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1. 发明授权

US07989563B2 Resin compositions, films using the same and process for producing the films 有权
标题翻译：树脂组合物，使用其的薄膜和制造薄膜的方法
公开(公告)号：US07989563B2
公开(公告)日：2011-08-02
申请号：US12388077
申请日：2009-02-18
申请人： Masahito Nakabayashi , Mamoru Kobayashi
发明人： Masahito Nakabayashi , Mamoru Kobayashi
IPC分类号： C08F222/10 , B05D3/06
CPC分类号： C08J5/18 , C08F220/18 , C08F222/10 , C08J2367/00 , C08J2367/07
摘要： The present invention provides a resin composition containing a reactive monomer and/or oligomer having allyl ester groups, a film of the resin composition which is excellent in transparency and heat resistance and has a high thickness precision, and a process for producing such a film. The resin composition includes (A) a reactive oligomer having allyl ester groups and represented by the general formula (1): wherein R1 represents an alkanediyl or alkenediyl group having 1 to 4 carbon atoms with the proviso that a plurality of R1 groups may be the same or different, R2 represents a cycloalkanediyl, cycloalkenediyl or arenediyl group with the proviso that a plurality of R2 groups may be the same or different, and n represents an average degree of polymerization and is a number of 1 to 30; (B) a polyfunctional (meth)acrylic monomer and/or oligomer; and (C) a thermal polymerization initiator.
摘要翻译：本发明提供一种含有具有烯丙基酯基团的反应性单体和/或低聚物的树脂组合物，透明性和耐热性优异且厚度精度高的树脂组合物的膜及其制造方法。树脂组合物包括（A）具有烯丙基酯基并由通式（1）表示的反应性低聚物：其中R1表示具有1至4个碳原子的烷二基或亚烯基，条件是多个R 1基团可以是相同或不同，R 2表示环烷二基，环烯二基或异癸基，条件是多个R 2基可以相同或不同，n表示平均聚合度，为1〜30的数。（B）多官能（甲基）丙烯酸单体和/或低聚物; 和（C）热聚合引发剂。

2. 发明申请

US20090029161A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet 审中-公开
标题翻译：压敏粘合剂组合物，压敏粘合剂层和压敏粘合片
公开(公告)号：US20090029161A1
公开(公告)日：2009-01-29
申请号：US12219064
申请日：2008-07-15
申请人： Yasunori Karasawa , Mikihiro Kashio , Masahito Nakabayashi , Mamoru Kobayashi
发明人： Yasunori Karasawa , Mikihiro Kashio , Masahito Nakabayashi , Mamoru Kobayashi
IPC分类号： B32B27/36 , C08F120/18
CPC分类号： C08F220/34 , C09J7/385 , C09J2201/606 , C09J2433/00 , Y10T428/2891
摘要： The present inventions are a pressure-sensitive adhesive composition comprising a poly(meth)acrylate compound that contains a repeating unit shown by the following formula (1) in its molecule and has a melting point of 50° C. or less; a pressure-sensitive adhesive layer comprising a crosslinked product of the pressure-sensitive adhesive composition; and a pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer and a support, the pressure-sensitive adhesive layer being provided on one side or both sides of the support material. wherein X+ and Y− represent a combination of a counter cation and a counter anion which may form an ion pair, R represents a hydrogen atom or a methyl group, and A represents a linking group.
摘要翻译：本发明是一种压敏粘合剂组合物，其包含在分子中含有下式（1）所示的重复单元且熔点为50℃以下的聚（甲基）丙烯酸酯化合物; 包含所述压敏粘合剂组合物的交联产物的压敏粘合剂层; 以及包含所述压敏粘合剂层和支持体的压敏粘合片，所述压敏粘合剂层设置在所述支撑材料的一侧或两侧。其中X +和Y-表示可形成离子对的抗衡阳离子和抗衡阴离子的组合，R表示氢原子或甲基，A表示连接基团。

