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1. 发明授权

US08696406B2 Device for blast-machining or abrasive blasting objects 有权
标题翻译：用于爆破加工或喷砂处理物体的装置
公开(公告)号：US08696406B2
公开(公告)日：2014-04-15
申请号：US13034550
申请日：2011-02-24
申请人： Werner Hunziker
发明人： Werner Hunziker
IPC分类号： B24B1/00
CPC分类号： B24C7/0046 , B24C7/0023 , B24C7/0038 , B24C7/0061 , B24C9/003 , B24C9/006 , Y02P70/179
摘要： A device (33) for blast-machining or abrasive blasting objects such as structural elements, tools, household objects, pots, pans or the like, has a blast pot (3) for holding a blasting abrasive (35) which is connected via at least one line (21) to a blasting nozzle (24) which extends into a blasting space (1) in which the objects which are to be blasted can be placed. Compressed air is introduced above the blasting abrasive mixture (35) provided in the blast pot (3) by means of a pressure-generating means (43) and the blasting abrasive (35) thus being forced into the blasting space (1), the compressed air conveying via a second line (10) the granular material or the granular material mixture (35) and/or a suspension formed from granular material and liquid out of the blasting space (1) and back into the blast pot (3), which also takes the form of a pressurized space.
摘要翻译：用于爆破加工的装置（33）或诸如结构元件，工具，家用物体，锅，平底锅或类似物的喷砂处理物体的装置（33）具有用于保持喷砂磨料（35）的鼓风炉（3）至喷射喷嘴（24）的至少一条线（21），其延伸到可以放置待喷射物体的喷砂空间（1）中。压缩空气通过压力发生装置（43）被引入到设置在鼓风炉（3）中的喷砂研磨剂混合物（35）上，并且喷砂研磨剂（35）被迫进入喷砂空间（1），经由第二管线（10）将粒状材料或颗粒状混合物（35）和/或由颗粒状材料和液体形成的悬浮液输出到喷砂空间（1）内并返回到鼓风罐（3）中的压缩空气，这也采取加压空间的形式。

2. 发明申请

US20140028340A1 SENSOR DEVICE 有权
标题翻译：传感器设备
公开(公告)号：US20140028340A1
公开(公告)日：2014-01-30
申请号：US13981651
申请日：2012-01-26
申请人： Markus Graf , Matthias Streiff , Werner Hunziker , Christoph Schanz
发明人： Markus Graf , Matthias Streiff , Werner Hunziker , Christoph Schanz
IPC分类号： G01R31/28
CPC分类号： G01R31/2831 , B81C1/00333 , G01N33/0027 , G09G1/00 , H01L21/00 , H01L24/94 , H01L2221/00 , H01L2224/13
摘要： In a method for manufacturing a sensor chip a spacer (3) is arranged at the front side (11) of a substrate (1) at which front side (11) a sensing element (2) is arranged, too. Holes (14) are etched for building vias (15) extending through the substrate (1) between the front side (11) of the substrate (1) and its back side (12). After etching, the holes (14) are filled with conductive material to complete the vias (15). The spacer (3) provides protection to the sensing element (2) and the sensing chip throughout the manufacturing process.
摘要翻译：在传感器芯片的制造方法中，在基板（1）的前侧（11）配置有隔离物（3），在基板（1）的前侧（11）配置有感应元件（2）。蚀刻孔（14），用于在衬底（1）的前侧（11）和其背面（12）之间延伸穿过衬底（1）的建筑通孔（15）。在蚀刻之后，用导电材料填充孔（14）以完成通路（15）。间隔件（3）在整个制造过程中提供对传感元件（2）和传感芯片的保护。

3. 发明申请

US20120267731A1 SENSOR MOUNTED IN FLIP-CHIP TECHNOLOGY ON A SUBSTRATE 有权
标题翻译：传感器安装在基板上的芯片技术中
公开(公告)号：US20120267731A1
公开(公告)日：2012-10-25
申请号：US13498371
申请日：2009-11-18
申请人： Markus Graf , Werner Hunziker , Franziska Brem , Felix Mayer
发明人： Markus Graf , Werner Hunziker , Franziska Brem , Felix Mayer
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： H01L21/563 , G01L19/148 , G01N27/128 , H01L24/32 , H01L2224/13099 , H01L2224/16225 , H01L2224/26145 , H01L2224/32225 , H01L2924/00013 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01057 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： The sensor assembly comprises a substrate (1), such as a flexible printed circuit board, and a sensor chip (2) flip-chip mounted to the substrate (1), with a first side (3) of the sensor chip (2) facing the substrate (1). A sensing area (4) and contact pads (5) are integrated on the first side (3) of the sensor chip (2) and located in a chamber (17) between the substrate (1) and the sensor chip (2). Chamber (17) is bordered along at least two sides by a dam (16). Underfill (18) and/or solder flux is arranged between the sensor chip (2) and the substrate (1), and the dam (16) prevents the underfill from entering the chamber (17). An opening (19) extends from the chamber to the environment and is located between the substrate (1) and the sensor chip (2) or extends through the sensor chip (2).
摘要翻译：该传感器组件包括一个衬底（1），例如柔性印刷电路板，以及安装在衬底（1）上的传感器芯片（2）倒装芯片，其中传感器芯片（2）的第一侧（3）面向基板（1）。感测区域（4）和接触焊盘（5）集成在传感器芯片（2）的第一侧（3）上并且位于基板（1）和传感器芯片（2）之间的腔室（17）中。大厅（17）至少由两座大坝毗邻（16）。在传感器芯片（2）和基板（1）之间布置有底部填充物（18）和/或焊剂，并且防止底板（16）进入腔室（17）。开口（19）从腔室延伸到环境并且位于衬底（1）和传感器芯片（2）之间或延伸穿过传感器芯片（2）。

