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1. 发明授权

US5940268A Heat sink and electronic device employing the same 失效
标题翻译：散热器和采用其的电子设备
公开(公告)号：US5940268A
公开(公告)日：1999-08-17
申请号：US831430
申请日：1997-04-01
申请人： Masaharu Miyahara , Yasushi Inoue , Kenji Suga
发明人： Masaharu Miyahara , Yasushi Inoue , Kenji Suga
IPC分类号： H05K7/20 , H01L23/467
CPC分类号： H01L23/467 , H01L2924/0002
摘要： A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.
摘要翻译：散热风扇电动机的散热器有效地在散热器上方有限空间的薄电子设备中提供冷却空气流。散热器通过将风扇，散热器基板的翅片和基板的侧壁定位成低于风扇驱动单元，从而能够进入散热器上方的空气进入。散热基板和散热片形成为仅在一个方向上排出空气。在散热基板的安装有风扇驱动单元的一侧设置盖，并且吸入空气以防止排出的空气被吸入。电子设备的结构位于散热器上的风扇驱动单元。因此，散热器可以安装在薄的电子设备上，同时改善散热元件的冷却。

2. 再颁专利

USRE40369E1 Heat sink and electronic device employing the same 有权
标题翻译：散热器和采用其的电子设备
公开(公告)号：USRE40369E1
公开(公告)日：2008-06-10
申请号：US10667336
申请日：2003-09-23
申请人： Masaharu Miyahara , Yasushi Inoue , Kenji Suga
发明人： Masaharu Miyahara , Yasushi Inoue , Kenji Suga
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.
摘要翻译：散热风扇电动机的散热器有效地在散热器上方有限空间的薄电子设备中提供冷却空气流。散热器通过将风扇，散热器基板的翅片和基板的侧壁定位成低于风扇驱动单元，从而能够进入散热器上方的空气进入。散热基板和散热片形成为仅在一个方向上排出空气。在散热基板的安装有风扇驱动单元的一侧设置盖，并且吸入空气以防止排出的空气被吸入。电子设备的结构位于散热器上的风扇驱动单元。因此，散热器可以安装在薄的电子设备上，同时改善散热元件的冷却。

3. 再颁专利

USRE38382E1 Heat sink and electronic device employing the same 有权
标题翻译：散热器和采用其的电子设备
公开(公告)号：USRE38382E1
公开(公告)日：2004-01-13
申请号：US09930437
申请日：2001-08-16
申请人： Masaharu Miyahara , Yasushi Inoue , Kenji Suga
发明人： Masaharu Miyahara , Yasushi Inoue , Kenji Suga
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.

4. 发明授权

US06315031B1 Heat sink apparatus, blower for use therein and electronic equipment using the same apparatus 失效
标题翻译：散热装置，使用的鼓风机和使用相同装置的电子设备
公开(公告)号：US06315031B1
公开(公告)日：2001-11-13
申请号：US08624990
申请日：1996-03-29
申请人： Masaharu Miyahara , Koji Mehara , Kenji Suga , Kazuya Shibasaki , Hiroshi Nakamura , Hironori Ito
发明人： Masaharu Miyahara , Koji Mehara , Kenji Suga , Kazuya Shibasaki , Hiroshi Nakamura , Hironori Ito
IPC分类号： H05K720
CPC分类号： H01L23/467 , G06F1/20 , G06F1/203 , H01L2224/48472 , H01L2224/73265
摘要： A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer frame. The outer frame of the fan is made of a highly thermally conductive material such as aluminum. A radiation board is fixed to or formed integrally with a lower surface of the outer frame. Heat generated from a heat generating device is conveyed through the radiation board to the outer frame. The blower is provided with radiation fins so that the heat conveyed to the outer frame is transferred to the radiation fins as well.
摘要翻译：提供一种用于有效地冷却个人计算机等的壳体中的发热部件的鼓风机，使用该鼓风机的散热装置和使用该散热装置的电子设备。鼓风机包括风扇和外框架。风扇的外框由铝等高导热性材料制成。辐射板固定到外框的下表面或与外框的下表面一体地形成。从发热装置产生的热量通过辐射板传送到外框架。鼓风机设置有辐射翅片，使得传送到外框架的热量也被传送到散热片。