3. 发明申请

US20050142318A1 Pressure sensitive adhesive sheet, a multilayer structured article for photorecording media having the sheet and multilayer photorecording medium having the article 审中-公开
标题翻译：压敏粘合片，用于具有片材的光刻介质的多层结构制品和具有该制品的多层光记录介质
公开(公告)号：US20050142318A1
公开(公告)日：2005-06-30
申请号：US11009865
申请日：2004-12-10
申请人： Masahito Nakabayashi , Sou Miyata
发明人： Masahito Nakabayashi , Sou Miyata
IPC分类号： G11B7/24038 , G11B7/256 , G11B7/26 , B32B9/00
CPC分类号： G11B7/24038 , G11B7/256 , G11B7/26 , Y10T428/14
摘要： A pressure sensitive adhesive sheet which is a laminate of a photorecording layer containing a photosensitive material and a pressure sensitive adhesive layer which is a pressure sensitive adhesive layer or a pressure sensitive adhesive layer of the energy hardening type, a multilayer structured article for photorecording medium using this sheet in which the photorecording layer and the pressure sensitive adhesive layer are laminated alternately, and a multilayer photorecording medium having this article, are provided. The sheet, the article and the medium exhibit excellent accuracy of thickness and can be produced easily without restriction on the material. The sheet, the article and the medium having a great area can be produced. When the pressure sensitive adhesive layer is formed with a pressure sensitive adhesive layer of the energy hardening type, formation of press marks on the multilayer photorecording medium can be suppressed.
摘要翻译：作为包含感光材料的光记录层和作为压敏粘合剂层的压敏粘合剂层或能量硬化型压敏粘合剂层的层压体的压敏粘合片，使用提供其中光接收层和压敏粘合剂层交替层压的片材和具有该制品的多层光记录介质。片材，制品和介质表现出优异的厚度精度，并且可以容易地制造而不限制材料。可以制造具有大面积的片材，制品和介质。当压敏粘合剂层由能量硬化型压敏粘合剂层形成时，可以抑制在多层记录介质上形成压痕。

4. 发明申请

US20120319305A1 PROCESS FOR PRODUCING A SHEET OF A CIRCUIT SUBSTRATE 审中-公开
标题翻译：制造电路基板的方法
公开(公告)号：US20120319305A1
公开(公告)日：2012-12-20
申请号：US13471647
申请日：2012-05-15
申请人： Takayuki Arai , Naofumi Izumi , Tomomi Tetsumoto , Masahito Nakabayashi
发明人： Takayuki Arai , Naofumi Izumi , Tomomi Tetsumoto , Masahito Nakabayashi
IPC分类号： H01L21/56 , H01L23/29
CPC分类号： H05K1/185
摘要： A process for producing a sheet of a circuit substrate which includes (i) providing a sheet for a circuit substrate which contains a layer of a polymer material of an energy ray hardening type for embedding circuit chips and is used for displays, the layer before being hardened by irradiating an energy ray having a storage modulus of 103 Pa or greater and smaller than 107 Pa at a temperature of embedding the circuit chips, (ii) embedding the circuit chips into the layer, and (iii) hardening the layer by irradiating an energy ray onto the layer to obtain the sheet of a circuit substrate, whereby the circuit chips are embedded, fixed and maintained in the resultant hardened layer, wherein the layer after being hardened by irradiating an energy ray has a storage modulus of 107 Pa or greater at 25° C.
摘要翻译：一种电路基板的制造方法，其特征在于，包括：（i）提供用于电路基板的片材，所述电路基板包含用于嵌入电路芯片的能量线硬化型聚合物材料层，并用于显示器，通过在嵌入电路芯片的温度下照射具有103Pa以上且小于107Pa的储能模量的能量线来硬化，（ii）将电路芯片嵌入该层中，以及（iii）通过照射能量射线到层上以获得电路基板，由此将电路芯片嵌入，固定并保持在所得到的硬化层中，其中通过照射能量射线硬化后的层具有107Pa或更大的储能模量在25°C

