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1. 发明申请

US20090292121A1 Cyanopyridine derivative and use thereof as medicine 有权
标题翻译：氰基吡啶衍生物及其作为药物的用途
公开(公告)号：US20090292121A1
公开(公告)日：2009-11-26
申请号：US11919173
申请日：2006-04-28
申请人： Masahiko Morioka , Hiroshi Ikegami , Makoto Sakiyama , Masayuki Hayashi , Shinsuke Ooike , Yasuhiro Fujino , Daisuke Abe , Hideo Tomozane
发明人： Masahiko Morioka , Hiroshi Ikegami , Makoto Sakiyama , Masayuki Hayashi , Shinsuke Ooike , Yasuhiro Fujino , Daisuke Abe , Hideo Tomozane
IPC分类号： C07D401/14 , C07D413/14 , C07D401/12 , C07D409/14
CPC分类号： C07D401/14 , C07D401/12 , C07D409/14
摘要： A therapeutic drug for cancer containing a substance selected from the group consisting of a novel cyanopyridine derivative, a pharmaceutically acceptable salt, a hydrate, a water adduct and a solvate as an active ingredient can be provided.
摘要翻译：可以提供含有选自新颖的氰基吡啶衍生物，药学上可接受的盐，水合物，水加合物和溶剂合物作为活性成分的物质的癌症治疗药物。

2. 发明授权

US07928126B2 Cyanopyridine derivative and use thereof as medicine 有权
标题翻译：氰基吡啶衍生物及其作为药物的用途
公开(公告)号：US07928126B2
公开(公告)日：2011-04-19
申请号：US11919173
申请日：2006-04-28
申请人： Masahiko Morioka , Hiroshi Ikegami , Makoto Sakiyama , Masayuki Hayashi , Shinsuke Ooike , Yasuhiro Fujino , Daisuke Abe , Hideo Tomozane
发明人： Masahiko Morioka , Hiroshi Ikegami , Makoto Sakiyama , Masayuki Hayashi , Shinsuke Ooike , Yasuhiro Fujino , Daisuke Abe , Hideo Tomozane
IPC分类号： A61K31/4439 , C07D401/14
CPC分类号： C07D401/14 , C07D401/12 , C07D409/14
摘要： A therapeutic drug for cancer containing a substance selected from the group consisting of a novel cyanopyridine derivative, a pharmaceutically acceptable salt, a hydrate, a water adduct and a solvate as an active ingredient can be provided.
摘要翻译：可以提供含有选自新颖的氰基吡啶衍生物，药学上可接受的盐，水合物，水加合物和溶剂合物作为活性成分的物质的癌症治疗药物。

3. 发明授权

US09751269B2 Device and method for forming sheet-like rubber 有权
公开(公告)号：US09751269B2
公开(公告)日：2017-09-05
申请号：US14001973
申请日：2012-03-02
申请人： Takashi Kitamura , Hiroshi Ikegami
发明人： Takashi Kitamura , Hiroshi Ikegami
IPC分类号： B29C47/00 , B29D30/00 , B29C47/08 , B29C47/16 , B29C47/36 , B29C47/92 , B29C47/38 , B29D30/30 , B29K21/00
CPC分类号： B29D30/0061 , B29C47/0021 , B29C47/0813 , B29C47/16 , B29C47/165 , B29C47/364 , B29C47/38 , B29C47/92 , B29C2947/92628 , B29C2947/92885 , B29C2947/92904 , B29D30/3007 , B29D30/62 , B29D2030/3078 , B29K2021/00
摘要： The sheet-like rubber forming device has a die body which has an opening having a predetermined cross sectional shape, and a variable die lip which is arranged in a front side of the die body and can change the height of the opening. The variable die lip is constructed by a first movable body and a second movable body. The die lip control unit controls the variable die lip so as to drive the first movable body in an opening direction from a state in which the first movable body and the second movable body are closed when the forming is started, hold the positions of the first movable body and the second movable body after reaching a predetermined height, and drive the second movable body in a closing direction when the forming is finished.

