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1. 发明授权

US08110907B2 Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrate 有权
标题翻译：包括具有多条导线的第一基板和多个第一电极的半导体装置和其上安装有半导体芯片的第二基板，以及与第一基板的第一电极连接的第二电极
公开(公告)号：US08110907B2
公开(公告)日：2012-02-07
申请号：US12318798
申请日：2009-01-08
申请人： Masahiro Yamaguchi , Emi Sawayama , Hiroshi Oyama , Shigeharu Tsunoda , Yasuo Amano , Naoki Matsushima
发明人： Masahiro Yamaguchi , Emi Sawayama , Hiroshi Oyama , Shigeharu Tsunoda , Yasuo Amano , Naoki Matsushima
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/5387 , H01L24/48 , H01L24/50 , H01L24/93 , H01L2224/0401 , H01L2224/05644 , H01L2224/78313 , H01L2225/06579 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/15311 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.
摘要翻译：半导体器件包括半导体芯片，第一基板和第二基板。第一基板包括多个导线和多个第一电极，每个第一电极与每个导线连接。第二基板包括安装在其上的半导体芯片，以及多个第二电极，每个第二电极与第一基板的每个第一电极连接。第一基板的导线的宽度根据导线的长度而不同。通过根据其长度改变电线的宽度，可以减少电极的刚度变化和电极附近，从而可以降低超声波接合强度的变化。

2. 发明申请

US20090206492A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20090206492A1
公开(公告)日：2009-08-20
申请号：US12318798
申请日：2009-01-08
申请人： Masahiro Yamaguchi , Emi Sawayama , Hiroshi Oyama , Shigeharu Tsunoda , Yasuo Amano , Naoki Matsushima
发明人： Masahiro Yamaguchi , Emi Sawayama , Hiroshi Oyama , Shigeharu Tsunoda , Yasuo Amano , Naoki Matsushima
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/5387 , H01L24/48 , H01L24/50 , H01L24/93 , H01L2224/0401 , H01L2224/05644 , H01L2224/78313 , H01L2225/06579 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/15311 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.
摘要翻译：半导体器件包括半导体芯片，第一基板和第二基板。第一基板包括多个导线和多个第一电极，每个第一电极与每个导线连接。第二基板包括安装在其上的半导体芯片，以及多个第二电极，每个第二电极与第一基板的每个第一电极连接。第一基板的导线的宽度根据导线的长度而不同。通过根据其长度改变电线的宽度，可以减少电极的刚度变化和电极附近，从而可以降低超声波接合强度的变化。

3. 发明授权

US08437584B2 Optical I/O array module and its fabrication method 有权
标题翻译：光I / O阵列模块及其制作方法
公开(公告)号：US08437584B2
公开(公告)日：2013-05-07
申请号：US12844452
申请日：2010-07-27
申请人： Yasunobu Matsuoka , Toshiki Sugawara , Koichiro Adachi , Naoki Matsushima , Saori Hamamura , Madoka Minagawa , Norio Chujo
发明人： Yasunobu Matsuoka , Toshiki Sugawara , Koichiro Adachi , Naoki Matsushima , Saori Hamamura , Madoka Minagawa , Norio Chujo
IPC分类号： G02B6/26 , G02B6/42
CPC分类号： G02B6/43 , G02B6/4214 , G02B6/423 , H01S5/423 , Y10T29/49117
摘要： In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.
摘要翻译：在制造光学I / O阵列模块时，在衬底上形成具有锥面的镜部分的光波导，凸形或凹形的部件位于光波导，激光二极管阵列和具有凹形或凸形的光电二极管阵列在安装之前与凸形构件或凹形构件配合或配合。此外，形成有多个膜层，其上集成有光学元件的驱动器IC LSI和光学元件的放大器LSI的LSI。

