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    • 3. 发明授权
    • Heat sink and electronic device employing the same
    • 散热器和采用其的电子设备
    • US5940268A
    • 1999-08-17
    • US831430
    • 1997-04-01
    • Masaharu MiyaharaYasushi InoueKenji Suga
    • Masaharu MiyaharaYasushi InoueKenji Suga
    • H05K7/20H01L23/467
    • H01L23/467H01L2924/0002
    • A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.
    • 散热风扇电动机的散热器有效地在散热器上方有限空间的薄电子设备中提供冷却空气流。 散热器通过将风扇,散热器基板的翅片和基板的侧壁定位成低于风扇驱动单元,从而能够进入散热器上方的空气进入。 散热基板和散热片形成为仅在一个方向上排出空气。 在散热基板的安装有风扇驱动单元的一侧设置盖,并且吸入空气以防止排出的空气被吸入。电子设备的结构位于 散热器上的风扇驱动单元。 因此,散热器可以安装在薄的电子设备上,同时改善散热元件的冷却。
    • 4. 再颁专利
    • Heat sink and electronic device employing the same
    • 散热器和采用其的电子设备
    • USRE40369E1
    • 2008-06-10
    • US10667336
    • 2003-09-23
    • Masaharu MiyaharaYasushi InoueKenji Suga
    • Masaharu MiyaharaYasushi InoueKenji Suga
    • H05K7/20
    • H01L23/467H01L2924/0002H01L2924/00
    • A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.
    • 散热风扇电动机的散热器有效地在散热器上方有限空间的薄电子设备中提供冷却空气流。 散热器通过将风扇,散热器基板的翅片和基板的侧壁定位成低于风扇驱动单元,从而能够进入散热器上方的空气进入。 散热基板和散热片形成为仅在一个方向上排出空气。 在散热基板的安装有风扇驱动单元的一侧设置盖,并且吸入空气以防止排出的空气被吸入。电子设备的结构位于 散热器上的风扇驱动单元。 因此,散热器可以安装在薄的电子设备上,同时改善散热元件的冷却。
    • 7. 发明授权
    • Thermal conductive member and electronic device using same
    • 导热构件和使用其的电子装置
    • US6097598A
    • 2000-08-01
    • US22624
    • 1998-02-12
    • Masaharu MiyaharaKenji Suga
    • Masaharu MiyaharaKenji Suga
    • H05K7/20H01L23/36H01L23/373
    • H01L23/3733H01L23/3732H01L23/3735H01L23/3737H01L2924/0002
    • There is disclosed a thermal conductive member which can be easily handled, and has high thermal conductivity and the high ability of intimate contact with a heat-generating device and a heatsink, and applies a small stress to a semiconductor package. An electronic device, using this thermal conductive member, is also disclosed. The thermal conductive member connects the heat-generating member to the heatsink serving to radiate heat generated by said heat-generating member, and includes an elastic member, and a thermal conductive foil wound on an elastic member in intimate contact therewith. The electronic device includes the heat-generating member such as a semiconductor, the heatsink for radiating heat generated by the heat-generating member, and the above thermal conductive member interposed between the heat-generating device and the heatsink. Even if the elastic member is made of nitrile rubber or silicone rubber, and the thermal conductive foil is made of graphite, copper or aluminum, the thermal conductivity is effected satisfactorily through the elastic member and the high thermal conductivity foil.
    • 公开了能够容易地处理并且具有高导热性和与发热装置和散热器紧密接触的高能力的导热构件,并且对半导体封装施加小的应力。 还公开了使用该导热部件的电子装置。 导热构件将发热构件连接到用于辐射由所述发热构件产生的热量的散热器,并且包括弹性构件和缠绕在与其紧密接触的弹性构件上的导热箔。 电子设备包括诸如半导体的发热构件,用于散热由发热构件产生的热的散热器,以及介于发热装置和散热器之间的上述导热构件。 即使弹性构件由丁腈橡胶或硅橡胶制成,并且导热箔由石墨,铜或铝制成,通过弹性构件和高热导率箔令人满意地实现导热性。