专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US6123248A Soldering method and soldering apparatus 失效
公开(公告)号：US6123248A
公开(公告)日：2000-09-26
申请号：US99522
申请日：1998-06-18
申请人： Masahiro Tadauchi , Makoto Gonda , Yoshiyuki Goto , Tomiaki Furuya , Kouichi Teshima , Izuru Komatsu , Takeshi Gotanda
发明人： Masahiro Tadauchi , Makoto Gonda , Yoshiyuki Goto , Tomiaki Furuya , Kouichi Teshima , Izuru Komatsu , Takeshi Gotanda
IPC分类号： B23K1/06 , B23K3/04 , B23K31/02 , B23K35/26 , C22C13/00 , H05K3/34 , B23K20/10 , B23K35/38
CPC分类号： B23K1/06 , B23K35/262 , B23K2201/40
摘要： Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

2. 发明授权

US06464122B1 Soldering method and soldering apparatus 失效
标题翻译：焊接方法和焊接设备
公开(公告)号：US06464122B1
公开(公告)日：2002-10-15
申请号：US09645595
申请日：2000-08-25
申请人： Masahiro Tadauchi , Makoto Gonda , Yoshiyuki Goto , Tomiaki Furuya , Kouichi Teshima , Izuru Komatsu , Takeshi Gotanda
发明人： Masahiro Tadauchi , Makoto Gonda , Yoshiyuki Goto , Tomiaki Furuya , Kouichi Teshima , Izuru Komatsu , Takeshi Gotanda
IPC分类号： B23K3700
CPC分类号： B23K1/06 , B23K35/262 , B23K2101/40
摘要： Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.
摘要翻译：公开了一种用于焊接基材的方法和装置。制备基本上由锡和可与锡形成共晶合金并且不含铅的金属组成的二元焊料。其他金属成分的含量为0.1重量％以下，氧含量为100ppm以下。二元焊料在非氧化环境中熔化，并在氧含量为2,000ppm以下的气氛中分配到基材，以用二元焊料来焊接基材。焊接装置包括用于向基材提供频率为15KHz至1MHz的振荡波能量的振荡器。焊接装置也可以以焊接喷嘴或烙铁的形式实现。

3. 发明授权

US06220501B1 Method of joining metallic members, and joined metallic members 有权
标题翻译：连接金属构件和接合的金属构件的方法
公开(公告)号：US06220501B1
公开(公告)日：2001-04-24
申请号：US09169981
申请日：1998-10-13
申请人： Masahiro Tadauchi , Izuru Komatsu , Kouichi Teshima , Rikiya Katoh , Jun Sugimoto , Takayuki Suzuki , Mitsuyoshi Hirayama
发明人： Masahiro Tadauchi , Izuru Komatsu , Kouichi Teshima , Rikiya Katoh , Jun Sugimoto , Takayuki Suzuki , Mitsuyoshi Hirayama
IPC分类号： B23K120
CPC分类号： B23K35/262 , B23K35/3613 , C22C13/00 , H05K3/3463
摘要： Disclosed is a method of joining metallic members together. The metallic members are coated with an undercoat composed of an alloy of tin and zinc and contacted with each other through a mixture containing a solder comprising tin and zinc and a flux, while heating the metallic members to melt the solder. Then the molten solder is solidified to join the metallic members. Here, the ratio of zinc in the undercoat is represented by x (% by weight), the ratio of zinc in the solder is represented by y (% by weight), and the ratio, x, and the ratio, y, are values within an area enclosed by the line A or B in FIG. 1, which satisfies the formulas: 1≦x≦20, 3≦y≦13 and 3≦(x+y)/2≦13, or formulas: 0.1≦x≦25, 2≦y≦15 and 2≦(x+y)/2≦15.
摘要翻译：公开了将金属构件连接在一起的方法。金属构件涂覆有由锡和锌的合金构成的底涂层，并通过包含锡和锌的焊料和助熔剂的混合物彼此接触，同时加热金属构件以熔化焊料。然后将熔融的焊料固化，以将金属构件接合。这里，底涂层中的锌的比例由x（重量％）表示，焊料中的锌的比例由y（重量％）表示，x的比例和y的比例为y 在由图1中的线A或B包围的区域内。 1，其满足以下公式：1 <= x <= 20,3 <= y <= 13和3 <=（x + y）/ 2 <= 13或式：0.1 <= x <= 25,2 = y <= 15和2 <=（x + y）/ 2 <= 15。

