/12G11C7/22G11C11/409G11C11/417H01L21/8242H01L27/10H01L27/108
    • G11C7/12G11C7/06G11C7/22
    • In a data read circuit, for a semiconductor storage device, data of a memory cell (11) selected according to an address is inputted to a sense amplifier (22) via a pair of complementary first data lines (N1 to N6). The sense amplifier outputs the inputted and amplified data to a pair of complementary second data lines (N7, N8). First switching means (Tr3) equalizes the pair of complementary first data lines (N5, N6) at the input side of the sense amplifier (22) by making the first data lines conductive with respect to each other. Second switching means (Tr4) equalizes the pair of complementary second data lines (N7, N8) by making the second data lines conductive with respect to each other. Third switching means (Tr5, Tr6) equalizes by making the pair of first data lines (N5, N6) at the input side of the sense amplifier (22) and corresponding ones of the pair of second data lines (N7, N8) conductive with respect to each other. Second equalizing pulse generator means (42) generates a second equalizing pulse (.PHI..sub.eq ') when the address is changed, and turns on the first switch means (Tr3) by applying the second equalizing pulse to a control terminal of the first switch means. First equalizing pulse generator means (41) generates a first equalizing pulse (.PHI..sub.eq) when the address is changed, and turns on the second and third switching means (Tr4, Tr5, Tr6) by applying the second equalizing pulse to gate terminals of the second and third switching means. The load capacitance ]C(.PHI..sub.eq ')] connected to an output terminal of the second equalizing pulse generating means (42) is set smaller than the load capacitance [C(.PHI..sub.eq)] connected to an output terminal of the first equalizing pulse generator means (41). The number of stages of logical circuits constituting the second equalizing pulse generator means (42) is smaller than the number of stages of logical circuits constituting the first equalizing pulse generator means (41). Accordingly, with this data read circuit for a semiconductor storage device, the second equalizing pulse (.PHI..sub.eq ') from the second equalizing pulse generator means (42) is established earlier than the first equalizing pulse (.PHI..sub.eq) from the first equalizing pulse generator means (41).
    • 6. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20080285324A1
    • 2008-11-20
    • US11834932
    • 2007-08-07
    • Yukako HATTORIKatsumi AbeMasami MasudaHiroshi Nakamura
    • Yukako HATTORIKatsumi AbeMasami MasudaHiroshi Nakamura
    • G11C5/02
    • H01L27/105G11C7/1042G11C7/18H01L27/0207H01L27/11898
    • Shunt regions are formed at certain intervals in a memory cell array region as extending in a second direction. The shunt regions each include a contact formed to connect a word line or a signal line wired in the same direction to another metal wire. Extension regions are each formed of an extension of the shunt region in the data cache array region. Data input/output lines extend in a first direction and transfer data on bit lines simultaneously via a data cache array. Sense circuits are arranged around the data cache array and connected to the data input/output lines respectively. The data input/output lines are divided at a certain interval in the first direction. The divided portions are connected to respective leads formed in the extension region in the longitudinal direction thereof and connected to the sense circuits via the leads.
    • 分流区域以沿第二方向延伸的存储单元阵列区域中的特定间隔形成。 并联区域各自包括形成为将字线或者以相同方向布线的信号线连接到另一金属线的触点。 延伸区域各自由数据高速缓存阵列区域中的分流区域的扩展形成。 数据输入/输出线在第一方向上延伸,并通过数据高速缓存阵列同时传送位线上的数据。 检测电路被布置在数据高速缓存阵列的周围,分别连接到数据输入/输出线。 数据输入/输出线在第一个方向上以一定间隔分开。 分开的部分连接到在其延伸区域中形成在其纵向方向上的各个引线,并且经由引线连接到感测电路。
    • 9. 发明授权
    • Semiconductor apparatus having wiring structure of an integrated circuit
in which a plurality of logic circuits of the same structure are
arranged in the same direction
    • 具有集成电路的布线结构的半导体装置,其中相同结构的多个逻辑电路沿相同的方向布置
    • US5594281A
    • 1997-01-14
    • US608937
    • 1996-02-29
    • Masami Masuda
    • Masami Masuda
    • H01L21/82G11C11/401G11C11/408H01L21/3205H01L23/52H01L23/522H01L23/48H01L29/44
    • H01L23/5222H01L2924/0002Y10S257/92Y10S257/923
    • In a semiconductor apparatus, a first circuit provided on a major surface of a semiconductor substrate. The first circuit includes a plurality of logic circuits of an identical structure, the logic circuits having input terminals supplied with identical signals. First metal wiring is provided on the semiconductor substrate in a direction identical to a direction of arrangement of the logic circuits, the first metal wiring being connected to one of the input terminals of each of the logic circuits. A second circuit provided on the major surface of the semiconductor substrate in an outside area which does not overlap an area extending in a direction perpendicular to the direction of arrangement of the logic circuits, the second circuit supplying an identical signal to the input terminals of the logic circuits of the first circuit. A second metal wiring is connected between an output terminal of the second circuit and a substantially middle point of the first metal wiring. The second metal wiring has a portion situated in parallel to the logic circuits. Thereby, an influence of wiring delay due to a difference in distances among the logic circuits can be reduced and a high-speed operation is achieved.
    • 在半导体装置中,设置在半导体基板的主表面上的第一电路。 第一电路包括具有相同结构的多个逻辑电路,逻辑电路具有被提供相同信号的输入端。 第一金属布线沿着与逻辑电路的布置方向相同的方向设置在半导体基板上,第一金属布线连接到每个逻辑电路的输入端之一。 第二电路设置在半导体衬底的主表面上的外部区域中,该外部区域不与垂直于逻辑电路的布置方向的方向延伸的区域重叠,第二电路向第二电路的输入端提供相同的信号 第一电路的逻辑电路。 第二金属布线连接在第二电路的输出端和第一金属布线的大致中点之间。 第二金属布线具有与逻辑电路平行的部分。 由此,可以降低逻辑电路间的距离差引起的布线延迟的影响,实现高速运转。