4. 发明申请

US20110071291A1 HYDRAZIDE COMPOUND AND PESTICIDAL USE OF THE SAME 失效
标题翻译：盐酸化合物及其杀虫剂使用
公开(公告)号：US20110071291A1
公开(公告)日：2011-03-24
申请号：US12950535
申请日：2010-11-19
申请人： Hiroshi Ikegami , Markus Jachmann , Yoshihiko Nokura , Chiemi Iwata
发明人： Hiroshi Ikegami , Markus Jachmann , Yoshihiko Nokura , Chiemi Iwata
IPC分类号： C07D403/04 , C07D401/04 , C07D207/34 , C07D231/14 , C07D401/14
CPC分类号： C07D231/14 , C07D207/34 , C07D401/04 , C07D403/04
摘要： A hydrazide compound represented by the formula (1): (wherein R1, R2, R3, R4, A1, A2, J, Q and n are defined in the specification) has excellent pesticidal activity.
摘要翻译：由式（1）表示的酰肼化合物：其中R1，R2，R3，R4，A1，A2，J，Q和n在本说明书中定义）具有优良的杀虫活性。

5. 发明授权

US07867949B2 Hydrazide compound and pesticidal use of the same 有权
标题翻译：酰肼化合物和杀虫剂使用相同
公开(公告)号：US07867949B2
公开(公告)日：2011-01-11
申请号：US11992490
申请日：2006-10-10
申请人： Hiroshi Ikegami , Markus Jachmann , Yoshihiko Nokura , Chiemi Iwata
发明人： Hiroshi Ikegami , Markus Jachmann , Yoshihiko Nokura , Chiemi Iwata
IPC分类号： A01N43/40 , A01N43/56 , A61K31/5355 , C07D265/14 , C07D401/00 , C07D231/10
CPC分类号： C07D231/14 , C07D207/34 , C07D401/04 , C07D403/04
摘要： A hydrazide compound represented by the formula (1): has excellent pesticidal activity.
摘要翻译：由式（1）表示的酰肼化合物：具有优良的杀虫活性。

6. 发明授权

US07211545B2 Imidazo[1,2-a]pyrimidine and fungicidal compositions containing thereof 失效
标题翻译：咪唑并[1,2-a]嘧啶和含有它们的杀真菌组合物
公开(公告)号：US07211545B2
公开(公告)日：2007-05-01
申请号：US10488273
申请日：2002-08-29
申请人： Hiroshi Ikegami
发明人： Hiroshi Ikegami
IPC分类号： C07D487/04 , C07D413/04 , C07D417/04 , A01N43/72 , A01N43/84 , A01N43/90
CPC分类号： C07D487/04 , A01N43/90
摘要： The imidazo[1,2-a]pyrimidines given by the following formula [I]: [wherein R1 and R2 represent a C1–C6 alkyl group optionally substituted by one or more selected from the group consisting of C1–C4 alkoxy group, C2–C8 dialkylamino group, C1–C4 alkylthio group, C2–C5 alkoxycarbonyl group, cyano group and halogen atoms; or R1 and R2 represent a 3–8 membered heterocyclic group together with the nitrogen atom bonded with R1 and R2; R3 represents a halogen atom or C1–C4 alkyl group; and Ar represents a phenyl group optionally substituted by a halogen atom or atoms; and the like] have excellent activity for controlling plant diseases.
摘要翻译：由下式[I]给出的咪唑并[1,2-a]嘧啶：其中R 1和R 2表示任选被选自C1-C4烷氧基，C2-C8二烷基氨基，C1-C4烷硫基，C2-C5烷氧基羰基，氰基和卤素原子的一个或多个; 或R 1和R 2代表3-8元杂环基以及与R 1和R 2结合的氮原子 ; R 3表示卤素原子或C 1 -C 4烷基; 且Ar表示任选被卤原子或原子取代的苯基; 等]具有优异的防治植物病害的活性。