4. 发明授权

US07901971B2 Method for manufacturing a sensor device with a stress relief layer 有权
标题翻译：制造具有应力消除层的传感器装置的方法
公开(公告)号：US07901971B2
公开(公告)日：2011-03-08
申请号：US12462528
申请日：2009-08-05
申请人： Werner Hunziker , Franziska Brem , René Hummel
发明人： Werner Hunziker , Franziska Brem , René Hummel
IPC分类号： H01L21/00
CPC分类号： G01N27/223 , G01D3/028 , G01K7/01 , H01L21/565 , H01L23/3185 , H01L2224/48091 , H01L2924/12044 , H01L2924/1461 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A method for packaging a sensor device having a sensitive structure integrated on a semiconductor chip is provided. When molding the device package, an inward extending section of the mold maintains an access opening to the sensor. A buffer layer is arranged on the chip between the inward extending section and the sensitive structure. The buffer layer protects the sensitive structure from damage by the inward extending section and acts as a seal while casting the housing. The buffer layer also covers at least part of the semiconductor electronic components of the circuitry integrated onto the chip. By covering these components, mechanical stress, as it is e.g. caused by different thermal expansion coefficients of the packaging and the chip, can be reduced.
摘要翻译：提供一种用于封装具有集成在半导体芯片上的敏感结构的传感器装置的方法。当模制装置包装时，模具的向内延伸部分保持对传感器的进入开口。缓冲层布置在芯片之间的向内延伸部分和敏感结构之间。缓冲层保护敏感结构免受向内延伸部分的损坏，并在铸造壳体时用作密封件。缓冲层还覆盖集成到芯片上的电路的至少一部分半导体电子部件。通过覆盖这些部件，例如机械应力。由包装和芯片的不同热膨胀系数引起的，可以减少。

5. 发明申请

US20100035373A1 Method for manufacturing a sensor device with a stress relief layer 有权
标题翻译：制造具有应力消除层的传感器装置的方法
公开(公告)号：US20100035373A1
公开(公告)日：2010-02-11
申请号：US12462528
申请日：2009-08-05
申请人： Werner Hunziker , Franziska Brem , Rene Hummel
发明人： Werner Hunziker , Franziska Brem , Rene Hummel
IPC分类号： H01L21/78
CPC分类号： G01N27/223 , G01D3/028 , G01K7/01 , H01L21/565 , H01L23/3185 , H01L2224/48091 , H01L2924/12044 , H01L2924/1461 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A method for packaging a sensor device having a sensitive structure integrated on a semiconductor chip is provided. When molding the device package, an inward extending section of the mold maintains an access opening to the sensor. A buffer layer is arranged on the chip between the inward extending section and the sensitive structure. The buffer layer protects the sensitive structure from damage by the inward extending section and acts as a seal while casting the housing. The buffer layer also covers at least part of the semiconductor electronic components of the circuitry integrated onto the chip. By covering these components, mechanical stress, as it is e.g. caused by different thermal expansion coefficients of the packaging and the chip, can be reduced.
摘要翻译：提供一种用于封装具有集成在半导体芯片上的敏感结构的传感器装置的方法。当模制装置包装时，模具的向内延伸部分保持对传感器的进入开口。缓冲层布置在芯片之间的向内延伸部分和敏感结构之间。缓冲层保护敏感结构免受向内延伸部分的损坏，并在铸造壳体时用作密封件。缓冲层还覆盖集成到芯片上的电路的至少一部分半导体电子部件。通过覆盖这些部件，例如机械应力。由包装和芯片的不同热膨胀系数引起的，可以减少。

