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1. 发明授权

US06137623A Modulatable reflectors and methods for using same 失效
标题翻译：可调式反射器及其使用方法
公开(公告)号：US06137623A
公开(公告)日：2000-10-24
申请号：US42836
申请日：1998-03-17
申请人： Mark W. Roberson , Glenn A. Rinne , Philip A. Deane , Karen W. Markus
发明人： Mark W. Roberson , Glenn A. Rinne , Philip A. Deane , Karen W. Markus
IPC分类号： G02B26/08 , G01S13/02 , G01S13/75 , G01S13/78 , G01S17/74 , G02B5/122 , G02B26/00
CPC分类号： G01S17/74 , G02B5/122 , G01S13/756 , G01S13/78
摘要： A reflector having a mechanically deformable portion of at least one reflective surface is disclosed. By deforming the portion of the reflective surface, discontinuity is introduced in that portion of the reflective surface. The discontinuity in the reflective surface scatters incident radiation signals so as to cause attenuation in the reflected signal. By selectively deforming the portion of the reflective surface, the reflected signal can be modulated to encode data thereon. The mechanically deformable portion of the reflective surface preferably comprises plates integrally formed therein.
摘要翻译：公开了一种具有至少一个反射表面的机械可变形部分的反射器。通过使反射表面的部分变形，在反射表面的该部分中引入不连续性。反射表面中的不连续性散射入射辐射信号，从而导致反射信号中的衰减。通过选择性地使反射表面的部分变形，可以调制反射信号以在其上编码数据。反射表面的机械可变形部分优选地包括一体地形成在其中的板。

2. 发明授权

US06233088B1 Methods for modulating a radiation signal 有权
标题翻译：调制辐射信号的方法
公开(公告)号：US06233088B1
公开(公告)日：2001-05-15
申请号：US09636141
申请日：2000-08-10
申请人： Mark W. Roberson , Glenn A. Rinne , Philip A. Deane , Karen W. Markus
发明人： Mark W. Roberson , Glenn A. Rinne , Philip A. Deane , Karen W. Markus
IPC分类号： G02B2600
CPC分类号： G01S17/74 , G01S13/756 , G01S13/78 , G02B5/122
摘要： A reflector having a mechanically deformable portion of at least one reflective surface is disclosed. By deforming the portion of the reflective surface, discontinuity is introduced in that portion of the reflective surface. The discontinuity in the reflective surface scatters incident radiation signals so as to cause attenuation in the reflected signal. By selectively deforming the portion of the reflective surface, the reflected signal can be modulated to encode data thereon. The mechanically deformable portion of the reflective surface preferably comprises plates integrally formed therein.
摘要翻译：公开了一种具有至少一个反射表面的机械可变形部分的反射器。通过使反射表面的部分变形，在反射表面的该部分中引入不连续性。反射表面中的不连续性散射入射辐射信号，从而导致反射信号中的衰减。通过选择性地使反射表面的部分变形，可以调制反射信号以在其上编码数据。反射表面的机械可变形部分优选地包括一体地形成在其中的板。

3. 发明授权

US5793116A Microelectronic packaging using arched solder columns 失效
公开(公告)号：US5793116A
公开(公告)日：1998-08-11
申请号：US654539
申请日：1996-05-29
申请人： Glenn A. Rinne , Philip A. Deane
发明人： Glenn A. Rinne , Philip A. Deane
IPC分类号： H05K1/14 , H01L23/485 , H01L25/00 , H01L25/065 , H01L25/10 , H05K3/30 , H05K3/36 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/10 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/065 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/13 , H01L2224/13099 , H01L2224/16105 , H01L2224/16108 , H01L2225/06513 , H01L2225/0652 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/1058 , H01L2225/1064 , H01L2225/107 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H05K3/306
摘要： Microelectronic packages are formed wherein solder bumps on one or more substrates are expanded, to thereby extend and contact the second substrate and form a solder connection. The solder bumps are preferably expanded by reflowing additional solder into the plurality of solder bumps. The additional solder may be reflowed from an elongated, narrow solder-containing region adjacent the solder bump, into the solder bump. After reflow, the solder bump which extends across a pair of adjacent substrates forms an arched solder column or partial ring of solder between the two substrates.