5. 发明授权

US06702000B2 Heat sink apparatus, blower for use therein and electronic equipment using the same apparatus 有权
标题翻译：散热装置，使用的鼓风机和使用相同装置的电子设备
公开(公告)号：US06702000B2
公开(公告)日：2004-03-09
申请号：US09925508
申请日：2001-08-10
申请人： Masaharu Miyahara , Koji Mehara , Kenji Suga , Kazuya Shibasaki , Hiroshi Nakamura , Hironori Ito
发明人： Masaharu Miyahara , Koji Mehara , Kenji Suga , Kazuya Shibasaki , Hiroshi Nakamura , Hironori Ito
IPC分类号： H05K720
CPC分类号： H01L23/467 , G06F1/20 , G06F1/203 , H01L2224/48472 , H01L2224/73265
摘要： A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer frame. The outer frame of the fan is made of a highly thermally conductive material such as aluminum. A radiation board is fixed to or formed integrally with a lower surface of the outer frame. Heat generated from a heat generating device is conveyed through the radiation board to the outer frame. The blower is provided with radiation fins so that the heat conveyed to the outer frame is transferred to the radiation fins as well.
摘要翻译：提供一种用于有效地冷却个人计算机等的壳体中的发热部件的鼓风机，使用该鼓风机的散热装置和使用该散热装置的电子设备。鼓风机包括风扇和外框架。风扇的外框由铝等高导热性材料制成。辐射板固定到外框的下表面或与外框的下表面一体地形成。从发热装置产生的热量通过辐射板传送到外框架。鼓风机设置有辐射翅片，使得传送到外框架的热量也被传送到散热片。

6. 发明授权

US06172416B2 Heat sink unit for cooling a plurality of exothermic units, and electronic apparatus comprising the same 失效
标题翻译：用于冷却多个放热单元的散热单元，以及包括该放热单元的电子设备
公开(公告)号：US06172416B2
公开(公告)日：2001-01-09
申请号：US09019054
申请日：1998-02-05
申请人： Masaharu Miyahara , Kenji Suga , Hisao Tada , Sumio Tate , Kazuhiko Sugimoto
发明人： Masaharu Miyahara , Kenji Suga , Hisao Tada , Sumio Tate , Kazuhiko Sugimoto
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L23/552 , H01L2924/0002 , H01L2924/00
摘要： It is intended to provide a heat sink unit and an electronic apparatus capable of efficiently cooling a plurality of semiconductor devices and taking action for unnecessary electromagnetic waves. There are provided a plurality of fan units and electromagnetic shielding means for cutting off electromagnetic waves on a heat sink substrate. It is also provided a heat sink substrate, a unit having a fan for supplying fluid to the heat sink substrate and driving means for rotating the fan, and electromagnetic shielding means provided for the heat sink substrate.
摘要翻译：旨在提供能够有效地冷却多个半导体器件并对不必要的电磁波采取动作的散热器单元和电子设备。设置有用于切断散热基板上的电磁波的多个风扇单元和电磁屏蔽装置。还提供了一种散热基板，具有用于向散热基板供给流体的风扇和用于使风扇旋转的驱动装置的单元以及设置在该散热基板上的电磁屏蔽装置。

7. 发明授权

US6097598A Thermal conductive member and electronic device using same 失效
标题翻译：导热构件和使用其的电子装置
公开(公告)号：US6097598A
公开(公告)日：2000-08-01
申请号：US22624
申请日：1998-02-12
申请人： Masaharu Miyahara , Kenji Suga
发明人： Masaharu Miyahara , Kenji Suga
IPC分类号： H05K7/20 , H01L23/36 , H01L23/373
CPC分类号： H01L23/3733 , H01L23/3732 , H01L23/3735 , H01L23/3737 , H01L2924/0002
摘要： There is disclosed a thermal conductive member which can be easily handled, and has high thermal conductivity and the high ability of intimate contact with a heat-generating device and a heatsink, and applies a small stress to a semiconductor package. An electronic device, using this thermal conductive member, is also disclosed. The thermal conductive member connects the heat-generating member to the heatsink serving to radiate heat generated by said heat-generating member, and includes an elastic member, and a thermal conductive foil wound on an elastic member in intimate contact therewith. The electronic device includes the heat-generating member such as a semiconductor, the heatsink for radiating heat generated by the heat-generating member, and the above thermal conductive member interposed between the heat-generating device and the heatsink. Even if the elastic member is made of nitrile rubber or silicone rubber, and the thermal conductive foil is made of graphite, copper or aluminum, the thermal conductivity is effected satisfactorily through the elastic member and the high thermal conductivity foil.
摘要翻译：公开了能够容易地处理并且具有高导热性和与发热装置和散热器紧密接触的高能力的导热构件，并且对半导体封装施加小的应力。还公开了使用该导热部件的电子装置。导热构件将发热构件连接到用于辐射由所述发热构件产生的热量的散热器，并且包括弹性构件和缠绕在与其紧密接触的弹性构件上的导热箔。电子设备包括诸如半导体的发热构件，用于散热由发热构件产生的热的散热器，以及介于发热装置和散热器之间的上述导热构件。即使弹性构件由丁腈橡胶或硅橡胶制成，并且导热箔由石墨，铜或铝制成，通过弹性构件和高热导率箔令人满意地实现导热性。