6. 发明授权

US5284125A Multi-purpose fireplace for outdoor use 失效
标题翻译：多用途户外用壁炉
公开(公告)号：US5284125A
公开(公告)日：1994-02-08
申请号：US828877
申请日：1992-01-31
申请人： Werner Hunziker
发明人： Werner Hunziker
IPC分类号： A47J37/06 , F24B1/181 , F24B1/20 , A47J37/00
CPC分类号： F24B1/181 , A47J37/06 , F24B1/202
摘要： A multi-purpose fireplace for outdoor use having a firebox, a baking chamber and at least one grill above the baking chamber. The baking chamber is delimited by a metal wall with a door which is accessible from the outside of the fireplace. The baking chamber is fixed in an outer housing which receives the firebox. The baking chamber is preferably also delimited by a cylindrical metal barrel which is mounted with respect to the sidewalls such that an open flue conduit is formed between the metal barrel and the outer housing.
摘要翻译： PCT No.PCT / CH91 / 00124 Sec。 371日期：1992年1月31日 102（e）日期1992年1月31日PCT提交1991年5月28日PCT公布。 WO91 / 19448 PCT出版物日期为1991年12月26日。一种用于户外用途的多功能壁炉，具有火炉，烘烤室和烘烤室上方的至少一个烤架。烘烤室由具有可从壁炉外部接近的门的金属壁限定。烘烤室被固定在接收火箱的外壳中。烘烤室也优选地由相对于侧壁安装的圆柱形金属桶限定，使得在金属桶和外壳之间形成开放的烟道。

7. 发明授权

US4844232A Installation for the surface treatment of workpieces 失效
标题翻译：安装表面处理工件
公开(公告)号：US4844232A
公开(公告)日：1989-07-04
申请号：US187360
申请日：1988-04-28
申请人： Werner Hunziker
发明人： Werner Hunziker
IPC分类号： B65G49/02 , B08B3/04 , B24C3/26 , B65G33/12 , B65G35/00
CPC分类号： B08B3/042 , B24C3/266 , B65G35/00
摘要： An installation for the surface treatment of workpieces has a housing with a treatment chamber. The workpieces are conveyed through the chamber by an apparatus which continuously advances the workpieces while simultaneously tumbling the same. The apparatus includes an elongated, generally horizontal cage-like receptacle which extends through the chamber and a motor for rotating the receptacle on its longitudinal axis to thereby tumble the workpieces. The receptacle has an end wall to either side of the chamber and the end walls are joined to one another by a tubular shell made up of a series of elongated components such as rods or wires. The elongated components, which are parallel to the longitudinal axis of the receptacle, are circumferentially spaced so that a medium for the surface treatment of workpieces being tumbled in the shell can penetrate the latter. The end walls of the receptacle can be pivoted so that the normals to the end walls make an acute angle with the longitudinal axis of the receptacle and this results in lengthwise movement of the elongated components as the receptacle rotates. Such lengthwise movement causes the workpieces to advance through the treatment chamber as the workpieces are tumbled. The elongated components are connected to one another, at least in the portion of the shell which is located in the chamber, in order to strengthen the shell and to allow the latter to confine flat workpieces.
摘要翻译：用于表面处理工件的装置具有带有处理室的壳体。工件通过连续前进工件同时翻转工件的设备输送通过室。该装置包括延伸穿过该室的细长的大致水平的笼状容器和用于在其纵向轴线上旋转容器从而使工件翻转的马达。容器具有到室的任一侧的端壁，并且端壁通过由诸如杆或线的一系列细长部件组成的管状壳体相互连接。平行于容器的纵向轴线的细长部件周向间隔开，使得用于在壳体中翻滚的工件的表面处理的介质可以穿透其中。容器的端壁可以枢转，使得端壁的法线与插座的纵向轴线成锐角，并且这导致当插座转动时细长部件的纵向移动。当工件翻滚时，这种纵向运动导致工件前进通过处理室。细长部件至少在壳体的位于腔室的部分中彼此连接，以便加强壳体并允许其限制平坦的工件。