4. 发明授权

US5963793A Microelectronic packaging using arched solder columns 失效
标题翻译：微电子封装采用拱形焊料柱
公开(公告)号：US5963793A
公开(公告)日：1999-10-05
申请号：US96754
申请日：1998-06-12
申请人： Glenn A. Rinne , Philip A. Deane
发明人： Glenn A. Rinne , Philip A. Deane
IPC分类号： H05K1/14 , H01L23/485 , H01L25/00 , H01L25/065 , H01L25/10 , H05K3/30 , H05K3/36 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/10 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/065 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/13 , H01L2224/13099 , H01L2224/16105 , H01L2224/16108 , H01L2225/06513 , H01L2225/0652 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/1058 , H01L2225/1064 , H01L2225/107 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H05K3/306
摘要： Microelectronic packages are formed wherein solder bumps on one or more substrates are expanded, to thereby extend and contact the second substrate and form a solder connection. The solder bumps are preferably expanded by reflowing additional solder into the plurality of solder bumps. The additional solder may be reflowed from an elongated, narrow solder-containing region adjacent the solder bump, into the solder bump. After reflow, the solder bump which extends across a pair of adjacent substrates forms an arched solder column or partial ring of solder between the two substrates.
摘要翻译：形成微电子封装，其中在一个或多个衬底上的焊料凸块被扩张，从而延伸和接触第二衬底并形成焊接连接。焊料凸起优选通过将附加焊料回流到多个焊料凸块来扩展。附加的焊料可以从与焊料凸块相邻的细长的，含有焊料的狭窄区域回流到焊料凸块中。在回流之后，延伸穿过一对相邻基板的焊料凸块在两个基板之间形成拱形焊料柱或部分焊料环。

5. 发明授权

US07994043B1 Lead free alloy bump structure and fabrication method 有权
标题翻译：无铅合金凸块结构及制造方法
公开(公告)号：US07994043B1
公开(公告)日：2011-08-09
申请号：US12108909
申请日：2008-04-24
申请人： J. Daniel Mis , Glenn A. Rinne
发明人： J. Daniel Mis , Glenn A. Rinne
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/0345 , H01L2224/03462 , H01L2224/03472 , H01L2224/0401 , H01L2224/05027 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05186 , H01L2224/05564 , H01L2224/05572 , H01L2224/05655 , H01L2224/1145 , H01L2224/1146 , H01L2224/1147 , H01L2224/11472 , H01L2224/11502 , H01L2224/11849 , H01L2224/119 , H01L2224/11901 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2924/00013 , H01L2924/0002 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/04941 , H01L2224/05552 , H01L2924/00
摘要： A method includes forming a patterned resist layer comprising a resist layer opening overlying a bond pad of a substrate. The resist layer opening is at least partially filled with a first solder component layer. A second solder component layer is formed on the first solder component layer. The patterned resist layer is removed. The first solder component layer and the second solder component layer are reflowed to form a lead free binary metal alloy solder bump electrically connected to the bond pad.
摘要翻译：一种方法包括形成图案化的抗蚀剂层，其包括开口覆盖在基底的接合焊盘上的抗蚀层。抗蚀剂层开口至少部分地填充有第一焊料组分层。在第一焊料组分层上形成第二焊料组分层。去除图案化的抗蚀剂层。第一焊料组分层和第二焊料组分层被回流以形成电连接到焊盘的无铅二元金属合金焊料凸块。

6. 发明申请

US20110037171A1 Electronic Structures Including Barrier Layers and/or Oxidation Barriers Defining Lips and Related Methods 有权
标题翻译：电子结构包括屏障层和/或氧化屏障定义嘴唇和相关方法
公开(公告)号：US20110037171A1
公开(公告)日：2011-02-17
申请号：US12907430
申请日：2010-10-19
申请人： Glenn A. Rinne , J. Daniel Mis
发明人： Glenn A. Rinne , J. Daniel Mis
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05178 , H01L2224/05181 , H01L2224/05184 , H01L2224/05557 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05657 , H01L2224/05664 , H01L2224/05669 , H01L2224/11334 , H01L2224/1147 , H01L2224/11472 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2924/0001 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/062 , H05K3/243 , H05K2201/0367 , H05K2201/09436 , H05K2203/054 , H05K2203/0723 , H01L2924/00014 , H01L2924/013
摘要： An electronic device may include a substrate, a seed layer on the substrate, a barrier layer on the seed layer opposite the substrate, and an oxidation barrier on the barrier layer opposite the seed layer. The barrier layer and the seed layer comprise different materials, and the oxidation barrier and the barrier layer may comprise different materials. The seed layer may be undercut relative to the barrier layer and/or relative to the oxidation barrier so that the barrier layer and/or the oxidation barrier define a lip extending beyond the seed layer in a direction parallel with respect to a surface of the substrate. Related methods are also discussed.
摘要翻译：电子器件可以包括衬底，衬底上的种子层，与衬底相对的种子层上的阻挡层以及与种子层相对的阻挡层上的氧化屏障。阻挡层和种子层包含不同的材料，氧化屏障和阻挡层可以包括不同的材料。种子层可以相对于阻挡层和/或相对于氧化屏障而被切削，使得阻挡层和/或氧化屏障在相对于衬底的表面平行的方向上限定延伸超过种子层的唇缘。还讨论了相关方法。