4. 发明授权

US08437228B2 Thermally-assisted magnetic recording head 失效
标题翻译：热辅助磁记录头
公开(公告)号：US08437228B2
公开(公告)日：2013-05-07
申请号：US13057585
申请日：2009-06-09
申请人： Naoki Matsushima , Satoshi Arai , Takuya Matsumoto , Jun-ichiro Shimizu , Irizo Naniwa
发明人： Naoki Matsushima , Satoshi Arai , Takuya Matsumoto , Jun-ichiro Shimizu , Irizo Naniwa
IPC分类号： G11B11/00
CPC分类号： G11B5/314 , G02B6/4214 , G11B5/6005 , G11B5/6088 , G11B2005/0005 , G11B2005/0021
摘要： A thermally assisted magnetic recording head with highly efficient optical coupling, while guiding a laser beam from a semiconductor laser element, i.e., a light source, to a leading end thereof, eliminating an influence due to heat generated by the element, and having excellent floating characteristics. The thermally assisted magnetic recording head includes a substrate 2 having a first optical waveguide 1, a semiconductor laser element 100, and a slider 4 having a second optical waveguide 3 formed on an end surface. The semiconductor laser element 100 is fixed on the substrate 2 so that light emitted from the element 100 propagates through the first optical waveguide 1 and a slider 4 is fixed on the substrate 2 so that light emitted from the first optical waveguide 1 propagates through the second optical waveguide 3. High optical coupling efficiency is then achieved, while ensuring both heat-dissipating and floating characteristics.
摘要翻译：一种具有高效光耦合的热辅助磁记录头，同时将来自半导体激光元件（即光源）的激光束引导到其前端，消除了由元件产生的热量的影响，并且具有优异的浮动特点热辅助磁记录头包括具有第一光波导1，半导体激光元件100和具有形成在端面上的第二光波导3的滑块4的基板2。半导体激光元件100固定在基板2上，使得从元件100发射的光通过第一光波导1传播，并且滑块4固定在基板2上，使得从第一光波导1发射的光通过第二光波导1传播。光波导3.然后实现高光耦合效率，同时确保散热和浮动特性。

5. 发明授权

US08103332B2 Head-coupled holder for living body optical measurement 有权
标题翻译：用于生物体光学测量的头部联接支架
公开(公告)号：US08103332B2
公开(公告)日：2012-01-24
申请号：US12219259
申请日：2008-07-18
申请人： Masashi Kiguchi , Naoki Matsushima , Hirokazu Atsumori
发明人： Masashi Kiguchi , Naoki Matsushima , Hirokazu Atsumori
IPC分类号： A61B6/00
CPC分类号： A61B5/0059 , A61B5/1455 , A61B5/6814 , A61B2562/0233 , A61B2562/046
摘要： A head-coupled holder the optical measurement of a living body that securely brings a light irradiation module and a light detection module in close contact with the scalp of a person to be examined, and gives the person no excessive pressure feeling. Each light irradiation module and light detection module includes a contactor having a contact portion that comes in contact with the scalp at a leading end thereof, and exposes a leading end of a light guide to the contact portion to form the light guide, and a package having a lower portion to which the contactor is attached. The contactor is fixed to the lower portion of the package through an elastic body, and the package is fixed to an inner upper wall of the insertion hole with a series structure of the elastic body and the viscoelastic body.
摘要翻译：一种头部联接的保持器，其使得能够牢固地使被照射人的头皮紧密接触的光照射模块和光检测模块的生物体的光学测量，并且给予该人没有过度的压力感。每个光照射模块和光检测模块包括接触器，该接触器具有在其前端与头皮接触的接触部分，并且将导光体的前端暴露于接触部分以形成光导;以及封装具有接触器所附接的下部。接触器通过弹性体固定到包装的下部，并且包装件以弹性体和粘弹性体的串联结构固定到插入孔的内上壁。