5. 发明申请

US20060153057A1 Protective film for optical disks and optical disk using the same 审中-公开
标题翻译：光盘保护膜及使用其的光盘
公开(公告)号：US20060153057A1
公开(公告)日：2006-07-13
申请号：US11302204
申请日：2005-12-14
申请人： Sou Miyata , Masahito Nakabayashi , Shin Kubota , Masahiko Sekiya
发明人： Sou Miyata , Masahito Nakabayashi , Shin Kubota , Masahiko Sekiya
IPC分类号： G11B7/24
CPC分类号： G11B7/256 , G11B7/2534 , G11B7/2542 , G11B7/2585 , G11B7/259 , G11B2007/25706 , G11B2007/2571 , G11B2007/25713 , G11B2007/25715 , G11B2007/25716
摘要： There are disclosed a protective film for optical disks which comprises a light transmittable substrate film and a pressure sensitive adhesive layer formed on one side thereof, wherein the difference in refractive index between the light transmittable substrate film and the pressure sensitive adhesive layer is at most 0.08 and a gel fraction of the pressure sensitive adhesive layer is at least 65% by mass; and an optical disk in which the protective film is stuck onto an information recording layer via the pressure sensitive adhesive layer. The protective film for optical disks is used for the purpose of protecting the information recording layer for optical disks, particularly Blu-ray Discs, and is characterized in that it never exerts adverse influence on the recording characteristics of optical disks and besides, is capable of suppressing the corrosion of the metallic reflection film and information recording layer for optical disks. The above optical disk is highly reliable, and never brings about hindrance to the information recording and reproducing function.
摘要翻译：公开了一种用于光盘的保护膜，其包括透光性基材膜和在其一侧形成的压敏粘合剂层，其中可透光基材膜和压敏粘合剂层之间的折射率差最大为0.08 压敏粘合剂层的凝胶分数为65质量％以上。以及其中保护膜经由压敏粘合剂层粘附到信息记录层上的光盘。用于光盘的保护膜用于保护用于光盘的信息记录层，特别是蓝光盘的目的，其特征在于它不会对光盘的记录特性产生不利影响，此外，能够抑制金属反射膜和光盘用信息记录层的腐蚀。上述光盘是高度可靠的，从而不会妨碍信息记录和再现功能。

6. 发明授权

US08298873B2 Method for producing circuit substrate, and circuit substrate 有权
标题翻译：电路基板和电路基板的制造方法
公开(公告)号：US08298873B2
公开(公告)日：2012-10-30
申请号：US12523805
申请日：2008-01-17
申请人： Tatsuo Fukuda , Masahito Nakabayashi , Naofumi Izumi
发明人： Tatsuo Fukuda , Masahito Nakabayashi , Naofumi Izumi
IPC分类号： H01L21/16
CPC分类号： H05K1/185 , H01L21/56 , H01L23/5389 , H01L2924/0002 , H05K3/0011 , H05K3/007 , H05K2201/0108 , H05K2203/016 , H05K2203/056 , H05K2203/1469 , H05K2203/1476 , H01L2924/00
摘要： The method for producing a circuit substrate of the present invention is characterized in that the circuit substrate is produced using as sheet a circuit substrate sheet including an uncured layer a part of which, the part being other than a part at which a circuit chip is disposed, is selectively curable before or after disposal of said circuit chip, wherein the uncured layer has a softness that enables embedding of the circuit chip in the circuit substrate sheet upon pressing the circuit chip that has been disposed on a surface of the uncured layer. According to the method for producing the circuit substrate of the present invention, the circuit chip can be embedded inwards with high accuracy, and the circuit substrate can be produced easily with high accuracy.
摘要翻译：本发明的电路基板的制造方法的特征在于，使用片状电路基板来制造电路基板，所述电路基板包括未固化层，其一部分除了设置电路芯片的部分之外可在处理所述电路芯片之前或之后选择性地固化，其中所述未固化层具有柔性，其能够在按压未固化层表面上的电路芯片之后将电路芯片嵌入电路基板中。根据本发明的电路基板的制造方法，可以高精度地将电路芯片嵌入到内部，并且可以高精度地容易地制造电路基板。