7. 发明申请

US20060237112A1 PNEUMATIC TIRE AND PRODUCING METHOD OF PNEUMATIC TIRE 有权
标题翻译：气动轮胎和气动轮胎的生产方法
公开(公告)号：US20060237112A1
公开(公告)日：2006-10-26
申请号：US11379746
申请日：2006-04-21
申请人： Kazuma Nishitani , Shigeru Ohno , Hiroshi Ikegami , Koji Hiramatsu , Katsuhiro Nakatani
发明人： Kazuma Nishitani , Shigeru Ohno , Hiroshi Ikegami , Koji Hiramatsu , Katsuhiro Nakatani
IPC分类号： B60C13/00 , B29D30/72
CPC分类号： B60C13/00 , B29D30/30 , B29D30/72 , B60C2013/045
摘要： A sidewall rubber disposed outside of a carcass layer, reinforcing a portion between beads, in a widthwise direction of the tire is configured from a wide rubber ribbon having a width of 20 to 100 mm wound spirally along a circumferential direction of the tire outward of the tire such that the rubber ribbon is deviated radially outward of the tire.
摘要翻译：在轮胎宽度方向上设置在胎体层外侧的侧壁橡胶，其沿着轮胎的宽度方向加强胎圈之间的部分，由宽度为20〜100mm的宽度的橡胶带构成，沿着轮胎的周向螺旋地卷绕，轮胎使得橡胶带径向向外偏离轮胎。

8. 发明授权

US07061070B2 Semiconductor device with fuse arrangement 失效
标题翻译：具有保险丝布置的半导体器件
公开(公告)号：US07061070B2
公开(公告)日：2006-06-13
申请号：US10165982
申请日：2002-06-11
申请人： Hiroshi Ikegami
发明人： Hiroshi Ikegami
IPC分类号： H01L29/00
CPC分类号： H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device is disclosed, which comprises a semiconductor substrate, an interlayer insulation film formed above the semiconductor substrate, a fuse formed on or in the interlayer insulation film, and a wiring layer formed in a portion of the interlayer insulation film, which is under the fuse, the wiring layer being isolated from the fuse and having a width smaller than the fuse.
摘要翻译：公开了一种半导体器件，其包括半导体衬底，形成在半导体衬底上方的层间绝缘膜，形成在层间绝缘膜上或其中的熔丝，以及形成在层间绝缘膜的一部分中的布线层，保险丝，布线层与保险丝隔离并且具有小于保险丝的宽度。

