专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06955178B1 Substrate treatment apparatus 失效
标题翻译：基板处理装置
公开(公告)号：US06955178B1
公开(公告)日：2005-10-18
申请号：US10626517
申请日：2003-07-25
申请人： Masaki Kuzumoto , Seiji Noda , Izumi Oya , Makoto Miyamoto , Hideo Horibe , Tatsuo Kataoka , Tetsuji Oishi
发明人： Masaki Kuzumoto , Seiji Noda , Izumi Oya , Makoto Miyamoto , Hideo Horibe , Tatsuo Kataoka , Tetsuji Oishi
IPC分类号： B08B7/00 , C23G5/00 , G03F7/42 , H01L21/00 , H01L21/027 , H01L21/302 , H01L21/3065 , B08B5/00 , H01L21/461
CPC分类号： H01L21/6708 , B08B7/00 , G03F7/422 , Y10S134/902
摘要： A substrate treatment apparatus includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, and a supply device for supplying the wet ozone-containing gas from the wetting device to a work object on a surface of the substrate. The supply device includes a gas disperser including apertures aligned in rows in a width direction of the work object. The apertures in adjacent rows are not aligned with each other in a direction perpendicular to the rows. At least one of the gas disperser and the substrate is movable in a direction perpendicular to the rows. A gas conduit connects the wetting device to the supply device. A wet ozone-containing gas heating device heats the wet ozone-containing gas to a temperature at least equal to the temperature of the substrate.
摘要翻译：一种基板处理装置，具备：将基板保持在比室温以上的温度下的基板加热装置，通过用处理液润湿含臭氧的气体来生产含湿臭氧的气体的润湿装置，以及供给装置来自润湿装置的湿臭氧的气体到基板表面上的工件。供给装置包括气体分散器，其包括在工作对象的宽度方向上成行排列的孔。相邻行中的孔在垂直于行的方向上彼此不对齐。气体分散器和基板中的至少一个可以在垂直于行的方向上移动。气体管道将润湿装置连接到供应装置。含湿臭氧的气体加热装置将含湿臭氧的气体加热至至少等于基板温度的温度。

2. 发明授权

US06616773B1 Substrate treatment method 有权
标题翻译：底物处理方法
公开(公告)号：US06616773B1
公开(公告)日：2003-09-09
申请号：US09686061
申请日：2000-10-11
申请人： Masaki Kuzumoto , Seiji Noda , Izumi Oya , Makoto Miyamoto , Hideo Horibe , Tatsuo Kataoka , Tetsuji Oishi
发明人： Masaki Kuzumoto , Seiji Noda , Izumi Oya , Makoto Miyamoto , Hideo Horibe , Tatsuo Kataoka , Tetsuji Oishi
IPC分类号： B08B300
CPC分类号： H01L21/6708 , B08B7/00 , G03F7/422 , Y10S134/902
摘要： A substrate treatment assembly for treating a work object on a surface of a substrate by supplying to the work object a wet ozone-containing gas wetted with a treatment solution includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, a supply device for supplying the wet ozone-containing gas to a work object on a surface of the substrate, a gas conduit connecting the wetting device to the supply device, and a heating device for heating the wet ozone-containing gas to a temperature approximately equal to or greater than the temperature of the substrate.
摘要翻译：一种基板处理组件，用于通过向处理对象物供给湿润的含臭氧的气体来处理基板表面上的工件，所述基底处理组件包括用于将基板保持在高于室温的温度的基板加热装置，润湿装置，用于通过用处理溶液润湿含臭氧的气体来产生含湿臭氧的气体;供应装置，用于将湿的含臭氧的气体供应到基板的表面上的工件;连接润湿剂的气体导管装置，以及用于将含湿臭氧的气体加热到大约等于或大于基板的温度的温度的加热装置。

3. 发明授权

US06715944B2 Apparatus for removing photoresist film 失效
标题翻译：去除光刻胶膜的设备
公开(公告)号：US06715944B2
公开(公告)日：2004-04-06
申请号：US10134481
申请日：2002-04-30
申请人： Izumi Oya , Seiji Noda , Makoto Miyamoto , Masaki Kuzumoto , Masashi Ohmori , Tatsuo Kataoka
发明人： Izumi Oya , Seiji Noda , Makoto Miyamoto , Masaki Kuzumoto , Masashi Ohmori , Tatsuo Kataoka
IPC分类号： G03D302
CPC分类号： H01L21/67075 , G03F7/42 , G03F7/422 , G03F7/423 , G03F7/428 , Y10S134/902
摘要： An apparatus for removing a photoresist film includes a substrate cassette for fixing a substrate having a surface covered with a photoresist film, an ozone feed tube for supplying ozone, a liquid feed tube for supplying a liquid photoresist film removing solution, and a processing tank for recovering and processing at least one of ozone and the liquid photoresist film removing solution, wherein the liquid photoresist film removing solution is supplied through the liquid feed tube as a liquid or mist, at least one of ozone and the photoresist film removing solution being continuously supplied.
摘要翻译：一种用于去除光致抗蚀剂膜的设备包括用于固定具有被光致抗蚀剂膜覆盖的表面的基板的基板盒，用于供应臭氧的臭氧供给管，用于供给液态光致抗蚀剂膜去除溶液的液体供给管，以及用于回收和处理臭氧和液体光致抗蚀剂去除溶液中的至少一种，其中液态光致抗蚀剂去除溶液作为液体或雾通过液体供给管提供，臭氧和光致抗蚀剂去膜溶液中的至少一种被连续供应。

