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    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    • 半导体器件及其制造方法
    • US20100084709A1
    • 2010-04-08
    • US11993862
    • 2006-06-30
    • Ryuta TsuchiyaShinichiro Kimura
    • Ryuta TsuchiyaShinichiro Kimura
    • H01L29/786H01L21/336H01L21/86
    • H01L27/12H01L21/823878H01L21/84H01L27/0922H01L27/1207
    • When a bulk silicon substrate and an SOI substrate are used separately, a board area is increased and so it is impossible to reduce the size of a semiconductor device as a whole. On the other hand, when an SOI-type MISFET and a bulk-type MISFET are formed on a same substrate, the SOI-type MISFET and the bulk-type MISFET should be formed in separate steps respectively, and thus the process gets complicated. A single crystal semiconductor substrate and an SOI substrate separated from the single crystal semiconductor substrate by a thin buried insulating film and having a thin single crystal semiconductor thin film (SOI layer) are used, and well diffusion layer regions, drain regions, gate insulating films and gate electrodes of the SOI-type MISFET and the bulk-type MISFET are formed in same steps. Since the bulk-type MISFET and the SOI-type MISFET can be formed on the same substrate, the board area can be reduced. A simple process can be realized by making manufacturing steps of the SOI-type MISFET and the bulk-type MISFET common.
    • 当单独使用体硅衬底和SOI衬底时,板面积增加,因此整体上不可能减小半导体器件的尺寸。 另一方面,当在同一衬底上形成SOI型MISFET和体型MISFET时,分别将SOI型MISFET和体型MISFET分别形成,因此工艺变得复杂。 使用通过薄埋入绝缘膜与单晶半导体衬底分离并具有薄单晶半导体薄膜(SOI层)的单晶半导体衬底和SOI衬底,以及良好扩散层区域,漏极区域,栅极绝缘膜 并且以相同的步骤形成SOI型MISFET和体型MISFET的栅电极。 由于可以在同一基板上形成体型MISFET和SOI型MISFET,所以可以减小电路板面积。 可以通过制造SOI型MISFET和体型MISFET的制造步骤来实现简单的工艺。