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1. 发明授权

US06566287B1 Non-woven fabric, and sheet and artificial leather produced from the same 失效
标题翻译：无纺布，以及从其制造的片材和人造革
公开(公告)号：US06566287B1
公开(公告)日：2003-05-20
申请号：US09530426
申请日：2000-05-01
申请人： Masahisa Mimura , Hideki Nitta , Nobuo Ohkawa , Kimio Nakamura , Yoshiji Usui , Hiroji Wakisaka , Akihiro Imoto
发明人： Masahisa Mimura , Hideki Nitta , Nobuo Ohkawa , Kimio Nakamura , Yoshiji Usui , Hiroji Wakisaka , Akihiro Imoto
IPC分类号： D04H100
CPC分类号： D06N3/0004 , D04H1/4334 , D04H1/435 , D04H1/4374 , D04H1/4382 , D04H1/4391 , Y10S428/904 , Y10T428/24438 , Y10T442/2008 , Y10T442/2369 , Y10T442/2893 , Y10T442/614 , Y10T442/615 , Y10T442/626 , Y10T442/689
摘要： A non-woven fabric having such a structure that fine fibers having a small fineness are entangled with one another and a sheet obtained by impregnating the non-woven fabric with an elastic polymer satisfy the following requirements: the fine fibers should be obtained by splitting a strippable and splittable composite short fiber comprising at least two components; the fine fibers should have a monofilament size of 0.01 to 0.5 denier; the fine fibers should form a fine non-woven fabric structure that they are entangled with one another at random; the apparent density should be 0.18 to 0.45 g/cm3; the average area of spaces between fibers in the cross section of the non-woven fabric measured by the image analysis of an electron scanning microscope should be 70 to 250 &mgr;m2; and the non-woven fabric should have such a uniform structure that the standard deviation of the area of a space between fibers in the cross section of the non-woven fabric measured by the image analysis of the electron scanning microscope is 200 to 600 &mgr;m2. The non-woven fabric and sheet are advantageously used as a substrate for artificial leather.
摘要翻译：具有这样一种结构的无纺织物，其细纤维细小的纤维彼此缠结，并且通过用弹性聚合物浸渍无纺布获得的片材满足以下要求：细纤维应该通过分裂可剥离和可分裂复合短纤维，其包含至少两种组分; 细纤维的单丝尺寸应为0.01〜0.5旦; 细纤维应形成细微的无纺布结构，使它们互相缠绕; 表观密度应为0.18〜0.45g / cm3; 通过电子扫描显微镜的图像分析测量的无纺布横截面中的纤维之间的平均空间面积应为70至250mum2; 并且无纺布应具有通过电子扫描显微镜的图像分析测量的无纺布横截面中的纤维之间的空间面积的标准偏差为200至600mum2的均匀结构。无纺布和片材有利地用作人造革的基材。

2. 发明授权

US08679654B2 Magnetic recording medium including plural FePt alloy layers including carbon, oxides or nitrides 有权
标题翻译：磁记录介质包括包含碳，氧化物或氮化物的多个FePt合金层
公开(公告)号：US08679654B2
公开(公告)日：2014-03-25
申请号：US13372116
申请日：2012-02-13
申请人： Hiroaki Nemoto , Ikuko Takekuma , Kimio Nakamura , Junichi Sayama
发明人： Hiroaki Nemoto , Ikuko Takekuma , Kimio Nakamura , Junichi Sayama
IPC分类号： G11B5/66 , G11B5/65 , C22C38/00 , C22C5/04
CPC分类号： G11B5/653 , C22C5/04 , C22C38/002 , C22C2202/02 , G11B5/65 , G11B5/66
摘要： Surface flatness of magnetic recording medium to which a magnetic recording layer made of L10 FePt magnetic alloy thin film, with distance between a magnetic head and a magnetic recording medium sufficiently reduced. The magnetic recording layer includes: magnetic layers containing a magnetic alloy including Fe and Pt as principal materials; and one non-magnetic material selected from carbon, oxide and nitride. The first magnetic layer disposed closer to a substrate has a granular structure in which magnetic alloy grains including FePt alloy as the principal material are separated from grain boundaries including the non-magnetic material as the principal material. The second magnetic layer disposed closer to the surface than the first magnetic layer is fabricated so as to have a homogeneous structure in which an FePt alloy and the non-magnetic material are mixed in a state finer than diameters of the FePt magnetic alloy grains in the first magnetic layer.
摘要翻译：由L10FePt磁性合金薄膜制成的磁记录层，磁头和磁记录介质之间的距离充分降低的磁记录介质的表面平整度。磁记录层包括：含有以Fe和Pt为主要材料的磁性合金的磁性层; 和一种选自碳，氧化物和氮化物的非磁性材料。靠近基板设置的第一磁性层具有以包含FePt合金作为主要材料的磁性合金颗粒与包括非磁性材料在内的晶界作为主要材料的颗粒结构。制造比第一磁性层更靠近表面的第二磁性层，以具有均匀的结构，其中FePt合金和非磁性材料以比FePt磁性合金粒子的直径小的状态混合第一磁性层。