8. 发明授权

US08736002B2 Sensor mounted in flip-chip technology at a substrate edge 有权
标题翻译：传感器以倒装芯片技术安装在基板边缘
公开(公告)号：US08736002B2
公开(公告)日：2014-05-27
申请号：US13498490
申请日：2009-11-18
申请人： Markus Graf , Werner Hunziker , Franziska Brem , Felix Mayer
发明人： Markus Graf , Werner Hunziker , Franziska Brem , Felix Mayer
IPC分类号： H01L29/84 , H01L21/50 , H01L23/12
CPC分类号： H01L24/10 , G01N27/128 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01057 , H01L2924/014 , H01L2924/09701 , H01L2924/00
摘要： The sensor assembly comprises a substrate (1), such as a flexible printed circuit board, and a sensor chip (2) flip-chip mounted to the substrate (1), with a first side (3) of the sensor chip (2) facing the substrate (1). A sensing area (4) and contact pads (5) are integrated on the first side (3) of the sensor chip (2). Underfill (18) and/or solder flux is arranged between the sensor chip (2) and the substrate (1). The sensor chip (2) extends over an edge (12) of the substrate (1), with the edge (12) of the substrate (1) extending between the contact pads (5) and the sensing area (4) over the whole sensor chip (2). A dam (16) can be provided along the edge (12) of the substrate (1) for even better separation of the underfill (18) and the sensing area (4). This de sign allows for a simple alignment of the sensor chip on the substrate (1) and prevents underfill (18) from covering the sensing area (4).
摘要翻译：该传感器组件包括一个衬底（1），例如柔性印刷电路板，以及安装在衬底（1）上的传感器芯片（2）倒装芯片，其中传感器芯片（2）的第一侧（3）面向基板（1）。感测区域（4）和接触焊盘（5）集成在传感器芯片（2）的第一侧（3）上。在传感器芯片（2）和基板（1）之间布置有底部填充物（18）和/或焊剂。传感器芯片（2）在衬底（1）的边缘（12）上延伸，衬底（1）的边缘（12）在整个接触焊盘（5）和感测区域（4）之间延伸传感器芯片（2）。可以沿着基板（1）的边缘（12）设置坝（16），以便更好地分离底部填充物（18）和感测区域（4）。该符号允许传感器芯片在衬底（1）上的简单对准，并且防止底部填充物（18）覆盖感测区域（4）。

9. 发明授权

US08156815B2 Sensor in a moulded package and a method for manufacturing the same 有权
标题翻译：模制包装中的传感器及其制造方法
公开(公告)号：US08156815B2
公开(公告)日：2012-04-17
申请号：US12660289
申请日：2010-02-24
申请人： Werner Hunziker , Felix Mayer
发明人： Werner Hunziker , Felix Mayer
IPC分类号： G01L7/00
CPC分类号： G01D11/245 , G01F1/684 , G01F1/6845 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , Y10T29/49158 , H01L2924/00014 , H01L2924/00012
摘要： The flow sensor or other type of sensor comprises a package having a cylindrical section arranged between an anchor section and a head section. The diameter of the anchor section is typically larger than the diameter of the cylindrical section, which in turn is typically larger than the diameter of the head section. A sensor chip is embedded partially into the package, with a sensitive area being exposed to the surroundings. The sensor can e.g. be inserted into a bore having a diameter matching the one of the cylindrical section.
摘要翻译：流量传感器或其它类型的传感器包括具有布置在锚定部分和头部部分之间的圆柱形部分的包装。锚固部分的直径通常大于圆柱形部分的直径，该直径通常大于头部部分的直径。传感器芯片部分地嵌入到封装中，敏感区域暴露于周围环境。传感器可以例如插入具有与圆柱形部分中的一个相匹配的直径的孔中。

10. 发明申请

US20110306279A1 Blasting nozzle for a device for blast-machining or abrasive blasting objects 有权
标题翻译：用于爆破加工或喷砂处理物体的喷砂器
公开(公告)号：US20110306279A1
公开(公告)日：2011-12-15
申请号：US13034558
申请日：2011-02-24
申请人： Werner HUNZIKER
发明人： Werner HUNZIKER
IPC分类号： B24C5/04
CPC分类号： B24C7/0046 , B24C7/0023 , B24C7/0038 , B24C7/0061 , B24C9/003 , B24C9/006 , Y02P70/179
摘要： A device (33) for blast-machining or abrasive blasting objects such as structural elements, tools, household objects, pots, pans or the like, has a blast pot (3) for holding a blasting abrasive (35) which is connected via at least one line (21) to a blasting nozzle (24) which extends into a blasting space (1) in which the objects which are to be blasted can be placed. Compressed air is introduced above the blasting abrasive mixture (35) provided in the blast pot (3) by means of a pressure-generating means (43) and the blasting abrasive (35) thus being forced into the blasting space (1), the compressed air conveying via a second line (10) the granular material or the granular material mixture (35) and/or a suspension formed from granular material and liquid out of the blasting space (1) and back into the blast pot (3), which also takes the form of a pressurized space.
摘要翻译：用于爆破加工的装置（33）或诸如结构元件，工具，家用物体，锅，平底锅或类似物的喷砂处理物体的装置（33）具有用于保持喷砂磨料（35）的鼓风炉（3）至喷射喷嘴（24）的至少一条线（21），其延伸到可以放置待喷射物体的喷砂空间（1）中。压缩空气通过压力发生装置（43）被引入到设置在鼓风炉（3）中的喷砂研磨剂混合物（35）上，并且喷砂研磨剂（35）被迫进入喷砂空间（1），经由第二管线（10）将粒状材料或颗粒状混合物（35）和/或由颗粒状材料和液体形成的悬浮液输出到喷砂空间（1）内并返回到鼓风罐（3）中的压缩空气，这也采取加压空间的形式。

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