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    • 1. 发明授权
    • Ink bag for ink jet type recording apparatus and package suitable for packing such ink bag
    • 用于喷墨式记录装置的墨水袋和适于包装这种墨水袋的包装
    • US06220702B1
    • 2001-04-24
    • US09471335
    • 1999-12-23
    • Masahiro NakamuraTakeshi KobayashiMasanori KamijyoTadatoshi HonzawaMichinari Tsukahara
    • Masahiro NakamuraTakeshi KobayashiMasanori KamijyoTadatoshi HonzawaMichinari Tsukahara
    • B41J2175
    • B41J2/17503B41J2/17513
    • The ink bag is structured as follows: To the respective long side portions (1a, 1b, 2a, 2b) of a rectangular-shaped, thermally fusible first film forming the surface portions (1, 2) of the ink bag, there are attached, by thermal fusion, the long side portions of a rectangular-shaped, thermally fusible second film forming the side surface portions (3, 4) of the ink bag and having lower rigidity than the first film to thereby form a cylindrical body. The one-side short side portions (1c, 2c) of the surface portions of the ink bag are attached together by thermal fusion to form a bag body. An ink supply hole forming member (5) is attached by thermal fusion to the other-side short side portions of the surface portions of the ink bag. In the four corners of the ink bag, there are formed band-shaped connecting portions (6 to 9) each starting from one of the two mutually adjoining sides of the ink bag and reaching the other of the two sides.
    • 油墨袋的结构如下:形成形成墨水袋的表面部分(1,2)的矩形的,热熔融的第一薄膜的各个长边部分(1a,1b,2a,2b)附着 通过热熔接,形成形成墨袋的侧表面部分(3,4)的矩形的热熔第二膜的长边部分,并且具有比第一膜低的刚性,从而形成圆柱体。 油墨袋的表面部分的一侧短边部分(1c,2c)通过热熔粘合在一起形成袋体。 供墨孔形成构件(5)通过热熔融附接到墨袋的表面部分的另一侧短边部分。 在墨水袋的四个角部,形成有从油墨袋的两个相邻侧之一开始并到达两侧的另一侧的带状连接部(6〜9)。
    • 6. 发明授权
    • Mechanical pencil
    • 自动铅笔
    • US08337107B2
    • 2012-12-25
    • US12866943
    • 2008-12-18
    • Norio OhsawaTakeo FukumotoYoshitoshi OsanoTakeshi KobayashiHirotake IzawaKyo Nakayama
    • Norio OhsawaTakeo FukumotoYoshitoshi OsanoTakeshi KobayashiHirotake IzawaKyo Nakayama
    • B43K21/22
    • B43K21/003B43K21/16B43K21/22
    • A writing lead (10) is grasped and released by reciprocation of a chuck (3) provided in a body cylinder (1) so as to inch the writing lead forward and a rotational drive mechanism is provided for rotationally driving a rotor (5) in one direction in conjunction with retreat operation by the writing pressure applied to the writing lead and forward movement by releasing the writing pressure. A pipe support member (8) for supporting a pipe end (7) is accommodated in a base (1A) which constitutes a front end portion of the body cylinder, and a retreat drive mechanism is provided for gradually retreating the pipe support member into the body cylinder in conjunction with rotational drive operation of the rotor. With the above-mentioned structure, a pipe-slide type mechanical pencil can maintain an amount of projection of the writing lead from the pipe end within a certain range.
    • 一个写入引线(10)通过设置在主体滚筒(1)中的卡盘(3)的往复运动而被夹紧和释放,以便使书写引线向前平齐,并且提供一个旋转驱动机构用于旋转地驱动转子 通过施加到书写笔的书写压力和撤销操作的一个方向,通过释放书写压力来向前移动。 用于支撑管端(7)的管支撑构件(8)容纳在构成主体筒体的前端部的基部(1A)中,并且设置有后退驱动机构,用于逐渐将管支撑构件缩回到 结合转子的旋转驱动操作。 利用上述结构,管滑动型自动铅笔可以将写入线从管端的突出量保持在一定范围内。
    • 9. 发明授权
    • Vertical heat treatment boat and heat treatment method for semiconductor wafer
    • 半导体晶圆立式热处理船和热处理方法
    • US08003918B2
    • 2011-08-23
    • US12449629
    • 2008-02-28
    • Takeshi Kobayashi
    • Takeshi Kobayashi
    • F27D11/00A21B2/00
    • H01L21/67309
    • The present invention provides a vertical heat treatment boat that has at least four or more support portions per processing target substrate to be supported, the support portions horizontally supporting the processing target substrate, support auxiliary members on which the processing target substrate is mounted being detachably attached to the four or more support portions, respectively, wherein flatness obtained from all surfaces of the respective support auxiliary members on which the processing target substrate is mounted is adjusted by adjusting thicknesses of the support auxiliary members or interposing spacers between the support portions and the support auxiliary members in accordance with respective shapes of the four or more support portions. As a result, it is provided the vertical heat treatment boat and a heat treatment method for a semiconductor wafer that can readily improve flatness in support of the processing target substrate and effectively prevent occurrence of slip dislocation when performing a heat treatment to the processing target substrate such as a semiconductor wafer by using a vertical heat treatment furnace.
    • 本发明提供一种垂直热处理舟,每个加工对象基板的支撑部至少具有四个以上的支撑部,支撑部水平地支撑处理对象基板,支撑辅助部件,其上安装有处理对象基板,可拆卸地安装 分别与四个或更多个支撑部分相对应,其中通过调节在支撑部分和支撑件之间的支撑辅助构件或插入间隔件的厚度来调节从其上安装有处理目标基板的各个支撑辅助构件的所有表面获得的平坦度 辅助构件根据四个或更多个支撑部分的相应形状。 结果,提供了一种用于半导体晶片的垂直热处理舟和热处理方法,其能够容易地提高对处理对象基板的支撑的平坦性,并且能够有效地防止在对处理对象基板进行热处理时发生滑移位错 例如通过使用立式热处理炉的半导体晶片。