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    • 3. 发明授权
    • IC substrate of glass and display device
    • 玻璃和显示装置的IC基板
    • US07072018B2
    • 2006-07-04
    • US10156972
    • 2002-05-29
    • Kuni YamamuraRyoichi YokoyamaYasushi MiyajimaKoji Hirosawa
    • Kuni YamamuraRyoichi YokoyamaYasushi MiyajimaKoji Hirosawa
    • G02F1/1345G02F1/1333
    • G02F1/13454G02F1/13452G02F2203/01
    • Disclosed is an IC chip using a glass substrate capable of being manufactured at a lower cost than the IC chip using from a semiconductor wafer. Further, where the body substrate of a display device is made of glass, the IC chip and the body substrate can have equal coefficients of thermal expansion, thus preventing the IC chips from peeling off and reducing the failure rate. Furthermore, the gate line driving IC applied to a display device can be arranged as an IC chip having a length approximately equal to the display area, therefore, mounting a plurality of IC chips as the gate driving IC is not required, thereby reducing the production cost. Still further, all gate lines can be extended in parallel from the IC chip so that no difference in the delay occurs among the gate lines and the size of frame of display device can reduced.
    • 公开了一种使用玻璃基板的IC芯片,其能够以比半导体晶片使用的IC芯片低的成本制造。 此外,在显示装置的主体基板由玻璃制成的情况下,IC芯片和主体基板能够具有相同的热膨胀系数,从而防止IC芯片剥离,降低故障率。 此外,施加到显示装置的栅极线驱动IC可以被布置为具有大致等于显示区域的长度的IC芯片,因此,不需要安装多个IC芯片作为栅极驱动IC,从而减少生产 成本。 此外,所有栅极线可以从IC芯片并行扩展,使得栅极线之间不产生延迟差异,并且可以减小显示器件的框架尺寸。