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1. 发明授权

US4585379A Precision positioning device 失效
标题翻译：精密定位装置
公开(公告)号：US4585379A
公开(公告)日：1986-04-29
申请号：US333632
申请日：1981-12-22
申请人： Kazuhiko Nagayama , Masami Masuda , Yukio Maeda
发明人： Kazuhiko Nagayama , Masami Masuda , Yukio Maeda
IPC分类号： B23D59/00 , B27B5/30 , B28D5/02 , G05B19/23 , B23Q15/00 , G01B9/02
CPC分类号： B28D5/024 , B23D59/002 , B27B5/30 , G05B19/231 , G05B2219/37275 , G05B2219/49169 , Y10T408/175 , Y10T408/6757 , Y10T409/304648 , Y10T409/306832 , Y10T409/308008
摘要： In effecting positioning of a workpiece relative to a working tool, indexing is carried out by obtaining precision measurement of the relative distance between the workpiece and the working tool by using a laser beam. Positioning can be effected with improved precision and working can be achieved with improved dimensional accuracy.
摘要翻译：在实现工件相对于加工工具的定位时，通过使用激光束来获得工件与加工工具之间的相对距离的精确测量来进行分度。可以提高精度进行定位，并且可以在提高尺寸精度的情况下实现加工。

2. 发明授权

US5022797A Diamond tool 失效
标题翻译：钻石工具
公开(公告)号：US5022797A
公开(公告)日：1991-06-11
申请号：US343830
申请日：1989-04-24
申请人： Masashi Sawa , Masami Masuda , Yukio Maeda , Ryu Itoh
发明人： Masashi Sawa , Masami Masuda , Yukio Maeda , Ryu Itoh
IPC分类号： B23B27/20
CPC分类号： B23B27/20 , Y10T407/27 , Y10T407/28 , Y10T82/10
摘要： A diamond tool for the mirror-finish cutting of non-ferrous materials and a method of manufacturing the same are provided. The diamond tool has a main cutting edge and minute side cutting edges formed at the opposite ends of the main cutting edge so as to intersect the main cutting edge at an angle. The dept .DELTA. of chamfer of the side cutting edge is 1.5 to 5 times the depth of tears formed in the machined surface (0.1 .mu.m.ltoreq..DELTA..ltoreq.1 .mu.m) and the length l.sub.2 of the side cutting edged is 1.5 to 10 times the feed of the diamond tool (0.02 mm.ltoreq.l.sub.2 .ltoreq.0.8 mm). The rake face of the diamond tool comprises two rake faces and two side rake faces. A tool grinding surface plate for manufacturing the diamond tool has a flat surface for grinding the rake faces, and a circumferential tapered surface for grinding the side rake faces. The end relief surface and the rake face of the diamond tool is in the (001) zone of the single crystal diamond tip thereof, and the crystal orientation of the end relief surface is in the range of (150) and (010) or a crystallographic equivalent.
摘要翻译：提供了一种用于有色金属材料的镜面切割的金刚石工具及其制造方法。金刚石工具具有形成在主切削刃的相对端处的主切削刃和微小侧切削刃，以与主切削刃成一定角度相交。侧切削刃的斜切部的DELTA为加工面上形成的撕裂深度的1.5〜5倍（0.1μm×DELTA <1μm），边切边的长度l2为1.5 至金刚石工具的进给量的10倍（0.02mm±12mm）。金刚石工具的前刀面包括两个前刀面和两个前刀面。用于制造金刚石工具的工具研磨面板具有用于研磨前刀面的平坦表面和用于研磨侧耙面的圆周锥形表面。金刚石工具的端部浮雕表面和前刀面在其单晶金刚石尖端的（001）区域中，并且端部浮雕表面的晶体取向在（150）和（010）的范围内，或者晶体相当。