4. 发明授权

US06517999B1 Method of removing photoresist film 失效
标题翻译：去除光刻胶膜的方法
公开(公告)号：US06517999B1
公开(公告)日：2003-02-11
申请号：US09614258
申请日：2000-07-12
申请人： Izumi Oya , Seiji Noda , Makoto Miyamoto , Masaki Kuzumoto , Masashi Ohmori , Tatsuo Kataoka
发明人： Izumi Oya , Seiji Noda , Makoto Miyamoto , Masaki Kuzumoto , Masashi Ohmori , Tatsuo Kataoka
IPC分类号： G03F742
CPC分类号： H01L21/67075 , G03F7/42 , G03F7/422 , G03F7/423 , G03F7/428
摘要： A method of removing photoresist film with high efficiency of removal and friendliness with the environment while reducing the material consumption and the cost for the ventilation facility, and an apparatus used for the method are provided. Particularly the present invention provides a method of removing a photoresist film provided on a surface of a substrate, comprising steps of in a sealed system, disposing the substrate surface having the photoresist film to contact with a photoresist film removing solution, making ozone exist in gas phase and/or solution phase in the vicinity of the liquid surface of the photoresist film removing solution, and changing a relative position between the surface of the substrate and the liquid surface of the solution to decompose or remove the photoresist film from the substarate, characterized in that the relative position is changed continuously or intermittently within a range between a position where a bottom edge of the substrate is present above the liquid surface of the solution, and another position where a top edge of the substrate is present below the liquid surface of the solution. The present invention also provides an apparatus used for the method.
摘要翻译：提供了一种去除光致抗蚀剂膜的方法，同时降低了通风设备的材料消耗和成本，同时具有高度的去除效率和环境友好性，并且提供了用于该方法的设备。特别地，本发明提供一种除去设置在基板表面上的光致抗蚀剂膜的方法，包括以下步骤：在密封系统中，设置具有光致抗蚀剂膜的基板表面与光致抗蚀剂膜去除溶液接触，使臭氧存在于气体中相位和/或溶液相位在光致抗蚀剂膜去除溶液的液面附近，并且改变基板的表面和溶液的液面之间的相对位置，以从底层分解或去除光致抗蚀剂膜，其特征在于因为相对位置在溶液的液面之上存在基板的底部边缘的位置与基板的上边缘的另一位置之间的范围内连续地或间歇地变化，解决方案。本发明还提供了一种用于该方法的装置。

5. 发明授权

US07965372B2 Apparatus for removing photoresist film 失效
标题翻译：去除光刻胶膜的设备
公开(公告)号：US07965372B2
公开(公告)日：2011-06-21
申请号：US10134508
申请日：2002-04-30
申请人： Seiji Noda , Masaki Kuzumoto , Izumi Oya , Makoto Miyamoto
发明人： Seiji Noda , Masaki Kuzumoto , Izumi Oya , Makoto Miyamoto
IPC分类号： G03B27/32 , G03B27/52
CPC分类号： G03F7/427 , G03F7/42
摘要： A photoresist film removing apparatus includes a reacting chamber, an ozonizer producing a gas supplied to the reacting chamber, and an exhaust system that exhausts the gas from the reacting chamber. A source of a photoresist film-remover is located opposite a stage carrying a substrate covered with photoresist. Photoresist film-remover and the gas are supplied to the substrate through apertures. An electric field may be generated between the source of the photoresist film-remover and the substrate. Alternatively, a centrally located feed tube supplies only one of the gas and the photoresist film-remover through a single aperture and a reservoir discharges the other through apertures. The reservoir surrounds and is sealed to the feed tube. The apparatus may include a container holding a liquid photoresist film-remover and a mixture of the gas and remover is supplied from outside the reacting chamber to the substrate.
摘要翻译：光致抗蚀剂膜去除装置包括反应室，产生供应到反应室的气体的臭氧发生器和从反应室排出气体的排气系统。光致抗蚀剂膜去除剂的来源位于载有被光致抗蚀剂覆盖的基底的阶段上。光致抗蚀剂去除剂和气体通过孔提供给基材。可以在光致抗蚀剂去膜剂的源和基板之间产生电场。或者，位于中心的进料管仅通过单个孔提供气体和光致抗蚀剂膜去除剂中的一个，并且储存器通过孔排出另一个。储存器周围并密封到进料管。该装置可以包括容纳液体光致抗蚀剂膜去除剂的容器，并且将气体和去除剂的混合物从反应室外部供应到基底。

6. 发明授权

US06517998B1 Method for removing photoresist film and apparatus used therefor 失效
标题翻译：去除光刻胶膜的方法及其用途
公开(公告)号：US06517998B1
公开(公告)日：2003-02-11
申请号：US09614252
申请日：2000-07-12
申请人： Seiji Noda , Masaki Kuzumoto , Izumi Oya , Makoto Miyamoto
发明人： Seiji Noda , Masaki Kuzumoto , Izumi Oya , Makoto Miyamoto
IPC分类号： G03F742
CPC分类号： G03F7/427 , G03F7/42
摘要： A method of removing a photoresist film with high efficiency of removal and friendliness with the environment while reducing material consumption and cost for a ventilation facility, and an apparatus used for the method. The method of removing a photoresist film in a sealed system, includes supplying a photoresist film-removal mixture containing an ozonized gas and a photoresist film-remover to a photoresist film on a surface of a substrate through a photoresist film-remover supplier opposed to the photoresist film.
摘要翻译：一种去除光致抗蚀剂膜的方法，其具有高的去除效率和环境友好性，同时减少通风设备的材料消耗和成本，以及用于该方法的设备。在密封系统中除去光致抗蚀剂膜的方法包括通过与光致抗蚀剂膜相反的光致抗蚀剂去除剂供应器将含有臭氧化气体和光致抗蚀剂膜去除剂的光致抗蚀剂膜去除混合物供应到基板表面上的光致抗蚀剂膜光致抗蚀剂膜。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式