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1. 发明申请

US20080053572A1 Soldering flux and solder paste composition 审中-公开
标题翻译：焊剂和焊膏组成
公开(公告)号：US20080053572A1
公开(公告)日：2008-03-06
申请号：US11896691
申请日：2007-09-05
申请人： Masaki Sanji , Masayasu Yamamoto , Kensuke Nakanishi , Masami Aihara
发明人： Masaki Sanji , Masayasu Yamamoto , Kensuke Nakanishi , Masami Aihara
IPC分类号： B23K35/363
CPC分类号： B23K35/362 , B23K35/0244 , B23K35/025 , B23K35/3613
摘要： A soldering flux contains a base resin and an activating agent. The base resin contains a thermoplastic acrylic resin having a glass transition temperature of below −50° C. This enables to sufficiently suppress the occurrence of cracks in the flux residue after soldering, under the severe environment where the temperature difference is extremely large. The soldering flux has high reliability and excellent solderability, and is conventional with respect to the load against manufacturing cost and environment.
摘要翻译：助焊剂含有基础树脂和活化剂。基础树脂含有玻璃化转变温度低于-50℃的热塑性丙烯酸树脂。这样能够在温度差非常大的恶劣环境下充分抑制焊接后的焊剂残留物中的裂纹的发生。助焊剂具有高的可靠性和优异的可焊性，并且在制造成本和环境方面是常规的。

2. 发明申请

US20120291921A1 FLUX FOR SOLDER PASTE, AND SOLDER PASTE 审中-公开
标题翻译：焊膏，焊膏
公开(公告)号：US20120291921A1
公开(公告)日：2012-11-22
申请号：US13513880
申请日：2010-12-06
申请人： Eiji Iwamura , Kazushi Gotoh , Shinsuke Nagasaka , Takayasu Yoshioka , Masayoshi Utsuno , Atsuo Nakamura , Teruo Okochi , Masaki Sanji , Takuji Sukekawa , Kenshi Ikedo , Yoshiyuki Andoh , Takeshi Shirai , Kimiaki Mori , Rie Wada , Kensuke Nakanishi , Masami Aihara , Seishi Kumamoto
发明人： Eiji Iwamura , Kazushi Gotoh , Shinsuke Nagasaka , Takayasu Yoshioka , Masayoshi Utsuno , Atsuo Nakamura , Teruo Okochi , Masaki Sanji , Takuji Sukekawa , Kenshi Ikedo , Yoshiyuki Andoh , Takeshi Shirai , Kimiaki Mori , Rie Wada , Kensuke Nakanishi , Masami Aihara , Seishi Kumamoto
IPC分类号： B23K35/363
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
摘要： A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.
摘要翻译：根据本发明的一个方面的用于焊膏的焊剂包括通过使具有C6-C15烷基的（甲基）丙烯酸酯和除上述（甲基）丙烯酸酯之外的（甲基）丙烯酸酯）自由基共聚得到的丙烯酸类树脂; 和松香。当松香的重量为1时，丙烯酸树脂的重量比为0.5以上且1.2以下，通过施加10Pa以上且150Pa以下的剪切力使焊膏的焊剂流动，或减。