4. 发明授权

US06673310B2 Solder material, device using the same and manufacturing process thereof 失效
标题翻译：焊料，使用该材料的装置及其制造方法
公开(公告)号：US06673310B2
公开(公告)日：2004-01-06
申请号：US09749606
申请日：2000-12-28
申请人： Masahiro Tadauchi , Izuru Komatsu , Hiroshi Tateishi , Kouichi Teshima , Kazutaka Matsumoto , Tetsuji Hori
发明人： Masahiro Tadauchi , Izuru Komatsu , Hiroshi Tateishi , Kouichi Teshima , Kazutaka Matsumoto , Tetsuji Hori
IPC分类号： C22C1300
CPC分类号： B23K35/282 , B23K35/0222 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/28 , B23K35/30 , B23K35/3006 , B23K35/36 , B23K2101/36 , H01L24/97 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83193 , H01L2224/97 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H05K3/3463 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.
摘要翻译：公开了由锡，锌和银组成的高温焊料材料，或0.01至2重量％的锗或铝，余量为锡，或锡和锌的比例为80/20至70/30。锡/锌/银焊料的组成比为：直到锌的比例在97/3〜79/21的范围内，锡和锌与银的和的比例在 88/12〜50/50，或锡与锌的比例在70/30〜5/95的范围内，银与锡，锌和银之和的比率为15％以下。焊料用于生产电气或电子设备和设备。

5. 发明授权

US06386426B1 Solder material and method of manufacturing solder material 有权
标题翻译：焊料材料及其制造方法
公开(公告)号：US06386426B1
公开(公告)日：2002-05-14
申请号：US09655344
申请日：2000-09-05
申请人： Masahiro Tadauchi , Kouichi Teshima , Izuru Komatsu , Mitsuhiro Tomita
发明人： Masahiro Tadauchi , Kouichi Teshima , Izuru Komatsu , Mitsuhiro Tomita
IPC分类号： B23K3102
CPC分类号： H05K3/3463 , B23K35/0227 , B23K35/0238 , B23K35/0244 , B23K35/262 , B23K35/282 , Y10T29/302
摘要： Disclosed is a solder material and a manufacturing method thereof. The solder material has a first layer composed of a first metallic material and a second layer composed of a second metallic material which is different from the first metallic material, the first layer being formed in an elongated shape having axiality, and the second layer covering the first layer to surround the axis of the first layer. The solder material is in a form of a wire, a granule, a sheet, a tape or a planar fragment. The manufacturing method includes: covering a first metallic material with a second metallic material which is different from the first metallic material to prepare a covered body; and rolling the covered body to prepare a solder material comprising a first layer formed of the first metallic material in an elongated shape having axiality and a second layer covering the first layer to surround an axis of the first layer. The solder material may be cut to granulate the solder material, and the second layer can be deformed during or after cutting.
摘要翻译：公开了一种焊料及其制造方法。焊料材料具有由第一金属材料构成的第一层和由与第一金属材料不同的第二金属材料构成的第二层，第一层形成为具有轴向的细长形状，第二层覆盖第一层围绕第一层的轴线。焊料材料为线材，颗粒，片材，带子或平面片段的形式。该制造方法包括：用与第一金属材料不同的第二金属材料覆盖第一金属材料以制备覆盖体; 并轧制被覆盖体以制备包括由具有轴向的细长形状的由第一金属材料形成的第一层的焊料材料和覆盖第一层以包围第一层的轴线的第二层。可以将焊料材料切割以使焊料材料成粒，并且第二层可在切割期间或切割后变形。

6. 发明授权

US06186390B1 Solder material and method of manufacturing solder material 有权
标题翻译：焊料材料及其制造方法
公开(公告)号：US06186390B1
公开(公告)日：2001-02-13
申请号：US09220343
申请日：1998-12-24
申请人： Masahiro Tadauchi , Kouichi Teshima , Izuru Komatsu , Mitsuhiro Tomita
发明人： Masahiro Tadauchi , Kouichi Teshima , Izuru Komatsu , Mitsuhiro Tomita
IPC分类号： B23K3514
CPC分类号： H05K3/3463 , B23K35/0227 , B23K35/0238 , B23K35/0244 , B23K35/262 , B23K35/282 , Y10T29/302
摘要： Disclosed is a solder material and a manufacturing method thereof. The solder material has a first layer composed of a first metallic material and a second layer composed of a second metallic material which is different from the first metallic material, the first layer being formed in an elongated shape having axiality, and the second layer covering the first layer to surround the axis of the first layer. The solder material is in a form of a wire, a granule, a sheet, a tape or a planar fragment. The manufacturing method includes: covering a first metallic material with a second metallic material which is different from the first metallic material to prepare a covered body; and rolling the covered body to prepare a solder material comprising a first layer formed of the first metallic material in an elongated shape having axiality and a second layer covering the first layer to surround an axis of the first layer. The solder material may be cut to granulate the solder material, and the second layer can be deformed during or after cutting.
摘要翻译：公开了一种焊料及其制造方法。焊料材料具有由第一金属材料构成的第一层和由与第一金属材料不同的第二金属材料构成的第二层，第一层形成为具有轴向的细长形状，第二层覆盖第一层围绕第一层的轴线。焊料材料为线材，颗粒，片材，带子或平面片段的形式。该制造方法包括：用与第一金属材料不同的第二金属材料覆盖第一金属材料以制备覆盖体; 并轧制被覆盖体以制备包括由具有轴向的细长形状的由第一金属材料形成的第一层的焊料材料和覆盖第一层以包围第一层的轴线的第二层。可以将焊料材料切割以使焊料材料成粒，并且第二层可在切割期间或切割后变形。