8. 发明申请

US20070193720A1 Composite heat-dissipating module 审中-公开
标题翻译：复合散热模块
公开(公告)号：US20070193720A1
公开(公告)日：2007-08-23
申请号：US11432368
申请日：2006-05-12
申请人： Alex Horng , Masaharu Miyahara
发明人： Alex Horng , Masaharu Miyahara
IPC分类号： F28D15/00 , F28F13/12
CPC分类号： F28D15/00 , G06F1/203 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A composite heat-dissipating module includes a heat-dissipating plate, an impeller, and a pump. The heat-dissipating plate includes at least one heat-dissipating section and a circulating pipe. The heat-dissipating section is thermally connected to an object to be dissipated. The circulating pipe contains a liquid coolant that circulates in the circulating pipe. The impeller is mounted adjacent to the heat-dissipating section for driving air to cool the heat-dissipating section. The pump drives the liquid coolant to circulate in the circulating pipe between the pump and the heat-dissipating section for cooling the heat-dissipating section.
摘要翻译：复合散热模块包括散热板，叶轮和泵。散热板包括至少一个散热部和循环管。散热部与被散发物体热连接。循环管包含在循环管中循环的液体冷却剂。叶轮安装在散热部分附近，用于驱动空气以冷却散热部分。泵驱动液体冷却剂在泵和散热部分之间的循环管中循环，以冷却散热部分。

9. 发明授权

US06351044B1 Cooling apparatus for an electronic device integrally formed with a circuit board 失效
标题翻译：与电路板一体形成的电子设备的冷却装置
公开(公告)号：US06351044B1
公开(公告)日：2002-02-26
申请号：US09229744
申请日：1999-01-14
申请人： Masaharu Miyahara
发明人： Masaharu Miyahara
IPC分类号： H02K960
CPC分类号： H02K3/26 , F04D25/0653 , H01L23/467 , H01L2924/0002 , H02K2211/03 , Y10S310/06 , H01L2924/00
摘要： A cooling apparatus integrally formed within a casing for an electronic device. A mounting board has heat generating members and the cooling apparatus mounted thereto. In an embodiment, a cooling fan having a flat motor is integrally formed with the mounting board by directly fixing a stator coil and a bearing of a motor on the mounting board. The reduced thickness of this structure permits the circuit element to be arranged on the bottom side of the mounting board, permitting increased surface area for the mounting of components of the electronic device. In another embodiment, the mounting board is made of multiple layers, and the field coils form a flat stator on the multiple layers of the mounting board. A bearing is integrally formed in the multiple layers of the mounting board. The rotor is spaced over the mounting board and opposes the flat stator which is integral with the mounting board to reduce the thickness of the motor and permit use of the mounting bottom of the mounting board for components of the electronic device.
摘要翻译：一种整体形成在用于电子设备的壳体内的冷却设备。安装板具有发热构件和安装在其上的冷却装置。在一个实施例中，具有扁平电动机的冷却风扇通过将定子线圈和电动机的轴承直接固定在安装板上而与安装板一体地形成。这种结构的厚度减小允许电路元件布置在安装板的底侧上，从而允许增加的表面积用于安装电子设备的部件。在另一实施例中，安装板由多层制成，并且场线圈在安装板的多层上形成平坦的定子。轴承一体地形成在安装板的多层中。转子与安装板间隔开，并与安装板一体的扁平定子相对，以减小电机的厚度，并允许使用安装板的安装底座用于电子设备的部件。

10. 发明申请

US20110013419A1 LINEAR LIGHT GUIDING MODULE 失效
标题翻译：线性光指导模块
公开(公告)号：US20110013419A1
公开(公告)日：2011-01-20
申请号：US12554482
申请日：2009-09-04
申请人： Alex Horng , Masaharu Miyahara , Ssu-Hao Lai
发明人： Alex Horng , Masaharu Miyahara , Ssu-Hao Lai
IPC分类号： F21V29/00 , F21V8/00
CPC分类号： G02B6/0085 , G02B6/0028
摘要： A linear light guiding module is provided, which includes a linear light guiding body, a plurality of light emitting bodies, a plurality of heat sinks, and a plurality of fans. With the linear light guiding body, the light emitting bodies, and the heat sinks linearly arranged, or with the fans further integrated, the linear light guiding module of the present invention has a small size and an effective heat-dissipation effect. Since only one linear light guiding module needs to be disposed on one side of a light guide plate, the linear light guiding module can be used in large-sized liquid crystal display panels. Moreover, the number of the linear light guiding modules used is decreased while the requirements for high brightness and brightness uniformity can still be met, so the cost can be reduced.
摘要翻译：提供一种线性导光模块，其包括线性导光体，多个发光体，多个散热器和多个风扇。通过线性导光体，发光体和散热片线性排列，或与风扇进一步集成，本发明的线性光导模块具有小尺寸和有效的散热效果。由于仅需要在导光板的一侧设置一个线性导光模块，所以线性光导模块可用于大尺寸液晶显示面板。此外，使用的线性导光模块的数量减少，而仍然可以满足高亮度和亮度均匀性的要求，因此可以降低成本。

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