9. 发明授权

US06659510B1 Pipe-end-connecting joint 失效
标题翻译：管端连接接头
公开(公告)号：US06659510B1
公开(公告)日：2003-12-09
申请号：US09383982
申请日：1999-08-26
申请人： Hiroshi Ikegami , Yasuhiro Kikumori , Toshihiro Nakanishi , Susumu Okairi , Nobuo Shindo , Tatsuya Machino
发明人： Hiroshi Ikegami , Yasuhiro Kikumori , Toshihiro Nakanishi , Susumu Okairi , Nobuo Shindo , Tatsuya Machino
IPC分类号： F16L3300
CPC分类号： F16L33/23 , F16L21/005 , F16L25/0036 , Y10S285/903
摘要： A pipe-end-connecting joint comprisse a nipple 1 inserted in the pipe end, a holder 2 for tightening the outer circumference of the pipe end, and an elastic packing 3 divided into half parts and attached in the holder 2. The nipple 1 includes a tubular portion 11 provided in one longitudinal end side thereof so as to be inserted in the pipe end, a connection portion 12 provided in the other longitudinal end side thereof so as to be connected to another joint, and a flange portion 13 provided in a longitudinal intermediate portion thereof so as to protrude outward. The holder 2 is divided longitudinally into two split parts 2A and 2B so that each of the two split parts 2A and 2B has an semicircularly formed inner circumferential surface 21, and each of the two split parts 2A and 2B has one longitudinal end side in which one of the half parts of the elastic packing is mounted, and has the other longitudinal end side in which a ring-like groove 23 is formed so as to be fitted to the flange portion 13, and further has a longitudinally intermediate portion between the one and the other longitudinal end sides in which a spiral corrugated portion 22 is formed along the outer circumferential surface of the pipe P, the spiral corrugated portion 22 having a spiral protruding portion 24 an inner diameter of which is smaller than an outer diameter of a trough portion r of the pipe P, the two split parts 2A and 2B having holes for insertion of connection bolts.
摘要翻译：管端连接接头包括插入管端的接头1，用于紧固管端外周的保持器2和分成半部分并附接在保持器2中的弹性衬垫3。一个管状部分11，其设置在一个纵向端侧以插入管端;连接部分12，设置在另一个纵向端侧，以便连接到另一个接头;以及凸缘部分13，其纵向中间部分向外突出。保持器2纵向分成两个分割部分2A和2B，使得两个分割部分2A和2B中的每一个具有半圆形的内圆周表面21，并且两个分割部分2A和2B中的每一个分别具有一个纵向端侧，其中，安装弹性衬垫的一半部分，并且另一个纵向端侧形成有环形槽23，以便与凸缘部分13配合，并且还具有一个纵向中间部分以及沿着管P的外周面形成有螺旋波纹部22的另一纵向端侧，螺旋形波纹状部22具有内径小于槽P的外径的螺旋形突出部24 管P的部分r，两个分割部分2A和2B具有用于插入连接螺栓的孔。

10. 发明授权

US06376894B1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06376894B1
公开(公告)日：2002-04-23
申请号：US09525107
申请日：2000-03-14
申请人： Hiroshi Ikegami , Keiichi Sasaki , Nobuo Hayasaka
发明人： Hiroshi Ikegami , Keiichi Sasaki , Nobuo Hayasaka
IPC分类号： H01L2900
CPC分类号： H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： There is provided a semiconductor device in which redundancy fuses formed in an upper layer wiring region can be cut without damaging an underlying Si substrate or adjacent regions. The semiconductor device comprises a lower layer wiring formed within an interlayer insulating film on the Si substrate, and an upper layer metal wiring made of Al, Cu or the like, formed above the lower layer wiring and connected thereto through a via metal, wherein the redundancy fuses are formed in the same wiring layer as the upper layer metal wiring. For cutting a fuse by irradiating with a laser having a wavelength in a range of 1,000 to 1,100 nm and a beam diameter D (&mgr;m), the fuse may be designed to have a film thickness T (&mgr;m) and a width W (&mgr;m) which satisfy T≦(−0.15 (D+2&sgr;)+0.46) exp (2W), where &sgr; (&mgr;m) is an alignment accuracy of the center of the laser beam to the center of the fuse, with the result that the fuse formed in the same wiring layer as the upper layer metal wiring can be cut without damaging the Si substrate, an adjacent fuse and the upper layer metal wiring.
摘要翻译：提供了一种半导体器件，其中可以切割形成在上层布线区域中的冗余熔丝而不损坏下面的Si衬底或相邻区域。半导体器件包括形成在Si衬底上的层间绝缘膜内的下层布线和由Al，Cu等制成的上层金属布线，其形成在下层布线的上方并通过通孔金属连接，冗余熔丝形成在与上层金属布线相同的布线层中。为了通过用波长在1000至1100nm的波长和光束直径D（母体）的激光照射来切割熔丝，可以将熔丝设计成具有膜厚T（mum）和宽度W（mum）其满足T <=（ - 0.15（D + 2sigma）+0.46）exp（2W），其中σ（mum）是激光束的中心对熔丝的中心的对准精度，结果是熔丝形成在与上层金属布线相同的布线层中，不会损坏Si基板，相邻的熔丝和上层金属布线。

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