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    • 6. 发明授权
    • Method of joining Ni-base heat resisting alloys
    • 连接Ni基耐热合金的方法
    • US4681251A
    • 1987-07-21
    • US782163
    • 1985-10-02
    • Shuichi KomatsuKazumi ShimotoriHiromitsu TakedaMasako Nakahashi
    • Shuichi KomatsuKazumi ShimotoriHiromitsu TakedaMasako Nakahashi
    • B23K35/00B23K35/28B23K1/04B23K20/24
    • B23K35/004B23K35/286
    • There is disclosed a method of joining Ni-base heat-resisting alloys which comprises forming, under an inert atmosphere, an aluminum layer on at least surfaces to be joined of a constructional member which has been divided into a plural number of parts composed of a Ni-base heat-resisting alloy reinforced by a .gamma.' phase in Ni.sub.3 Al system, followed by heating the parts so that said aluminum is dispersed in said Ni-base heat-resisting alloys, the joining portion (joint) contains substantially no .beta.-NiAl phase and a .gamma.'-Ni.sub.3 Al phase is dispersed therein to join the parts. The joint provided by the method according to the present invention has been improved in its strength and corrosion resistance at a high temperature. Further, the method according to the present invention can be carried out with a high degree of freedom in supplying a joining filler metal.
    • 公开了一种接合Ni基耐热合金的方法,其包括在惰性气氛下在至少被划分成多个部分的结构部件的表面上形成铝层的铝层 Ni3Al体系中由γ'相增强的Ni基耐热合金,然后加热部件使得所述铝分散在所述Ni基耐热合金中,所述接合部分(接头)基本上不含β-NiAl 相和γ'-Ni3Al相分散在其中以连接部件。 通过根据本发明的方法提供的接头在高温下的强度和耐腐蚀性得到改善。 此外,根据本发明的方法可以在供给接合填充金属时具有高自由度地进行。
    • 7. 发明授权
    • Thin film capacitor
    • 薄膜电容器
    • US5889299A
    • 1999-03-30
    • US804394
    • 1997-02-21
    • Kazuhide AbeShuichi KomatsuMitsuaki IzuhaNoburu FukushimaKenya SanoTakashi Kawakubo
    • Kazuhide AbeShuichi KomatsuMitsuaki IzuhaNoburu FukushimaKenya SanoTakashi Kawakubo
    • H01L21/02H01L29/76
    • H01L28/55
    • A thin film capacitor including a first electrode having on its surface a (100) face of cubic system or a (001) face of tetragonal system, a dielectric thin film epitaxially grown on the first electrode and exhibiting a crystal structure which inherently belongs to a perovskite structure of cubic system, and a second electrode formed on the dielectric thin film. Further, the dielectric thin film meets the following relationship V/V.sub.0 .gtoreq.1.01 where a unit lattice volume of true perovskite crystal structure belonging to the cubic system (lattice constant a.sub.0) is represented by V.sub.0 =a.sub.0.sup.3, and a unit lattice volume (lattice constant a=b.noteq.c) which is strained toward a tetragonal system after the epitaxial growth is represented by V=a.sup.2 c, and also meets the following relationship c/a.gtoreq.1.01 where c/a represents a ratio between a lattice constant "c" in the direction thicknesswise of the film and a lattice constant "a" in the direction parallel with a plane of the film.
    • 一种薄膜电容器,包括在其表面上具有立方体系的(100)面或四方晶系的(001)面的第一电极,在第一电极上外延生长并呈现出固有地属于 立方体的钙钛矿结构,以及形成在电介质薄膜上的第二电极。 此外,电介质薄膜满足以下关系V / V0 / = 1.01,其中属于立方体系的真实钙钛矿晶体结构的单位晶格体积(晶格常数a0)由V0 = a03表示,单位晶格体积 晶格常数a = b NOTEQUAL c),其外延生长后由V = a2c表示为四方晶系,并满足以下关系c / a> / = 1.01其中c / a表示晶格常数 在膜的厚度方向上的“c”和与膜的平面平行的方向上的晶格常数“a”。