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    • 6. 发明申请
    • CIRCUIT BOARD AND CONNECTION SUBSTRATE
    • 电路板和连接基板
    • US20090084597A1
    • 2009-04-02
    • US12293264
    • 2007-03-14
    • Toshiaki ChumaMakoto Inaba
    • Toshiaki ChumaMakoto Inaba
    • H05K1/11
    • H05K1/148H05K3/363H05K3/4007H05K2201/0367H05K2201/0394H05K2201/09481
    • There is provided a circuit board including a first and a second circuit substrate located with a spacing, on which a first and a second conductor pad are provided respectively; and a connection substrate including a first and a second conductor post projecting from one or the other side; the connection substrate being disposed so as to cover a portion of the first and the second circuit substrate, and bridged therebetween; the first conductor post and the first conductor pad, as well as the second conductor post and the second conductor pad, being disposed so as to oppose each other; the circuit board also including a connector portion to be formed upon melting a metal coating layer, formed in advance on a surface of at least one of the first conductor post and the first conductor pad, and on a surface of at least one of the second conductor post and the second conductor pad; the first and the second circuit substrate and the connection substrate being electrically connected through the connector portion.
    • 提供了一种电路板,包括分别设置有第一和第二导体焊盘的间隔的第一和第二电路基板; 以及连接基板,包括从一侧或另一侧突出的第一和第二导体柱; 连接基板被设置成覆盖第一和第二电路基板的一部分,并在其间桥接; 第一导体柱和第一导体焊盘以及第二导体柱和第二导体焊盘彼此相对设置; 电路板还包括在熔化金属涂层时形成的连接器部分,其预先形成在第一导体柱和第一导体焊盘中的至少一个的表面上,并且在第二第二导体柱中的至少一个的表面上形成 导体柱和第二导体垫; 第一和第二电路基板和连接基板通过连接器部分电连接。