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1. 发明申请

US20060082002A1 Sheet for circuit substrates and sheet of a circuit substrate for displays 审中-公开
标题翻译：用于显示器的电路基板和电路基板的片材
公开(公告)号：US20060082002A1
公开(公告)日：2006-04-20
申请号：US11230039
申请日：2005-09-19
申请人： Takayuki Arai , Naofumi Izumi , Tomomi Tetsumoto , Masahito Nakabayashi
发明人： Takayuki Arai , Naofumi Izumi , Tomomi Tetsumoto , Masahito Nakabayashi
IPC分类号： H01L23/28
CPC分类号： H05K1/185
摘要： A sheet for circuit substrates for displays which comprises a polymer material of an energy ray hardening type for embedding circuit chips, wherein a storage modulus of an unhardened layer comprising the polymer material of an energy ray hardening type is 103 Pa or greater and smaller than 107 Pa at a temperature of embedding the circuit chips or at 25° C., and a storage modulus of a hardened layer obtained by hardening the unhardened layer is 107 Pa or greater at 25° C.; and a sheet of circuit substrate for displays obtained by embedding circuit chips into the unhardened layer, followed by hardening the unhardened layer by irradiation with an energy ray. A sheet of a circuit substrate in which circuit chips for controlling pixels of displays and, in particular, flat panel displays are embedded into the sheet can be efficiently produced with excellent quality and productivity using the sheet for circuit substrates.
摘要翻译：一种显示器用电路基板用片，其特征在于，包括用于嵌入电路芯片的能量射线硬化型聚合物材料，其中包含能量射线硬化型聚合物材料的未硬化层的储能模量为10 3 > Pa或更大且小于10Pa，在嵌入电路芯片的温度或25℃下，通过硬化未硬化层获得的硬化层的储能模量为10 ^{7Pa以上。以及通过将电路芯片嵌入未硬化层而获得的用于显示器的电路基板片材，然后通过用能量射线照射来硬化未硬化层。可以使用电路基板的片材，以优异的质量和生产率，有效地制造用于控制显示器的像素，特别是平板显示器的电路芯片的电路基板。}

2. 发明申请

US20120319305A1 PROCESS FOR PRODUCING A SHEET OF A CIRCUIT SUBSTRATE 审中-公开
标题翻译：制造电路基板的方法
公开(公告)号：US20120319305A1
公开(公告)日：2012-12-20
申请号：US13471647
申请日：2012-05-15
申请人： Takayuki Arai , Naofumi Izumi , Tomomi Tetsumoto , Masahito Nakabayashi
发明人： Takayuki Arai , Naofumi Izumi , Tomomi Tetsumoto , Masahito Nakabayashi
IPC分类号： H01L21/56 , H01L23/29
CPC分类号： H05K1/185
摘要： A process for producing a sheet of a circuit substrate which includes (i) providing a sheet for a circuit substrate which contains a layer of a polymer material of an energy ray hardening type for embedding circuit chips and is used for displays, the layer before being hardened by irradiating an energy ray having a storage modulus of 103 Pa or greater and smaller than 107 Pa at a temperature of embedding the circuit chips, (ii) embedding the circuit chips into the layer, and (iii) hardening the layer by irradiating an energy ray onto the layer to obtain the sheet of a circuit substrate, whereby the circuit chips are embedded, fixed and maintained in the resultant hardened layer, wherein the layer after being hardened by irradiating an energy ray has a storage modulus of 107 Pa or greater at 25° C.
摘要翻译：一种电路基板的制造方法，其特征在于，包括：（i）提供用于电路基板的片材，所述电路基板包含用于嵌入电路芯片的能量线硬化型聚合物材料层，并用于显示器，通过在嵌入电路芯片的温度下照射具有103Pa以上且小于107Pa的储能模量的能量线来硬化，（ii）将电路芯片嵌入该层中，以及（iii）通过照射能量射线到层上以获得电路基板，由此将电路芯片嵌入，固定并保持在所得到的硬化层中，其中通过照射能量射线硬化后的层具有107Pa或更大的储能模量在25°C

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