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1. 发明授权

US09341499B2 Sensor system 有权
标题翻译：传感器系统
公开(公告)号：US09341499B2
公开(公告)日：2016-05-17
申请号：US13068628
申请日：2011-05-17
申请人： Markus Graf , Vincent Hess , Dominik Niederberger
发明人： Markus Graf , Vincent Hess , Dominik Niederberger
IPC分类号： G01D18/00 , G01D3/036
CPC分类号： G01D18/008 , G01D3/0365
摘要： Disclosed is a method for adjusting a sensor signal and a corresponding sensor system comprising a sensor for providing a sensor signal representative of a measure other than temperature, dynamic components of the sensor signal being dependent on temperature. In addition there is provided a temperature sensor for measuring the temperature. Dynamic components in the sensor signal are adjusted subject to the temperature sensed, and a compensated sensor signal is supplied. Such sensor system helps compensating for long response times of sensors.
摘要翻译：公开了一种用于调节传感器信号的方法和相应的传感器系统，该传感器系统包括传感器，用于提供代表不同于温度的测量值的传感器信号，传感器信号的动态分量取决于温度。此外，还提供了用于测量温度的温度传感器。传感器信号中的动态组件根据感测温度进行调整，并提供补偿的传感器信号。这种传感器系统有助于补偿传感器的长时间响应时间。

2. 发明申请

US20110307208A1 Sensor system 有权
标题翻译：传感器系统
公开(公告)号：US20110307208A1
公开(公告)日：2011-12-15
申请号：US13068628
申请日：2011-05-17
申请人： Markus Graf , Vincent Hess , Dominik Niederberger
发明人： Markus Graf , Vincent Hess , Dominik Niederberger
IPC分类号： G01D18/00
CPC分类号： G01D18/008 , G01D3/0365
摘要： Disclosed is a method for adjusting a sensor signal and a corresponding sensor system comprising a sensor for providing a sensor signal representative of a measure other than temperature, dynamic components of the sensor signal being dependent on temperature. In addition there is provided a temperature sensor for measuring the temperature. Dynamic components in the sensor signal are adjusted subject to the temperature sensed, and a compensated sensor signal is supplied. Such sensor system helps compensating for long response times of sensors.
摘要翻译：公开了一种用于调节传感器信号的方法和相应的传感器系统，该传感器系统包括传感器，用于提供代表不同于温度的测量值的传感器信号，传感器信号的动态分量取决于温度。此外，还提供了用于测量温度的温度传感器。传感器信号中的动态组件根据感测温度进行调整，并提供补偿的传感器信号。这种传感器系统有助于补偿传感器的长时间响应时间。

3. 发明授权

US08838037B2 Mobile phone with humidity sensor 有权
标题翻译：带湿度传感器的手机
公开(公告)号：US08838037B2
公开(公告)日：2014-09-16
申请号：US13398439
申请日：2012-02-16
申请人： Dominik Niederberger , Johannes Schumm , Pascal Gerner , Markus Graf
发明人： Dominik Niederberger , Johannes Schumm , Pascal Gerner , Markus Graf
IPC分类号： H04B17/00 , H04M1/21
CPC分类号： H04M1/21 , A61B5/443 , A61B5/6898 , A61B2562/029 , G01N27/223 , H04M2250/12
摘要： A mobile phone comprises a casing and a cavity in the casing. A humidity sensor is arranged for measuring a humidity in the cavity. In response to a trigger, a control unit analyzes a humidity signal supplied by the humidity sensor. A result of the analysis is presented via an output unit. Such device allows for measuring a humidity of a user's skin in case the user covers a window in the casing connected to the cavity by a body part.
摘要翻译：手机包括壳体和壳体中的空腔。布置湿度传感器用于测量空腔中的湿度。响应于触发，控制单元分析由湿度传感器提供的湿度信号。通过输出单元提供分析结果。在用户通过身体部分覆盖连接到腔体的壳体中的窗口的情况下，这种装置允许测量使用者皮肤的湿度。

4. 发明申请

US20120231841A1 MOBILE PHONE 有权
标题翻译：移动电话
公开(公告)号：US20120231841A1
公开(公告)日：2012-09-13
申请号：US13398439
申请日：2012-02-16
申请人： Dominik Niederberger , Johannes Schumm , Pascal Gerner , Markus Graf
发明人： Dominik Niederberger , Johannes Schumm , Pascal Gerner , Markus Graf
IPC分类号： H04W88/02
CPC分类号： H04M1/21 , A61B5/443 , A61B5/6898 , A61B2562/029 , G01N27/223 , H04M2250/12
摘要： A mobile phone comprises a casing and a cavity in the casing. A humidity sensor is arranged for measuring a humidity in the cavity. In response to a trigger, a control unit analyzes a humidity signal supplied by the humidity sensor. A result of the analysis is presented via an output unit. Such device allows for measuring a humidity of a user's skin in case the user covers a window in the casing connected to the cavity by a body part.
摘要翻译：手机包括壳体和壳体中的空腔。布置湿度传感器用于测量空腔中的湿度。响应于触发，控制单元分析由湿度传感器提供的湿度信号。通过输出单元提供分析结果。在用户通过身体部分覆盖连接到腔体的壳体中的窗口的情况下，这种装置允许测量使用者皮肤的湿度。