6. 发明授权

US07939938B2 Functional device package with metallization arrangement for improved bondability of two substrates 有权
标题翻译：具有金属化布置的功能器件封装，用于改善两个衬底的粘合性
公开(公告)号：US07939938B2
公开(公告)日：2011-05-10
申请号：US12028108
申请日：2008-02-08
申请人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
发明人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
IPC分类号： H01L23/04
CPC分类号： B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： A packaging structure for hermetically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.
摘要翻译：一种封装结构，用于通过在晶片级焊接连接来密封功能器件，其中使用在其内表面上具有金属化的凹部的第一Si衬底和在与所述凹部相对的位置上金属化的第二Si衬底，所述金属化施加到第一Si衬底的凹部的内表面，并且在与凹部相对的位置处施加到第二Si衬底的金属化通过熔融焊料连接，以将功能器件密封在第一Si衬底和第二Si衬底之间 Si衬底，由此提高了用于两个Si衬底的焊料的润湿性，提高了Si衬底之间的粘合性，并提高了制造封装的成品率。

7. 发明申请

US20090180732A1 Junction Structure Between Optical Element and Substrate, Optical Transmission/Receiving Module, and Method of Manufacturing the Optical Module 审中-公开
标题翻译：光学元件与基板之间的接合结构，光学传输/接收模块以及制造光学模块的方法
公开(公告)号：US20090180732A1
公开(公告)日：2009-07-16
申请号：US12257415
申请日：2008-10-24
申请人： Toshiaki TAKAI , Akiko Mizushima , Naoki Matsushima
发明人： Toshiaki TAKAI , Akiko Mizushima , Naoki Matsushima
IPC分类号： G02B6/12 , B29D11/00 , G02B6/26
CPC分类号： G02B6/42 , G02B6/4212 , G02B6/4214 , G02B6/4239
摘要： The present invention provides a junction structure between an optical element and a substrate. The junction structure is formed by supplying an under-fill resin not containing a filler to a portion functioning as a light path for light emitted from or incoming into the optical element on the substrate, then jointing a conductive bump of the optical element to electric wiring on the substrate, and then thermally hardening the under-fill resin not containing a filler to bond the resin not containing a filler to the optical element and to the substrate so that the under-fill resin containing a filler will not enter a space between the optical element and the substrate when the under-fill resin containing a filler is filled in portions other than the light path between the optical element and the substrate.
摘要翻译：本发明提供了一种光学元件与基板之间的接合结构。通过将不含填料的填充不足的树脂供给到作为从基板上的光学元件射出的光的光路的部分，然后将光学元件的导电凸块接合到电线然后对不含填料的未填充树脂进行热固化，将不含填料的树脂粘合到光学元件和基材上，使含有填料的填充不足的树脂不会进入当包含填料的填充不足的树脂填充在光学元件和基板之间的光路以外的部分时，光学元件和基板。

8. 发明申请

US20080277589A1 SEMICONDUCTOR RADIOACTIVE RAY DETECTOR, RADIOACTIVE RAY DETECTION MODULE, AND NUCLEAR MEDICINE DIAGNOSIS APPARATUS 失效
标题翻译：半导体放射性检测器，放射性检测模块和核医学诊断装置
公开(公告)号：US20080277589A1
公开(公告)日：2008-11-13
申请号：US11501779
申请日：2006-08-10
申请人： Tomoyuki Seino , Norihito Yanagita , Toshiaki Takai , Chiko Yorita , Naoki Matsushima
发明人： Tomoyuki Seino , Norihito Yanagita , Toshiaki Takai , Chiko Yorita , Naoki Matsushima
IPC分类号： G01T1/24
CPC分类号： G01T1/2985 , A61B6/037 , G01T1/243 , G01T1/244 , G01T1/249
摘要： The present invention provides a semiconductor radioactive ray detector having the excellent energy resolution or time precision, a radioactive detection module, and a nuclear medicine diagnosis apparatus. The semiconductor radioactive ray detector has a structure in which plate-like elements made of cadmium telluride and conductive members are alternately laminated and the plate-like element made of cadmium telluride and the conductive member are adhered to each other with a conductive adhesive agent, and the Young's modulus of the conductive adhesive agent is in the range from 350 MPa to 1000 MPa, while the conductive members are made from a material with the linear expansion coefficient of the conductive members in the range from 5×10−6/° C. to 7×10−6/° C.
摘要翻译：本发明提供了具有优异的能量分辨率或时间精度的半导体放射线检测器，放射性检测模块和核医学诊断装置。半导体放射线检测器具有由碲化镉和导电构件制成的板状元件交替层叠的结构，并且由碲化镉构成的板状元件和导电元件用导电粘合剂彼此粘合，并且导电粘合剂的杨氏模量在350MPa至1000MPa的范围内，而导电构件由导电构件的线性膨胀系数在5×10 -6以下的材料制成 > /℃至7×10 -6 /℃