3. 发明申请

US20120291922A1 SOLDER PASTE 审中-公开
标题翻译：焊膏
公开(公告)号：US20120291922A1
公开(公告)日：2012-11-22
申请号：US13514076
申请日：2010-12-06
申请人： Eiji Iwamura , Kazushi Gotoh , Fumio Ishiga , Takayasu Yoshioka , Masayoshi Utsuno , Atsuo Nakamura , Teruo Okochi , Masaki Sanji , Takuji Sukekawa , Kenshi Ikedo , Yoshiyuki Andoh , Takeshi Shirai , Kimiaki Mori , Rie Wada , Kensuke Nakanishi , Masami Aihara , Seishi Kumamoto
发明人： Eiji Iwamura , Kazushi Gotoh , Fumio Ishiga , Takayasu Yoshioka , Masayoshi Utsuno , Atsuo Nakamura , Teruo Okochi , Masaki Sanji , Takuji Sukekawa , Kenshi Ikedo , Yoshiyuki Andoh , Takeshi Shirai , Kimiaki Mori , Rie Wada , Kensuke Nakanishi , Masami Aihara , Seishi Kumamoto
IPC分类号： B23K35/363
CPC分类号： B23K35/3613 , B23K35/362 , C22C12/00 , C22C13/00 , H05K3/3484
摘要： A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.
摘要翻译：根据本发明的一个方面的焊膏在助焊剂中包括具有分子量为250或更小的二元酸，分子量为150以上且300以下的一元酸的活化剂，以及分子量为300以上且600以下的二元酸; 和至少一种选自高密度聚乙烯和聚丙烯的树脂添加剂。当焊剂的总量为100重量％时，焊膏的树脂添加量为4重量％以上，12重量％以下，粘度为400Pa·s以上在80℃

4. 发明授权

US5074928A Water-soluble soldering flux 失效
标题翻译：水溶性焊剂
公开(公告)号：US5074928A
公开(公告)日：1991-12-24
申请号：US617329
申请日：1990-11-23
申请人： Masaki Sanji , Toshihiko Taguchi , Tomohiko Iino , Kouichi Ootuka
发明人： Masaki Sanji , Toshihiko Taguchi , Tomohiko Iino , Kouichi Ootuka
IPC分类号： B23K35/363 , B23K35/36
CPC分类号： B23K35/3616 , B23K35/3618
摘要： A water-soluble soldering flux having good solderability, removability with water, and insulation resistance comprises, as activators, a combination of tartaric acid and a hydrohalide salt of mono-, di-, or tri-ethanolamine.

5. 发明授权

US5770993A Thermal fuse 失效
标题翻译：热熔丝
公开(公告)号：US5770993A
公开(公告)日：1998-06-23
申请号：US719208
申请日：1996-09-25
申请人： Kazuhiro Miyazawa , Shinji Iwama , Masaki Sanji , Yasufumi Kojima
发明人： Kazuhiro Miyazawa , Shinji Iwama , Masaki Sanji , Yasufumi Kojima
IPC分类号： B60R16/02 , H01C7/13 , H01H37/76 , H05K1/02 , H05K3/34 , H01H85/04
CPC分类号： H05K1/0201 , H01C7/13 , H01H37/761 , H01H2037/046 , H01H2037/763 , H05K2201/10181 , H05K2203/176 , H05K3/222 , H05K3/3421
摘要： A resistor with a thermal fuse includes: a substrate consisting of an insulating material; a wire pattern formed on a surface of the substrate; a gap for electrically cutting off the wire pattern; a plate spring consisting of an electrically conductive material arranged across the gap; an electrically conductive member fixed to one end of the plate spring on a side of the wire pattern and having approximately the same linear conduction coefficient as that of the substrate; a first low melting point alloy for welding the electrically conductive material and the wire pattern provided on one side of the gap; a second low melting point alloy for welding the other end of the plate spring and the wire pattern provided on the other side of the gap; wherein, when the first low melting point alloy is melted, the electrically conductive member is released from the first low melting point alloy so that the plate spring is also released from the wire pattern.
摘要翻译：具有热熔丝的电阻器包括：由绝缘材料构成的衬底; 形成在所述基板的表面上的线图案; 用于电切断线图案的间隙; 由横跨间隙布置的导电材料组成的板簧; 导电构件，其固定在所述导线图案侧面上的所述板簧的一端，并且具有与所述基板大致相同的线性导通系数; 用于焊接导电材料的第一低熔点合金和设置在间隙的一侧上的线图案; 第二低熔点合金，用于焊接板簧的另一端和设置在间隙的另一侧的线图案; 其中，当所述第一低熔点合金熔化时，所述导电构件从所述第一低熔点合金释放，使得所述板簧也从所述导线图案脱离。

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