7. 发明授权

US07659621B2 Solder structures for out of plane connections 有权
标题翻译：用于不平面连接的焊接结构
公开(公告)号：US07659621B2
公开(公告)日：2010-02-09
申请号：US11362964
申请日：2006-02-27
申请人： Glenn A. Rinne
发明人： Glenn A. Rinne
IPC分类号： H01L23/48
CPC分类号： H01L23/48 , H01L21/44 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/02175 , H01L2224/0401 , H01L2224/05555 , H01L2224/10145 , H01L2224/1146 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/13006 , H01L2224/13017 , H01L2224/13027 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/94 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/3442 , H05K2201/09381 , H05K2201/10674 , H05K2203/0465 , Y02P70/613 , H01L2224/11 , H01L21/78 , H01L2924/01083 , H01L2924/01031 , H01L2924/01048 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00014
摘要： Methods of forming a solder structure may include providing a wafer including a plurality of die therein, and a solder wettable pad may be formed on one of the die adjacent an edge of the die. The solder wettable pad may have a length parallel to the edge of the die and a width perpendicular to the edge of the die wherein the length parallel to the edge of the die is greater than the width perpendicular to the edge of the die. A solder bump may be plated on the solder wettable pad, and the die may be separated from the wafer along the edge of the die after plating the solder bump on the solder wettable pad. Moreover, the solder bump may be reflowed on the solder wettable pad so that the solder structure extends laterally from the solder wettable pad beyond the edge of the die after separating the die from the wafer. Related structures are also discussed.
摘要翻译：形成焊料结构的方法可以包括在其中提供包括多个管芯的晶片，并且可以在与管芯的边缘相邻的管芯中的一个上形成焊料可湿性焊盘。焊料可湿性垫可以具有平行于管芯边缘的长度和垂直于管芯边缘的宽度，其中平行于管芯的边缘的长度大于垂直于管芯边缘的宽度。可将焊料凸块电镀在焊料可湿性垫上，并且在将焊料凸块镀在焊料可润湿垫上之后，可以沿着模具的边缘将晶片与晶片分离。此外，焊料凸块可以在焊料可润湿垫上回流，使得焊料结构从焊料可润湿垫横向延伸超过模具的边缘，从而将晶片与晶片分离。还讨论了相关结构。

8. 发明申请

US20080308931A1 Electronic Structures Including Barrier Layers Defining Lips 有权
标题翻译：电子结构包括屏障层定义嘴唇
公开(公告)号：US20080308931A1
公开(公告)日：2008-12-18
申请号：US12194999
申请日：2008-08-20
申请人： Glenn A. Rinne , J. Daniel Mis
发明人： Glenn A. Rinne , J. Daniel Mis
IPC分类号： H01L23/498
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05178 , H01L2224/05181 , H01L2224/05184 , H01L2224/05557 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05657 , H01L2224/05664 , H01L2224/05669 , H01L2224/11334 , H01L2224/1147 , H01L2224/11472 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2924/0001 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/062 , H05K3/243 , H05K2201/0367 , H05K2201/09436 , H05K2203/054 , H05K2203/0723 , H01L2924/00014 , H01L2924/013
摘要： Forming an electronic structure may include forming a seed layer on a substrate, and forming a mask on the seed layer. The mask may include an aperture therein exposing a portion of the seed layer, and a barrier layer may be formed on the exposed portion of the seed layer. A bump may be formed on the barrier layer, and the mask may be removed. In addition, portions of the seed layer may be selectively removed using the barrier layer as an etch mask.
摘要翻译：形成电子结构可以包括在基底上形成种子层，并在种子层上形成掩模。掩模可以包括其中露出种子层的一部分的孔，并且阻挡层可以形成在种子层的暴露部分上。可以在阻挡层上形成凸起，并且可以去除掩模。此外，可以使用阻挡层作为蚀刻掩模来选择性地去除种子层的部分。