5. 发明申请

US20100310343A1 Method and apparatus for processing individual sensor devices 有权
标题翻译：用于处理各个传感器装置的方法和装置
公开(公告)号：US20100310343A1
公开(公告)日：2010-12-09
申请号：US12798890
申请日：2010-04-13
申请人： Felix Mayer , Markus Graf , Dominik Niederberger , Martin Fitzi
发明人： Felix Mayer , Markus Graf , Dominik Niederberger , Martin Fitzi
IPC分类号： B25J11/00
CPC分类号： G01D18/00
摘要： To process a plurality of sensor devices, such as humidity sensors or gas sensors, the sensor devices are run through a testing station and a turret handler. In order to increase throughput of the testing station, several test cycles are operated simultaneously in a phase-shifted manner. The sensor devices are e.g. sequentially fed onto trays of the test station, on which they are assembled in batches. Each batch is subjected to a test cycle. After the test cycle, the sensor devices of a batch are sequentially fed back to the turret handler.
摘要翻译：为了处理诸如湿度传感器或气体传感器的多个传感器装置，传感器装置通过测试台和转塔处理器运行。为了提高测试站的吞吐量，以相移方式同时操作多个测试周期。传感器装置例如依次送入测试台的托盘上，批量组装。每个批次经受一个测试周期。在测试周期之后，批次的传感器装置被顺序地反馈到转塔处理器。

6. 发明授权

US08499609B2 Method and apparatus for processing individual sensor devices 有权
标题翻译：用于处理各个传感器装置的方法和装置
公开(公告)号：US08499609B2
公开(公告)日：2013-08-06
申请号：US12798890
申请日：2010-04-13
申请人： Felix Mayer , Markus Graf , Dominik Niederberger , Martin Fitzi
发明人： Felix Mayer , Markus Graf , Dominik Niederberger , Martin Fitzi
IPC分类号： G01N1/28
CPC分类号： G01D18/00
摘要： To process a plurality of sensor devices, such as humidity sensors or gas sensors, the sensor devices are run through a testing station and a turret handler. In order to increase throughput of the testing station, several test cycles are operated simultaneously in a phase-shifted manner. The sensor devices are e.g. sequentially fed onto trays of the test station, on which they are assembled in batches. Each batch is subjected to a test cycle. After the test cycle, the sensor devices of a batch are sequentially fed back to the turret handler.
摘要翻译：为了处理诸如湿度传感器或气体传感器的多个传感器装置，传感器装置通过测试台和转塔处理器运行。为了提高测试站的吞吐量，以相移方式同时操作多个测试周期。传感器装置例如依次送入测试台的托盘上，批量组装。每个批次经受一个测试周期。在测试周期之后，批次的传感器装置被顺序地反馈到转塔处理器。

7. 发明授权

US08736002B2 Sensor mounted in flip-chip technology at a substrate edge 有权
标题翻译：传感器以倒装芯片技术安装在基板边缘
公开(公告)号：US08736002B2
公开(公告)日：2014-05-27
申请号：US13498490
申请日：2009-11-18
申请人： Markus Graf , Werner Hunziker , Franziska Brem , Felix Mayer
发明人： Markus Graf , Werner Hunziker , Franziska Brem , Felix Mayer
IPC分类号： H01L29/84 , H01L21/50 , H01L23/12
CPC分类号： H01L24/10 , G01N27/128 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01057 , H01L2924/014 , H01L2924/09701 , H01L2924/00
摘要： The sensor assembly comprises a substrate (1), such as a flexible printed circuit board, and a sensor chip (2) flip-chip mounted to the substrate (1), with a first side (3) of the sensor chip (2) facing the substrate (1). A sensing area (4) and contact pads (5) are integrated on the first side (3) of the sensor chip (2). Underfill (18) and/or solder flux is arranged between the sensor chip (2) and the substrate (1). The sensor chip (2) extends over an edge (12) of the substrate (1), with the edge (12) of the substrate (1) extending between the contact pads (5) and the sensing area (4) over the whole sensor chip (2). A dam (16) can be provided along the edge (12) of the substrate (1) for even better separation of the underfill (18) and the sensing area (4). This de sign allows for a simple alignment of the sensor chip on the substrate (1) and prevents underfill (18) from covering the sensing area (4).
摘要翻译：该传感器组件包括一个衬底（1），例如柔性印刷电路板，以及安装在衬底（1）上的传感器芯片（2）倒装芯片，其中传感器芯片（2）的第一侧（3）面向基板（1）。感测区域（4）和接触焊盘（5）集成在传感器芯片（2）的第一侧（3）上。在传感器芯片（2）和基板（1）之间布置有底部填充物（18）和/或焊剂。传感器芯片（2）在衬底（1）的边缘（12）上延伸，衬底（1）的边缘（12）在整个接触焊盘（5）和感测区域（4）之间延伸传感器芯片（2）。可以沿着基板（1）的边缘（12）设置坝（16），以便更好地分离底部填充物（18）和感测区域（4）。该符号允许传感器芯片在衬底（1）上的简单对准，并且防止底部填充物（18）覆盖感测区域（4）。

