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1. 发明申请

US20080304934A1 BOOKBINDING APPARATUS AND BOOKBINDING SYSTEM 有权
标题翻译：书写装置和书本系统
公开(公告)号：US20080304934A1
公开(公告)日：2008-12-11
申请号：US11861023
申请日：2007-09-25
申请人： Masahiro KANEKO
发明人： Masahiro KANEKO
IPC分类号： B42C13/00
CPC分类号： B42C9/0018 , B42C9/0025 , G03G15/6544
摘要： A bookbinding apparatus which forms a sheet bundle by aligning a plurality of sheets fed from an image forming apparatus and prepares a booklet by applying adhesive on a spine of the sheet bundle, the bookbinding apparatus includes: a storage member for storing the adhesive; a rotating member for rotating in contact with the adhesive in the storage member; a heater for melting the adhesive in the storage member and for heating the adhesive so as to reach a preset temperature; and a control device for controlling the preset temperature, at a termination of the bookbinding job, to switch from a first preset temperature for a time of bookbinding to a second preset temperature which is below the first preset temperature and equal to or above a melting point of the adhesive.
摘要翻译：一种装订装置，其通过对准从图像形成装置供给的多张片材来形成片材束，并通过在片材摞的脊柱上施加粘合剂来制备小册子，该装订装置包括：用于存储粘合剂的存储构件; 旋转构件，用于与存储构件中的粘合剂接触旋转; 用于熔化存储构件中的粘合剂并用于加热粘合剂以使其达到预设温度的加热器; 以及控制装置，用于在装订作业终止时控制预设温度，以便在装订时间内从第一预设温度切换到低于第一预设温度并等于或高于熔点的第二预设温度的粘合剂。

2. 发明申请

US20080267734A1 BOOKBINDING APPARATUS AND IMAGE FORMING SYSTEM 审中-公开
标题翻译： BOOKBINDING设备和图像形成系统
公开(公告)号：US20080267734A1
公开(公告)日：2008-10-30
申请号：US12047559
申请日：2008-03-13
申请人： Masahiro KANEKO
发明人： Masahiro KANEKO
IPC分类号： B42C13/00
CPC分类号： B42C9/0012
摘要： A bookbinding apparatus having: a coating device for coating adhesive onto a spine of a sheet bundle; a first moving device which moves the coating device along the spine of the sheet bundle; a second moving device which moves the coating device in a substantially perpendicular direction to a surface of the spine; and a control device, wherein the control device controls the first moving device to move the coating device along the spine from near a one corner of the spine of the sheet bundle toward another corner until the coating device reaches to near the another corner of the spine of the sheet bundle, then controls the second moving device to separate the coating device away from the spine of the sheet bundle and keeps the coating device for a predetermined duration after separating
摘要翻译：一种装订装置，具有：将粘合剂涂布在片材束的脊上的涂布装置; 沿着所述片材束的脊部移动所述涂覆装置的第一移动装置; 第二移动装置，其使涂覆装置沿大致垂直于脊柱表面的方向移动; 以及控制装置，其中所述控制装置控制所述第一移动装置沿着所述脊柱从所述片材束的脊的附近的角部向另一角移动所述涂覆装置，直到所述涂覆装置到达所述脊柱的另一个角部附近的片材束，然后控制第二移动装置将涂覆装置分离离开片材束的脊部，并在分离之后将涂覆装置保持预定的持续时间

3. 发明申请

US20110067913A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20110067913A1
公开(公告)日：2011-03-24
申请号：US12770820
申请日：2010-04-30
申请人： Masahiro KANEKO , Daiki Komatsu , Satoru Kose , Hirokazu Higashi
发明人： Masahiro KANEKO , Daiki Komatsu , Satoru Kose , Hirokazu Higashi
IPC分类号： H05K1/11 , H01K3/10
CPC分类号： H05K3/421 , H01L21/486 , H01L21/563 , H01L21/6835 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2221/68345 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48165 , H01L2224/48227 , H01L2224/48235 , H01L2224/484 , H01L2224/48599 , H01L2224/4911 , H01L2224/73203 , H01L2224/73265 , H01L2224/83385 , H01L2224/85385 , H01L2225/06506 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/078 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/113 , H05K3/007 , H05K3/284 , H05K3/328 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09563 , H05K2203/016 , H05K2203/0361 , H05K2203/049 , H05K2203/1316 , Y10T29/49165 , H01L2924/00012 , H01L2924/00011 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer.
摘要翻译：印刷电路板包括具有第一表面，第一表面相对侧的第二表面和通孔导体的穿透孔的层间树脂绝缘层，形成在层间树脂绝缘层的第一表面上的导电电路，形成在所述贯通孔中并连接到所述层间树脂绝缘层的第一表面上的导电电路的通孔导体，以及形成在所述通孔导体的从所述层间树脂绝缘体的第二表面露出的表面上的表面处理涂层穿透穿孔。通孔导体由形成在穿透孔的侧壁上的第一导电层和填充穿透孔的电镀金属制成。通孔导体的表面从层间树脂绝缘层的第二表面凹入。

4. 发明申请

US20090081002A1 BOOKBINDING APPARATUS AND BOOKBINDING SYSTEM 有权
标题翻译：书写装置和书本系统
公开(公告)号：US20090081002A1
公开(公告)日：2009-03-26
申请号：US12042703
申请日：2008-03-05
申请人： Masahiro KANEKO
发明人： Masahiro KANEKO
IPC分类号： B42C9/00
CPC分类号： B42C9/0018 , G03G15/6544 , G03G2215/00936
摘要： To form a consistent non-application area at an end of a spine of a sheet bundle by adjusting either an application start timing or application termination timing of adhesive through an application device.
摘要翻译：通过调整粘合剂的应用程序开始时间或应用程序终止时间，通过应用程序设备，在纸张捆的脊柱的末端形成一致的非应用区域。

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