9. 发明授权

US07027674B2 Optical module and optical transmission apparatus 有权
标题翻译：光模块和光传输装置
公开(公告)号：US07027674B2
公开(公告)日：2006-04-11
申请号：US10611289
申请日：2003-06-30
申请人： Naoki Matsushima , Kazumi Kawamoto , Hideyuki Kuwano , Yoshiaki Niwa , Tetsuya Katou
发明人： Naoki Matsushima , Kazumi Kawamoto , Hideyuki Kuwano , Yoshiaki Niwa , Tetsuya Katou
IPC分类号： G02B6/12 , G02B6/10
CPC分类号： G02B6/4201 , G02B6/423
摘要： The present invention provides an optical module, and an optical transmission line comprising the optical module. The optical module has a structure in which an optical-modulator-mounted carrier is formed of a semiconductor substrate; a transmission line on the carrier is formed of a coplanar waveguide; a transmission line for inputting a signal into the transmission line is formed on a dielectric substrate; the transmission line on the input side which is a grounded coplanar waveguide is coupled by a conversion line to the transmission line on the output side which is a coplanar waveguide; and an electrical connection between the transmission lines is made by use of a conductor wire.
摘要翻译：本发明提供了一种光学模块和包括该光学模块的光学传输线。光学模块具有其中由光学调制器安装的载体由半导体衬底形成的结构; 载体上的传输线由共面波导形成; 在电介质基板上形成用于将信号输入到传输线的传输线; 作为接地共面波导的输入侧的传输线通过转换线耦合到作为共面波导的输出侧的传输线; 并且通过使用导线来实现传输线之间的电连接。

10. 发明授权

US07011457B2 Optical coupling apparatus 有权
标题翻译：光耦合装置
公开(公告)号：US07011457B2
公开(公告)日：2006-03-14
申请号：US10989290
申请日：2004-11-17
申请人： Kazuyuki Fukuda , Hideyuki Kuwano , Yoshiaki Niwa , Naoki Matsushima
发明人： Kazuyuki Fukuda , Hideyuki Kuwano , Yoshiaki Niwa , Naoki Matsushima
IPC分类号： G02B6/36
CPC分类号： G02B6/4204 , G02B6/4201 , G02B6/4208 , G02B6/4243 , G02B6/4256 , G02B6/4271
摘要： An optical coupling apparatus having a temperature control element on which a semiconductor light emitting element, a substrate and a lens are mounted, the semiconductor light emitting element being mounted on the substrate, and rays of light from the semiconductor light emitting element being introduced into the lens. A base on which the temperature control element is disposed, a through-hole portion formed in a housing wall portion installed on the base, penetrating through the housing wall portion and having a wall surface portion longer than a thickness of the housing wall portion and an optical fiber communicated with the through-hole portion and receiving converted light from the lens introduced thereto. A length of the substrate in a direction connecting the light emitting element to the optical fiber is within a range from 0.1 to 0.25 with respect to a length of the base sandwiched by the housing walls of the substrate.
摘要翻译：一种具有安装有半导体发光元件，基板和透镜的温度控制元件的光耦合装置，半导体发光元件安装在基板上，并将来自半导体发光元件的光线引入到镜片。设置有温度控制元件的基座，形成在安装在基座上的壳体壁部中的通孔部分，穿过壳体壁部分并且具有比壳体壁部分的厚度更长的壁表面部分，以及与通孔部分连通并接收从其引入的透镜的转换光的光纤。在将发光元件连接到光纤的方向上的基板的长度相对于由基板的壳体壁夹持的基板的长度在0.1〜0.25的范围内。

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