7. 发明申请

US20060067853A1 Lead free solder 审中-公开
标题翻译：无铅焊料
公开(公告)号：US20060067853A1
公开(公告)日：2006-03-30
申请号：US11222808
申请日：2005-09-12
申请人： Toshihide Takahashi , Kazutaka Matsumoto , Izuru Komatsu , Masahiro Tadauchi , Yoshiyuki Fukuda
发明人： Toshihide Takahashi , Kazutaka Matsumoto , Izuru Komatsu , Masahiro Tadauchi , Yoshiyuki Fukuda
IPC分类号： C22C13/00
CPC分类号： B23K35/262
摘要： A lead-free solder comprises tin and zinc at a weight ratio between tin and zinc ranging from about 88:12 to about 80:20 on the basis of total weight of the lead-free solder.
摘要翻译：基于无铅焊料的总重量，无铅焊料包含锡和锌之间的锡和锌的重量比约为88:12至约80:20。

8. 发明申请

US20070221712A1 THERMOSETTING FLUX AND SOLDER PASTE 失效
标题翻译：热熔胶和焊膏
公开(公告)号：US20070221712A1
公开(公告)日：2007-09-27
申请号：US11756714
申请日：2007-06-01
申请人： Kazutaka MATSUMOTO , Masahiro Tadauchi , Izuru Komatsu
发明人： Kazutaka MATSUMOTO , Masahiro Tadauchi , Izuru Komatsu
IPC分类号： B23K31/00
CPC分类号： H05K3/3484 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , B23K2101/40 , H05K3/3489 , H05K2201/10977
摘要： The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.
摘要翻译：本发明的目的是提供一种适用于半导体元件和电子部件的焊接的热固性焊剂，并且可以在高温下具有高接合强度和高耐热强度的焊接，并且含有焊剂和非焊接材料，铅类焊膏，相对于热固化性助焊剂，环氧树脂，硬化剂，以及具有官能团的至少一种具有在环氧树脂上反应并且选自马来酸改性松香，富马酸改性松香，和丙烯酸改性松香。焊剂可以以焊膏的形式使用，同时与非铅型焊料合金粉末混合和捏合。

9. 发明申请

US20060081995A1 Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device 审中-公开
标题翻译：焊接材料，半导体器件，焊接方法以及制造半导体器件的方法
公开(公告)号：US20060081995A1
公开(公告)日：2006-04-20
申请号：US11176422
申请日：2005-07-08
申请人： Toshihide Takahashi , Shuichi Komatsu , Masahiro Tadauchi , Kazutaka Matsumoto , Izuru Komatsu
发明人： Toshihide Takahashi , Shuichi Komatsu , Masahiro Tadauchi , Kazutaka Matsumoto , Izuru Komatsu
IPC分类号： H01L23/48
CPC分类号： H01L23/488 , H01L23/4827 , H01L23/49562 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/04026 , H01L2224/04042 , H01L2224/29111 , H01L2224/32245 , H01L2224/32507 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83439 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/1301 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3651 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A soldered material according to an aspect of the present invention comprises a first metallic material to be soldered, a second metallic material to be soldered which is composed of at least one element selected from the group consisting of nickel, palladium, platinum and aluminum, and a soldering layer soldering the first metallic material and the second metallic material, and in a cross-sectional microstructure of the soldering layer a solid solution phase comprising the element constituting the second metallic material and tin is present.
摘要翻译：根据本发明的一个方面的焊接材料包括待焊接的第一金属材料，由至少一种选自镍，钯，铂和铝的元素组成的待焊接的第二金属材料，以及焊接第一金属材料和第二金属材料的焊接层，并且在焊接层的横截面微结构中存在包含构成第二金属材料的元素和锡的固溶体相。

10. 发明申请

US20050056687A1 Thermosetting flux and solder paste 审中-公开
标题翻译：热固性助焊剂和焊膏
公开(公告)号：US20050056687A1
公开(公告)日：2005-03-17
申请号：US10913370
申请日：2004-08-09
申请人： Kazutaka Matsumoto , Masahiro Tadauchi , Izuru Komatsu
发明人： Kazutaka Matsumoto , Masahiro Tadauchi , Izuru Komatsu
IPC分类号： B23K35/363 , B23K35/02 , B23K35/22 , B23K35/26 , B23K35/36 , C08G59/42 , H05K3/34 , B23K31/00
CPC分类号： H05K3/3484 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , B23K2101/40 , H05K3/3489 , H05K2201/10977
摘要： The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.
摘要翻译：本发明的目的是提供一种适用于半导体元件和电子部件的焊接的热固性焊剂，并且可以在高温下具有高接合强度和高耐热强度的焊接，并且含有焊剂和非焊接材料，铅类焊膏，相对于热固化性助焊剂，环氧树脂，硬化剂，以及具有官能团的至少一种具有在环氧树脂上反应并且选自马来酸改性松香，富马酸改性松香，和丙烯酸改性松香。焊剂可以以焊膏的形式使用，同时与非铅型焊料合金粉末混合和捏合。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式