9. 发明授权

US06863209B2 Low temperature methods of bonding components 有权
标题翻译：粘接部件的低温方法
公开(公告)号：US06863209B2
公开(公告)日：2005-03-08
申请号：US10017350
申请日：2001-12-14
申请人： Glenn A. Rinne , Krishna K. Nair
发明人： Glenn A. Rinne , Krishna K. Nair
IPC分类号： B23K1/00 , B23K31/02
CPC分类号： G02B6/3628 , B23K1/0004 , G02B6/3636 , G02B6/3692
摘要： Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the metal while bonding. Related structures are also discussed.
摘要翻译：粘合两个部件的方法可以包括相对于彼此定位组件以获得期望的取向。一旦获得了所需的取向，就可以将金属成分按期望的方向与金属结合，其中两种成分的温度在粘合时保持在金属的熔融温度以下。还讨论了相关结构。

10. 发明授权

US06492197B1 Trilayer/bilayer solder bumps and fabrication methods therefor 有权
标题翻译：三层/双层焊料凸块及其制造方法
公开(公告)号：US06492197B1
公开(公告)日：2002-12-10
申请号：US09576477
申请日：2000-05-23
申请人： Glenn A. Rinne
发明人： Glenn A. Rinne
IPC分类号： H01L2144
CPC分类号： H01L24/12 , H01L21/4853 , H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/11462 , H01L2224/1147 , H01L2224/11472 , H01L2224/11502 , H01L2224/11849 , H01L2224/11901 , H01L2224/13017 , H01L2224/1308 , H01L2224/131 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H05K3/3463 , H05K3/3473 , H05K2201/10992 , H01L2224/13099 , H01L2924/00
摘要： Solder bumps are fabricated by plating a first solder layer on an underbump metallurgy, plating a second solder layer having higher melting point than the first solder layer on the first solder layer and plating a third solder layer having lower melting point than the second solder layer on the second solder layer. The structure then is heated to below the melting point of the second solder layer but above the melting point of the first solder layer and the third solder layer, to alloy at least some of the first solder layer with at least some of the underbump metallurgy and to round the third solder layer. Accordingly, a trilayer solder bump may be fabricated wherein the first and third layers melt at lower temperatures than the second solder layer, to thereby round the outer surface of the solder bump and alloy the base of the solder bump to the underbump metallurgy, while allowing the structure of the intermediate layer to be preserved. Solder bump fabrication as described above may be particularly useful with lead-tin solder wherein the first solder layer is eutectic lead-tin solder, the second solder layer is lead-tin solder having higher lead content than eutectic lead-tin solder and the third solder layer is eutectic lead-tin solder. In yet other embodiments, the thickness and/or composition of the outer underbump metallurgy layer and/or of the first solder layer may be selected so that upon heating, sufficient tin from the first solder layer is alloyed with at least some of the outer underbump metallurgy layer, such that the first solder layer is converted to a fourth solder layer having the same lead content as the second solder layer. Bilayer solder bumps thereby may be provided.
摘要翻译：通过在下焊管冶金上电镀第一焊料层，在第一焊料层上电镀具有比第一焊料层更高的熔点的第二焊料层并且将具有比第二焊料层低的熔点的第三焊料层电镀到第二焊料层上来制造焊料凸块第二焊料层。然后将该结构加热到低于第二焊料层的熔点但高于第一焊料层和第三焊料层的熔点，以使第一焊料层中的至少一些与至少一些下焊管冶金和绕第三个焊料层。因此，可以制造三层焊料凸块，其中第一和第三层在比第二焊料层更低的温度下熔化，从而使焊料凸块的外表面圆周化，并将焊料凸块的底部合金到底部焊接冶金，同时允许待保存的中间层的结构。如上所述的焊料凸块制造对于铅锡焊料尤其有用，其中第一焊料层是共晶铅锡焊料，第二焊料层是比共晶铅锡焊料具有更高铅含量的铅锡焊料，而第三焊料层是共晶铅锡焊料。在另外的其它实施例中，可以选择外部底部基质金属层和/或第一焊料层的厚度和/或组成，使得在加热时，来自第一焊料层的足够的锡与至少一些外部底部基底使得第一焊料层被转换成具有与第二焊料层相同的铅含量的第四焊料层。可以提供双层焊料凸块。

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