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    • 3. 发明授权
    • Gate structure for field effect transistor
    • 场效应晶体管的栅极结构
    • US08518783B2
    • 2013-08-27
    • US12989521
    • 2009-04-27
    • Markus MuellerGuillaume BoccardiJasmine Petry
    • Markus MuellerGuillaume BoccardiJasmine Petry
    • H01L21/336
    • H01L21/26506H01L21/28158H01L21/28176H01L21/31155H01L21/32155H01L29/495H01L29/4958H01L29/4966H01L29/513H01L29/517
    • A field effect transistor having a gate structure that comprises an interfacial layer positioned in between the transistor channel region and a high-K dielectric layer of the gate stack. The interfacial layer comprises AlxSiyOz, which has a higher relative dielectric constant value than SiO2. A method of forming the gate structure of a field effect transistor. The method includes forming a gate stack comprising, in order: a SiO2-based layer adjacent a channel region of the field effect transistor; a high-K dielectric layer on the SiO2-based layer; and a gate electrode on the high-K dielectric layer. The method also includes introducing Al into the SiO2-based layer to form an AlxSiyOz interfacial layer in between the high-K dielectric layer and the channel region. A heating step to allows Al introduced into channel region to diffuse out of the channel region into the interfacial layer.
    • 具有栅极结构的场效应晶体管包括位于晶体管沟道区域和栅极叠层的高K电介质层之间的界面层。 界面层包含Al x Se y O z,其比SiO 2具有更高的相对介电常数值。 一种形成场效应晶体管的栅极结构的方法。 该方法包括形成栅极堆叠,其顺序包括:与场效应晶体管的沟道区相邻的基于SiO 2的层; 在SiO 2基层上的高K电介质层; 以及在高K电介质层上的栅电极。 该方法还包括将Al引入SiO 2基层中以在高K电介质层和沟道区之间形成Al x Se y O z界面层。 加热步骤,允许引入通道区域的Al扩散到沟​​道区域内进入界面层。