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    • 9. 发明授权
    • Sputtering target and method for producing the same
    • 溅射靶材及其制造方法
    • US08795489B2
    • 2014-08-05
    • US13262540
    • 2010-11-04
    • Shoubin ZhangYoshinori Shirai
    • Shoubin ZhangYoshinori Shirai
    • C23C14/34
    • C23C14/3414C22C1/0425C22C9/00H01L31/0322Y02E10/541Y02P70/521
    • [Problems]To provide a sputtering target that is capable of forming a Cu—Ga film to which Na is favorably added by a sputtering method, and a method for producing the same.[Means for Solving the Problems]The sputtering target is provided wherein 20 to 40 at % of Ga and 0.05 to 1 at % of Na are contained as metal components except fluorine (F) of the sputtering target, a remaining portion has a component composition consisting of Cu and unavoidable impurities, and Na is contained in the state of a NaF compound. Also, a method for producing the sputtering target includes the steps of forming a molded article consisting of a mixed powder of NaF powder and Cu—Ga powder or a mixed powder of NaF powder, Cu—Ga powder, and Cu powder; and sintering the molded article in a vacuum atmosphere, an inert gas atmosphere, or a reducing atmosphere.
    • [问题]提供能够形成通过溅射法有利地添加Na的Cu-Ga膜的溅射靶及其制造方法。 [解决问题的方法]提供溅射靶,其中,作为溅射靶的氟(F)以外的金属成分,作为金属成分含有Ga的20〜40at%的Na和0.05〜1at%的Na,剩余部分具有成分组成 由Cu和不可避免的杂质组成,Na含有NaF化合物的状态。 此外,溅射靶的制造方法包括以下步骤:形成由NaF粉末和Cu-Ga粉末的混合粉末或NaF粉末,Cu-Ga粉末和Cu粉末的混合粉末组成的模制品; 并在真空气氛,惰性气体气氛或还原气氛中烧结成型制品。