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    • 5. 发明授权
    • Curable composition comprising epoxidized natural oils
    • 包含环氧化天然油的可固化组合物
    • US06194490B1
    • 2001-02-27
    • US09253162
    • 1999-02-19
    • Martin RothQian TangRoger MalherbeCatherine Schoenenberger
    • Martin RothQian TangRoger MalherbeCatherine Schoenenberger
    • C08K336
    • C08L63/00C08G59/38C08G59/42C08G59/686
    • A composition, which comprises (a) a compound containing at least one epoxy group in inner position per molecule, obtained by epoxidation of a natural unsaturated oil or of its derivative; (b) an epoxy compound selected from the group consisting of glycidyl ethers, glycidyl esters and cycloaliphatic epoxides; (c) a polycarboxylic acid anhydride; (d) a compound of formula I, I, III or IV or an acid adduct of a compound of formula I, II, III or IV  wherein R1 to R4 are each independently of one another hydrogen; C1-C18alkyl which is unsubstituted or substituted by one or more than one hydroxyl group amino group, halogen atom, cyano group, C1-C6alkoxy group or C1-C6cyanalkoxy group; C5-C14aryl, C6-C24aralkyl, C3-C14heteroaryl or C4-C14heteroaralkyl which are unsubstituted or substituted by one or more than one C1-C6alkyl group, C1-C6alkoxy group or halogen atom,  n is an integer from 1 to 3, and  R5 and R6 are each independently of the other C1-C6alkyl or, together with the nitrogen atom, form a five- or six-membered ring, and (e) 20-90% by weight, based on the entire composition, of a filler, the average diameter of the filler particles being from 0.1 &mgr;m to 5.0 mm, can be cured to products having a high Tg and are suitable in particular as encapsulating material for electrical and electronic components.
    • 一种组合物,其包含(a)通过天然不饱和油或其衍生物的环氧化获得的每分子含有至少一个内部位置的环氧基的化合物;(b)选自缩水甘油醚, 缩水甘油酯和环脂族环氧化物;(c)多元羧酸酐;(d)式I,I,III或IV的化合物或式I,II,III或IV化合物的酸加合物,其中R 1至R 4各自 独立于氢; 未被取代或被一个或多于一个羟基氨基,卤素原子,氰基,C 1 -C 6烷氧基或C 1 -C 6氰基烷氧基取代的C 1 -C 18烷基; 未被取代或被一个或多于一个C 1 -C 6烷基,C 1 -C 6烷氧基或卤素原子取代的C 5 -C 14芳基,C 6 -C 24芳烷基,C 3 -C 14杂芳基或C 4 -C 14杂芳烷基,n为1至3的整数,R 5 和R 6各自独立地为其它C 1 -C 6烷基,或者与氮原子一起形成五元或六元环,和(e)基于整个组合物的20-90重量%的填料, 填料颗粒的平均直径为0.1μm至5.0mm,可以固化成具有高Tg的产品,并且特别适合用作电气和电子部件的包封材料。