8. 发明申请

US20110156383A1 CONNECTION PIECE 审中-公开
标题翻译：连接件
公开(公告)号：US20110156383A1
公开(公告)日：2011-06-30
申请号：US12650223
申请日：2009-12-30
申请人： Urs BOBST , Markus Graf , Andreas Naef , Patrik Zeiter , Thomas Wullschleger , Peter Schindler , Kurt Gysin
发明人： Urs BOBST , Markus Graf , Andreas Naef , Patrik Zeiter , Thomas Wullschleger , Peter Schindler , Kurt Gysin
IPC分类号： F16L55/00
CPC分类号： F16L37/091 , F16L37/0925
摘要： A connection piece (111) for a plug-in connection of a fluid-carrying system of lines for distributing drinking water within stories is formed without a supporting nipple. The connection piece (111) has in the region of an inner lateral surface of the first tubular part a first peripheral guiding surface (122) and a second peripheral guiding surface (117), arranged behind the first guiding surface (122) with respect to an insertion opening of the connection piece (111), for the second tubular part (160). A first axial extent of the first guiding surface (122) and a second axial extent of the second guiding surface (117) respectively make up each at least one sixth of an inside diameter of the first tubular part (112, 120). The connection piece (111) may form part of a fitting or a faucet and is suitable in particular for use with solid plastic pipes, for example of crosslinked polyethylene.
摘要翻译：形成用于在故障中分配饮用水的流体输送系统的插入式连接件的连接件（111），而没有支撑接头。连接件（111）在第一管状部件的内侧表面的区域中具有相对于第一引导表面（122）布置在第一引导表面（122）的后面的第一外围引导表面（122）和第二外围引导表面（117）用于第二管状部分（160）的连接件（111）的插入开口。第一引导表面（122）的第一轴向范围和第二引导表面（117）的第二轴向范围分别构成第一管状部分（112,120）的内径的至少六分之一。连接件（111）可以形成配件或水龙头的一部分，并且特别适用于固体塑料管，例如交联聚乙烯。

9. 发明申请

US20100171283A1 MOVABLE STEP FOR A MATERIALS HANDLING VEHICLE 审中-公开
标题翻译：一种材料处理车辆的可移动步骤
公开(公告)号：US20100171283A1
公开(公告)日：2010-07-08
申请号：US12730290
申请日：2010-03-24
申请人： James V. Kraimer , Jay G. Pollack , Markus Graf
发明人： James V. Kraimer , Jay G. Pollack , Markus Graf
IPC分类号： B60R3/02 , B60R3/00
CPC分类号： B66F9/07545
摘要： A materials handling vehicle is provided comprising a frame including an operator compartment having at least one entrance and a floorboard. The vehicle further comprises at least one step capable of being positioned across the entrance a spaced distance from the floorboard such that an operator may stand on the step when the step is positioned across the entrance to gain access to an elevated storage location.
摘要翻译：提供了一种材料搬运车辆，其包括框架，该框架包括具有至少一个入口和地板块的操作室。车辆还包括至少一个步骤，其能够跨越入口定位与地板块间隔开的距离，使得当台阶跨越入口定位以进入升高的存储位置时，操作员可以站在台阶上。

10. 发明申请

US20100117185A1 Temperature sensor with buffer layer 审中-公开
标题翻译：带缓冲层的温度传感器
公开(公告)号：US20100117185A1
公开(公告)日：2010-05-13
申请号：US12460152
申请日：2009-07-14
申请人： Werner Hunziker , Franziska Brem , René Hummel , Markus Graf
发明人： Werner Hunziker , Franziska Brem , René Hummel , Markus Graf
IPC分类号： H01L29/66 , H01L21/78
CPC分类号： G01N27/223 , G01D3/028 , G01K7/01 , H01L21/565 , H01L23/3185 , H01L2224/48091 , H01L2924/12044 , H01L2924/1461 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A temperature sensor with a bandgap circuit is provided. The bandgap circuit is covered by a buffer layer of photoresist. The device is packaged in a housing. By providing the buffer layer, mechanical stress in the bandgap circuit, as it is e.g. caused by different thermal expansion coefficients of the packaging and the chip, can be reduced. This improves the accuracy of the device.
摘要翻译：提供具有带隙电路的温度传感器。带隙电路由光致抗蚀剂的缓冲层覆盖。该设备被封装在外壳中。通过提供缓冲层，带隙电路中的机械应力，例如，由包装和芯片的不同热膨胀系数引起的，可以减少。这提高了设备的精度。

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