7. 发明授权

US08273437B2 Sheet material for multilayer optical recording medium, multilayer structural body for optical recording medium, and multilayer optical recording medium 有权
标题翻译：用于多层光学记录介质的片材，用于光学记录介质的多层结构体和多层光学记录介质
公开(公告)号：US08273437B2
公开(公告)日：2012-09-25
申请号：US12452315
申请日：2008-07-04
申请人： Masahito Nakabayashi
发明人： Masahito Nakabayashi
IPC分类号： B32B3/02
CPC分类号： G11B7/256 , B82Y10/00 , G11B7/24038 , G11B7/245 , G11B7/246 , Y10T428/21
摘要： A sheet material for a multilayer optical recording medium (10-a) which comprises an optical recording layer comprising a multiple-photon absorbing material (1), an adhesive layer (4) and a transfer layer of the energy beam curable type (3). The transfer layer of the energy beam curable type (3) is a layer for transferring the shape of a stamper having a shape having protrusions and depressions on the surface as recording pits and/or grooves. The transfer layer of the energy beam curable type (3) and the adhesive layer (4) are each disposed as outermost layers. A multilayer optical recording medium which has a repetitive structure comprising a plurality of laminated optical recording layers and exhibits excellent accuracy of thickness of each layer and the whole laminate can be produced with excellent productivity. Positional information can be contained at the inside of the optical recording medium.
摘要翻译：一种用于多层光学记录介质（10-a）的片材，其包括包含多光子吸收材料（1）的光学记录层，粘合层（4）和能量束固化型（3）的转印层，。能量束固化型（3）的转印层是用于将具有作为记录凹坑和/或沟槽的表面上具有突起和凹陷的形状的压模的形状转印的层。能量束固化型（3）和粘合层（4）的转印层各自设置为最外层。可以以优异的生产率制造具有重复结构的多层光学记录介质，其包括多个层压光学记录层，并且显示出优异的各层厚度精度和整个层叠体。位置信息可以包含在光学记录介质的内部。

8. 发明申请

US20090121363A1 Process for Producing Circuit Substrate and Circuit Substrate Obtained in Accordance With the Process 审中-公开
标题翻译：生产电路基板和电路基板的工艺
公开(公告)号：US20090121363A1
公开(公告)日：2009-05-14
申请号：US12225446
申请日：2007-03-20
申请人： Masahito Nakabayashi
发明人： Masahito Nakabayashi
IPC分类号： H01L23/28 , H01L21/77
CPC分类号： H05K1/185 , H01L23/5389 , H01L2924/0002 , H05K2201/09118 , H05K2203/0156 , H05K2203/1469 , H01L2924/00
摘要： A process for producing a circuit substrate having a resin sheet having embedded circuit chips which is obtained by embedding circuit chips into a resin sheet, which comprises steps of (a) arranging and fixing circuit chips on a substrate for processing, (b) coating the substrate for processing on which the circuit chips have been arranged and fixed with a liquid material for forming a resin sheet of an energy curing type to form an uncured coating layer, (c) curing the uncured coating layer by impressing energy to form a layer of a resin sheet having embedded circuit chips, and (d) removing the substrate for processing from the layer of a resin sheet having embedded circuit chips, and a circuit substrate obtained in accordance with the process. A circuit substrate having a resin sheet having embedded circuit chips for controlling pixels of displays and the like can be produced efficiently with excellent quality and excellent productivity.
摘要翻译：一种制造电路基板的方法，该电路基板具有通过将电路芯片嵌入树脂片而获得的具有嵌入电路芯片的树脂片，其包括以下步骤：（a）将电路芯片布置和固定在基板上进行处理，（b）用于形成未固化涂层的树脂片的液体材料布置和固定电路芯片的处理用基板，（c）通过施加能量来固化未固化的涂层，形成层具有嵌入电路芯片的树脂片，以及（d）从具有嵌入式电路芯片的树脂片的层除去加工用基板，以及根据该工序得到的电路基板。可以以优异的质量和优异的生产率有效地制造具有用于控制显示器像素的嵌入式电路芯片的树脂片的电路基板。