3. 发明授权

US07352943B2 Optical position sensing component, optical position sensing device, and manufacturing method thereof 有权
标题翻译：光学位置检测部件，光学位置检测装置及其制造方法
公开(公告)号：US07352943B2
公开(公告)日：2008-04-01
申请号：US11702606
申请日：2007-02-06
申请人： Yuichi Eriyama , Jun Huangfu , Yukio Maeda
发明人： Yuichi Eriyama , Jun Huangfu , Yukio Maeda
IPC分类号： G02B6/10
CPC分类号： G02B6/02033 , G02B6/32 , G06F3/0421
摘要： An optical position sensing component includes an input light guiding portion and a received light guiding portion. The input light guiding portion is constituted by a polymer waveguide and inputs a light emitted from a near-infrared light-emitting source and outputs the light to a lens for collimate through a plurality of ends. The received light guiding portion is constituted by a polymer waveguide and inputs the light output from the light guiding portion and outputs the input light to a near-infrared light-receiving device. Further, the polymer waveguide has a core portion composed of a cured photosensitive resin composition.
摘要翻译：光学位置检测部件包括输入光导部分和接收的光导部分。输入导光部由聚合物波导构成，并输入从近红外发光源射出的光，并通过多个端部将光输出到准直透镜。接收的导光部由聚合物波导构成，并输入从导光部输出的光，并将输入光输出到近红外光接收装置。此外，聚合物波导具有由固化的感光性树脂组合物构成的芯部。

4. 发明授权

US06657135B2 Connection structure and electronic circuit board 有权
标题翻译：连接结构和电路板
公开(公告)号：US06657135B2
公开(公告)日：2003-12-02
申请号：US09959482
申请日：2002-02-04
申请人： Kenichiro Suetsugu , Masuo Koshi , Kenichiro Todoroki , Shunji Hibino , Hiroaki Takano , Mikiya Nakata , Yukio Maeda
发明人： Kenichiro Suetsugu , Masuo Koshi , Kenichiro Todoroki , Shunji Hibino , Hiroaki Takano , Mikiya Nakata , Yukio Maeda
IPC分类号： H01R1204
CPC分类号： H05K3/3447 , H05K1/0293 , H05K1/115 , H05K1/116 , H05K3/3452 , H05K3/3463 , H05K3/4092 , H05K2201/0373 , H05K2201/0397 , H05K2201/09663 , H05K2201/0979 , H05K2201/099
摘要： A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.
摘要翻译：本发明的连接结构具有贯穿孔的通孔，形成在通孔周围的台面，以及从电子部件延伸设置在通孔中的引线。所述平台包括形成在所述通孔的壁面上的壁面陆部，以及分别形成在所述板的前后表面上的前表面和后表面接合部。连接陆地和铅的圆角包括分别与前表面和后表面陆部接触的上下圆角部分。上部圆角部分的轮廓小于下圆角部分的轮廓，并且不小于通孔的轮廓。因此，使用无铅焊料材料时，有效地减少了剥离的发生。

5. 发明授权

US5137936A Method for packaging electronic parts and adhesive for use in said method 失效
标题翻译：用于包装用于所述方法的电子部件和粘合剂的方法
公开(公告)号：US5137936A
公开(公告)日：1992-08-11
申请号：US558236
申请日：1990-07-26
申请人： Takashi Akiguchi , Yukio Maeda , Daisuke Irii
发明人： Takashi Akiguchi , Yukio Maeda , Daisuke Irii
IPC分类号： H05K3/34 , C08F2/46 , C08G59/00 , C08G59/18 , C09D4/06 , C09J4/02 , C09J163/00 , H05K3/30
CPC分类号： H05K3/305 , C09D4/06 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： An adhesive composition comprising 10 to 60 parts by weight per 100 parts of the total weight of components (1) to (4) of a monofunctional (meth)acrylic monomer, 0.01 to 10 parts by weight per 100 parts of the total weight of components (1) to (4) of a compound having at least two (meth)acryloyl groups in a molecule, 30 to 80 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a heat resistant epoxy resin, 0.1 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of an imidazole compound, 0.001 to 10 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a photopolymerization initiator, and 0.01 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a thixotropic agent, with which an electronic part can be effectively packaged to a printed board.
摘要翻译：一种粘合剂组合物，其包含每100份单官能（甲基）丙烯酸单体的组分（1）至（4））的总重量为10至60重量份，相对于每100份组分的总重量为0.01至10重量份在分子中具有至少两个（甲基）丙烯酰基的化合物的（1）〜（4）中，相对于热成分（1）〜（4）的总重量的100重量份，为30〜80重量份相对于100重量份的咪唑化合物的组分（1）〜（4）的总重量为0.1〜20重量份，相对于100重量份的组分（1）〜（4），相对于触变剂的成分（1）〜（4）的总重量的100重量份为0.01〜20重量份，电子部件能够有效地包装到印刷板上。