3. 发明授权

US08355310B2 Optical information recording method 失效
标题翻译：光信息记录方法
公开(公告)号：US08355310B2
公开(公告)日：2013-01-15
申请号：US12545996
申请日：2009-08-24
申请人： Koichi Watanabe , Kimio Nakamura
发明人： Koichi Watanabe , Kimio Nakamura
IPC分类号： G11B7/00
CPC分类号： G11B7/1267 , G11B7/0062 , G11B7/1263
摘要： To solve the problem of deterioration in recording quality due to a change of a write waveform caused by changes of temperature and recording powers, aged deterioration and the like. A driver having a function of controlling rise/fall times and an overshoot amount of an optical waveform is used to optimize an optical waveform that changes in recording under the influence of a component of a laser and the like. Specifically, the rise/fall times and the overshoot amount of the optical waveform are optimized by obtaining a waveform control register value from test recording or a table.
摘要翻译：为了解决由于温度变化和记录功率，老化劣化等引起的写入波形的变化而导致的记录质量劣化的问题。使用具有控制上升/下降时间和光波形的过冲量的功能的驱动器来优化在激光等的影响下记录变化的光波形。具体地，通过从测试记录或表中获得波形控制寄存器值来优化光学波形的上升/下降时间和过冲量。

4. 发明授权

US07566586B2 Method of manufacturing a semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US07566586B2
公开(公告)日：2009-07-28
申请号：US11634119
申请日：2006-12-06
申请人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
发明人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/00 , H01L2924/3512
摘要： A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.
摘要翻译：半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合在底部填充硬化步骤中加热。该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。

5. 发明授权

US07367108B2 Method of bonding flying leads 失效
标题翻译：拼接飞线的方法
公开(公告)号：US07367108B2
公开(公告)日：2008-05-06
申请号：US11391362
申请日：2006-03-29
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： B23K20/10
CPC分类号： B23K20/10 , B23K2101/32 , H05K3/26 , H05K3/328 , Y10T29/49027 , Y10T29/4903
摘要： A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which (at least one contact member) a plurality of contact members that contact(s) the flying leads and apply (applies) the ultrasonic vibration thereto are (is) rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the plurality of contact members (at least one contact member) rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the plurality of contact members (at least one contact member) to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.
摘要翻译：结合飞行引线的方法在飞行引线和衬底焊盘之间产生可靠的结合，并且可以使用焊接工具有效地结合多个飞行引线和多个衬底焊盘。飞行引线分别与平行设置的多个基板焊盘对准，并且焊接工具对飞行引线施加超声波振动以将相应的基板焊盘和飞行引线接合。使用接合工具进行接合，其中（至少一个接触构件）多个接触飞行引线并且施加（施加）超声波振动的接触构件被可旋转地支撑。接合工具沿与多个接触构件（至少一个接触构件）平行布置的飞行导线与飞行导线接触的方向移动，并且从多个接触构件对飞行的接触构件（至少一个接触构件）导致将相应的飞行引线超声波地结合到衬底焊盘。

6. 发明授权

US5179412A Transfer unit for xerographic printing machine with constant ventilating interior 失效
标题翻译：静电复印机的转印单元，具有恒定的通风内部
公开(公告)号：US5179412A
公开(公告)日：1993-01-12
申请号：US789887
申请日：1991-11-12
申请人： Masato Yamada , Junji Shirakawa , Kazuo Uno , Kimio Nakamura
发明人： Masato Yamada , Junji Shirakawa , Kazuo Uno , Kimio Nakamura
IPC分类号： G03G21/10 , G03G15/00 , G03G15/16 , G03G21/00
CPC分类号： G03G15/1635
摘要： A transfer unit for a xerographic printing machine including at least two rollers and an endless belt supported by the rollers. A frame member supports the rollers. A photoreceptor is disposed adjacent to the endless belt, and a charging means is disposed opposite to the photoreceptor so that the endless belt is locate between the charging means and the photoreceptor. Pressure in the space within the transfer unit, which is surrounded by the endless belt and the frame member and contains the endless belt charging means disposed therein, is slightly higher than atmosphere pressure outside the transfer unit.
摘要翻译：一种用于静电印刷机的转印单元，其包括至少两个辊和由辊支撑的环形带。框架构件支撑辊。感光体邻近环形带设置，并且充电装置设置成与感光体相对，使得环形带位于充电装置和感光体之间。由环形带和框架构件包围的传送单元内的空间中的压力，包含设置在其中的环形带充电装置，稍高于转印单元外部的气氛压力。