9. 发明申请

US20100143638A1 SHEET MATERIAL FOR MULTILAYER OPTICAL RECORDING MEDIUM, MULTILAYER STRUCTURAL BODY FOR OPTICAL RECORDING MEDIUM, AND MULTILAYER OPTICAL RECORDING MEDIUM 有权
标题翻译：用于多层光学记录介质的光学材料，用于光记录介质的多层结构体，以及多层光学记录介质
公开(公告)号：US20100143638A1
公开(公告)日：2010-06-10
申请号：US12452315
申请日：2008-07-04
申请人： Masahito Nakabayashi
发明人： Masahito Nakabayashi
IPC分类号： B32B3/02
CPC分类号： G11B7/256 , B82Y10/00 , G11B7/24038 , G11B7/245 , G11B7/246 , Y10T428/21
摘要： A sheet material for a multilayer optical recording medium (10-a) which comprises an optical recording layer comprising a multiple-photon absorbing material (1), an adhesive layer (4) and a transfer layer of the energy beam curable type (3). The transfer layer of the energy beam curable type (3) is a layer for transferring the shape of a stamper having a shape having protrusions and depressions on the surface as recording pits and/or grooves. The transfer layer of the energy beam curable type (3) and the adhesive layer (4) are each disposed as outermost layers. A multilayer optical recording medium which has a repetitive structure comprising a plurality of laminated optical recording layers and exhibits excellent accuracy of thickness of each layer and the whole laminate can be produced with excellent productivity. Positional information can be contained at the inside of the optical recording medium.
摘要翻译：一种用于多层光学记录介质（10-a）的片材，其包括包含多光子吸收材料（1）的光学记录层，粘合层（4）和能量束固化型（3）的转印层，。能量束固化型（3）的转印层是用于将具有作为记录凹坑和/或沟槽的表面上具有突起和凹陷的形状的压模的形状转印的层。能量束固化型（3）和粘合层（4）的转印层各自设置为最外层。可以以优异的生产率制造具有重复结构的多层光学记录介质，其包括多个层压光学记录层，并且显示出优异的各层厚度精度和整个层叠体。位置信息可以包含在光学记录介质的内部。

10. 发明申请

US20100044887A1 METHOD FOR PRODUCING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATE 有权
标题翻译：用于生产电路基板的方法和电路基板
公开(公告)号：US20100044887A1
公开(公告)日：2010-02-25
申请号：US12523805
申请日：2008-01-17
申请人： Tatsuo Fukuda , Masahito Nakabayashi , Naofumi Izumi
发明人： Tatsuo Fukuda , Masahito Nakabayashi , Naofumi Izumi
IPC分类号： H01L21/56 , H01L23/28
CPC分类号： H05K1/185 , H01L21/56 , H01L23/5389 , H01L2924/0002 , H05K3/0011 , H05K3/007 , H05K2201/0108 , H05K2203/016 , H05K2203/056 , H05K2203/1469 , H05K2203/1476 , H01L2924/00
摘要： The method for producing a circuit substrate of the present invention is characterized in that the circuit substrate is produced using as sheet a circuit substrate sheet including an uncured layer a part of which, the part being other than a part at which a circuit chip is disposed, is selectively curable before or after disposal of said circuit chip, wherein the uncured layer has a softness that enables embedding of the circuit chip in the circuit substrate sheet upon pressing the circuit chip that has been disposed on a surface of the uncured layer. According to the method for producing the circuit substrate of the present invention, the circuit chip can be embedded inwards with high accuracy, and the circuit substrate can be produced easily with high accuracy.
摘要翻译：本发明的电路基板的制造方法的特征在于，使用片状电路基板来制造电路基板，所述电路基板包括未固化层，其一部分除了设置电路芯片的部分之外可在处理所述电路芯片之前或之后选择性地固化，其中所述未固化层具有柔性，其能够在按压未固化层表面上的电路芯片之后将电路芯片嵌入电路基板中。根据本发明的电路基板的制造方法，可以高精度地将电路芯片嵌入到内部，并且可以高精度地容易地制造电路基板。

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