6. 发明授权

US4676864A Bonding method of semiconductor device 失效
标题翻译：半导体器件的接合方法
公开(公告)号：US4676864A
公开(公告)日：1987-06-30
申请号：US863152
申请日：1986-05-14
申请人： Yukio Maeda , Yoshifumi Kitayama , Shuichi Murakami
发明人： Yukio Maeda , Yoshifumi Kitayama , Shuichi Murakami
IPC分类号： H01L21/60 , H01L21/603 , H01L23/485 , B29C37/00 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/13 , H01L2224/13099 , H01L2224/81801 , H01L2924/01006 , H01L2924/01022 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , Y10T29/49121
摘要： A bonding method of semiconductor device by using a film carrier; A heat-resistive insulating layer is deposited all over the surface of a dummy wafer on which a photo-resist film having a predetermined pattern is previously formed; The photo-resist film is removed together with the heat-resistive insulating layer for forming openings; Bumps are formed on the openings by plating using the heat-resistive insulating layer as a mask; After transferring the bumps to inner leads, the bumps of the inner leads are bonded to bonding pads of the semiconductor element.
摘要翻译：一种使用薄膜载体的半导体器件的接合方法; 在其上预先形成有预定图案的光致抗蚀剂膜的虚拟晶片的整个表面上沉积耐热绝缘层; 与用于形成开口的耐热绝缘层一起去除光致抗蚀剂膜; 使用耐热绝缘层作为掩模通过电镀在开口上形成凸起; 在将凸块转移到内部引线之后，内部引线的凸点被接合到半导体元件的焊盘。

7. 发明申请

US20070189700A1 Optical position sensing component, optical position sensing device, and manufacturing method thereof 有权
标题翻译：光学位置检测部件，光学位置检测装置及其制造方法
公开(公告)号：US20070189700A1
公开(公告)日：2007-08-16
申请号：US11702606
申请日：2007-02-06
申请人： Yuichi Eriyama , Jun Huangfu , Yukio Maeda
发明人： Yuichi Eriyama , Jun Huangfu , Yukio Maeda
IPC分类号： G02B6/00
CPC分类号： G02B6/02033 , G02B6/32 , G06F3/0421
摘要： An optical position sensing component includes an input light guiding portion and a received light guiding portion. The input light guiding portion is constituted by a polymer waveguide and inputs a light emitted from a near-infrared light-emitting source and outputs the light to a lens for collimate through a plurality of ends. The received light guiding portion is constituted by a polymer waveguide and inputs the light output from the light guiding portion and outputs the input light to a near-infrared light-receiving device. Further, the polymer waveguide has a core portion composed of a cured photosensitive resin composition.
摘要翻译：光学位置检测部件包括输入光导部分和接收的光导部分。输入导光部由聚合物波导构成，并输入从近红外发光源射出的光，并通过多个端部将光输出到准直透镜。接收的导光部由聚合物波导构成，并输入从导光部输出的光，并将输入光输出到近红外光接收装置。此外，聚合物波导具有由固化的感光性树脂组合物构成的芯部。