7. 发明授权

US4323837A Power supply circuit for automotive vehicles 失效
标题翻译：汽车电源电路
公开(公告)号：US4323837A
公开(公告)日：1982-04-06
申请号：US58473
申请日：1979-07-18
申请人： Kimio Nakamura , Kimio Fujisawa , Kokichi Ochiai
发明人： Kimio Nakamura , Kimio Fujisawa , Kokichi Ochiai
IPC分类号： H02J7/14
CPC分类号： H02J7/1476
摘要： A power supply circuit arrangement for automotive vehicles comprises an engine-driven alternator, a storage battery, a battery charging circuit connected between the alternator and the battery including a diode poled in a sense to conduct current from the alternator to the battery and a plurality of connectors connected from the anode of the diode to supply current to associated load equipment. In one embodiment, a pair of series connected diodes is connected in inverse parallel relation with the charging diode for discharging the battery to supply current therefrom to the load equipments. A voltage detector is connected to the junction between the discharging diodes to generate a throttle opening signal when the voltage at the junction falls below a preset value. In another embodiment, the load equipments are divided into a first group of relatively heavy loads which can be operated on current less than the nominal value and a second group of relatively light loads which must be operated on the nominal current value, the first group being connected to the anode of the charging diode and the second group being connected to the cathode thereof.
摘要翻译：一种用于机动车辆的电源电路装置，包括发动机驱动的交流发电机，蓄电池，连接在交流发电机和电池之间的电池充电电路，其包括在从交流发电机传导电流到电池的意义上极化的二极管，以及多个连接器从二极管的阳极连接到相关的负载设备。在一个实施例中，一对串联连接的二极管与充电二极管反向并联连接，用于对电池放电以将电流从其提供给负载设备。电压检测器连接到放电二极管之间的连接点，当结点处的电压低于预设值时产生节气门开启信号。在另一个实施例中，负载设备被划分为可以在小于标称值的电流上操作的第一组相对较重的负载和必须以标称电流值操作的第二组较轻负载，第一组为连接到充电二极管的阳极，第二组连接到其阴极。

8. 发明授权

US08381963B2 Compression-bonding apparatus 失效
标题翻译：压接装置
公开(公告)号：US08381963B2
公开(公告)日：2013-02-26
申请号：US12818554
申请日：2010-06-18
申请人： Kimio Nakamura , Yoshiyuki Satoh , Kenji Kobae
发明人： Kimio Nakamura , Yoshiyuki Satoh , Kenji Kobae
IPC分类号： B23K37/04 , B29C65/02
CPC分类号： H01L24/97 , H01L21/563 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75305 , H01L2224/75315 , H01L2224/7598 , H01L2224/81203 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/9211 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.
摘要翻译：压接装置包括支撑台和按压工具。按压工具包括加压台，弹性件和多个接合头。弹性部件由压制台保持。多个接合头包括附接到弹性构件的上表面和面向支撑台的上表面的下表面。

9. 发明授权

US08186615B2 Rotor head of remotely-controlled helicopter and remotely-controlled helicopter 有权
标题翻译：遥控直升机和遥控直升机转头
公开(公告)号：US08186615B2
公开(公告)日：2012-05-29
申请号：US12667495
申请日：2007-07-02
申请人： Takakazu Uebori , Kimio Nakamura
发明人： Takakazu Uebori , Kimio Nakamura
IPC分类号： B64C27/52 , B64C27/54
CPC分类号： A63H27/12
摘要： A remote controlled helicopter of a single rotor type to be used indoors, having a flying operation that can be stabilized and operability that can be improved. The helicopter includes a center hub that supports a rotor head to a mainmast, and is divided into an upper center hub and a lower center hub. The upper and the lower center hubs are fixed around the shaft of the mainmast with a predetermined angle. A phase angle of a main rotor as an output with respect to an operation input from a swash plate becomes an acute angle, and the main rotor and a stabilizer are mounted to rotate with a phase difference of the acute angle.
摘要翻译：一种用于室内使用的单转子类型的遥控直升机，具有可以稳定的飞行操作和可以改进的可操作性。直升机包括一个将转子头支撑到主仓的中心毂，并分为上中心毂和下中心毂。上下中心毂以预定角度固定在主仓的轴上。相对于来自斜盘的操作输入的主转子作为输出的相位角成为锐角，主转子和稳定器安装成以锐角的相位差旋转。

10. 发明申请

US20100327435A1 ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF 审中-公开
标题翻译：电子元器件及其制造方法
公开(公告)号：US20100327435A1
公开(公告)日：2010-12-30
申请号：US12822656
申请日：2010-06-24
申请人： Kimio Nakamura , Takayoshi Matsumura , Yoshiyuki Satoh , Kuniko Ishikawa , Kenji Kobae
发明人： Kimio Nakamura , Takayoshi Matsumura , Yoshiyuki Satoh , Kuniko Ishikawa , Kenji Kobae
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L23/49811 , H01L23/49816 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/812 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/19041 , H01L2924/19043 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads.
摘要翻译：电子部件包括封装基板，多个导电焊盘，绝缘材料和半导体器件。多个导电焊盘设置在封装衬底上。绝缘材料设置在多个导电焊盘之间。绝缘材料包括位于与多个导电焊盘的上表面相同的平面上的顶表面。半导体器件包括对准在多个导电焊盘的相应导电焊盘上的导电凸块。

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