8. 发明授权

US06506982B1 Multi-layer wiring substrate and manufacturing method thereof 失效
公开(公告)号：US06506982B1
公开(公告)日：2003-01-14
申请号：US09501596
申请日：2000-02-10
申请人： Hidetaka Shigi , Naoya Kitamura , Masashi Nishiki , Tetsuya Yamazaki , Takehiko Hasebe , Masayuki Kyooi , Yukio Maeda
发明人： Hidetaka Shigi , Naoya Kitamura , Masashi Nishiki , Tetsuya Yamazaki , Takehiko Hasebe , Masayuki Kyooi , Yukio Maeda
IPC分类号： H05K111
CPC分类号： H05K3/403 , H01L2224/16237 , H05K1/056 , H05K3/045 , H05K3/42 , H05K3/445 , H05K3/4608 , H05K2201/09636 , H05K2201/09645 , H05K2201/09809 , H05K2201/09854
摘要： A multi-layer wiring substrate capable of high density packaging, and a method of manufacturing the same, in which a carrier substrate, in which through holes can be easily formed in high density corresponding substantially to a pitch of connecting terminals in a semiconductor chip, and build-up layers are formed on the substrate with the application of a conventional build-up technique. When the build-up technique for repeatedly forming insulating layers and wiring layers on a carrier substrate is used to manufacture a multi-layer wiring substrate, the carrier substrate is formed in the following manner. First, an insulating resin layer is formed in a copper foil, in which a plurality of first windows are regularly provided, to cover the copper foil, and the resin layer fills the interior of the windows. Subsequently, second windows of a particular shape are provided in regions of layers of the insulating resin filled in the windows, and independent conducting paths are formed through the second windows to extend from front sides of the second windows to back sides thereof. The conducting paths are formed radially to be spaced a substantially equal distance from centers of the respective second windows.

9. 发明授权

US06478558B2 Oscillating piston type compressor and method of manufacturing piston thereof 失效
公开(公告)号：US06478558B2
公开(公告)日：2002-11-12
申请号：US09799528
申请日：2001-03-07
申请人： Toshio Yamanaka , Yukio Maeda , Kazuya Kato , Fumitaka Nishioka , Nobuo Abe , Minoru Tateno , Tatsuo Horie
发明人： Toshio Yamanaka , Yukio Maeda , Kazuya Kato , Fumitaka Nishioka , Nobuo Abe , Minoru Tateno , Tatsuo Horie
IPC分类号： F04C18356
CPC分类号： F04C18/322 , Y10T29/49245
摘要： An oscillating piston type compressor has a piston formed integral with a blade. The compressor accommodates in a casing a compression mechanism section and a motor section, the mechanism including the piston having a plate-shaped blade integrally formed on a cylindrical portion is fitted onto an eccentric portion of a crankshaft to perform orbital motion relative to an inner peripheral surface of a cylinder, the plate-shaped blade being formed at its radial end surface with a recess or a protrusion, which serves as a reference of position.

10. 发明授权

US5136150A Image sensor having light guides for communication with image plane 失效
标题翻译：图像传感器，具有与图像平面通信的光导
公开(公告)号：US5136150A
公开(公告)日：1992-08-04
申请号：US632735
申请日：1990-12-26
申请人： Tetsuo Fukushima , Kenichiro Suetsugu , Tokuhito Hamane , Junji Ikeda , Yukio Maeda
发明人： Tetsuo Fukushima , Kenichiro Suetsugu , Tokuhito Hamane , Junji Ikeda , Yukio Maeda
IPC分类号： G02B6/04 , H04N1/028 , H04N1/031 , H04N1/19
CPC分类号： H04N1/02835 , H04N1/0311 , H04N1/0312 , H04N1/0314
摘要： Disclosed is an image sensor including a circuit board, an array of light emitting elements for emitting light to an image plane, an array of light receiving elements for receiving image information transmitted by reflected light from the image plane, and plural pairs of light wave guides interposed between the light emitting elements and the image plane and between the image plane and the light receiving elements. Both the light emitting elements and the light receiving elements are mounted on the same surface of the circuit board.
摘要翻译：公开了一种图像传感器，包括电路板，用于向像平面发射光的发光元件的阵列，用于接收从图像平面反射的光透射的图像信息的光接收元件阵列，以及多对光波导插入在发光元件和图像平面之间以及图像平面和光接收元件之间。发光元件和光接收元件都安装在电路板的同一表面上。

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