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    • 1. 发明授权
    • Methods of fabricating microneedle arrays using sacrificial molds, and microneedle arrays fabricated thereby
    • 使用牺牲模具制造微针阵列的方法和由此制造的微针阵列
    • US07332197B2
    • 2008-02-19
    • US10304277
    • 2002-11-26
    • Robert L. WoodHenry A. WynandsKaren W. Markus
    • Robert L. WoodHenry A. WynandsKaren W. Markus
    • B05D7/22B05D1/36
    • B81C99/0085A61B5/14514A61B5/150022A61B5/150282A61B5/150984A61M37/0015A61M2037/003A61M2037/0053B81B2201/055Y10T29/302Y10T29/49222
    • Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold. The first material preferably is coated on the sacrificial mold by plating. Prior to plating, a plating base preferably is formed on the sacrificial mold including on the substrate and on the array of posts. The inner and outer surfaces of the array of hollow tubes preferably are coated with the second material by overplating the second material on the inner and outer surfaces of the array of hollow tubes.
    • 微针阵列通过提供包括基底和从其突出的柱的阵列(优选固体柱)的牺牲模具来制造。 第一材料涂覆在牺牲模具上,包括在基板上和柱阵列上。 去除牺牲模具以提供从基部突出的中空管阵列。 中空管阵列的内表面和外表面涂覆有第二材料以产生从基底突出的微针阵列。 牺牲模具可以通过制造主模具来制造,该模具包括从其表面延伸到主模具中的通道阵列。 将第三种材料模制到通道中并在母模的表面上,以形成牺牲模具。 然后将牺牲模具与主模具分离。 或者,引线接合可用于将线阵列引线接合到基底以产生牺牲模。 第一种材料优选通过电镀涂覆在牺牲模具上。 在电镀之前,优选在包括在基板和柱阵列上的牺牲模具上形成镀覆基底。 优选地,中空管阵列的内表面和外表面通过在中空管阵列的内表面和外表面上的第二材料的上镀敷而涂覆有第二材料。
    • 6. 发明授权
    • Method for fabricating a microelectromechanical bearing
    • 微机电轴承的制造方法
    • US06555201B1
    • 2003-04-29
    • US09570628
    • 2000-05-15
    • Vijayakumar R. DhulerDavid A. KoesterMark D. WaltersKaren W. Markus
    • Vijayakumar R. DhulerDavid A. KoesterMark D. WaltersKaren W. Markus
    • B32B310
    • G02B26/0841B81B3/0051B81B2201/042B81B2203/058G02B26/101Y10S359/90Y10T428/24273Y10T428/24322Y10T428/24355Y10T428/24479
    • An electromechanical device includes a first frame having a first aperture therein, a second frame suspended in the first frame wherein the second frame has a second aperture therein, and a plate suspended in the second aperture. A first pair of beams support the second frame along a first axis relative to the first frame so that the second frame rotates about the first axis. A second pair of beams supports the plate along a second axis relative to the second frame so that the plate rotates about the second axis relative to the frame. The first and second axes preferably intersect at a 90° angle. A first actuator provides mechanical force for rotating the second frame relative to the first frame about the first axis. A second actuator provides mechanical force for rotating the plate relative to the second frame about the second axis. Accordingly, the plate can be independently rotated relative to the first axis and the second axis. Related methods are also disclosed.
    • 机电装置包括其中具有第一孔的第一框架,悬挂在第一框架中的第二框架,其中第二框架在其中具有第二孔,以及悬挂在第二孔中的板。 第一对梁相对于第一框架沿着第一轴线支撑第二框架,使得第二框架围绕第一轴线旋转。 第二对梁相对于第二框架沿着第二轴支撑板,使得板相对于框架围绕第二轴线旋转。 第一和第二轴优选地以90°的角度相交。 第一致动器提供用于使第二框架围绕第一轴线相对于第一框架旋转的机械力。 第二致动器提供用于相对于第二框架围绕第二轴线旋转板的机械力。 因此,板可以相对于第一轴线和第二轴线独立地旋转。 还公开了相关方法。
    • 7. 发明授权
    • Methods of fabricating microneedle arrays using sacrificial molds
    • 使用牺牲模具制造微针阵列的方法
    • US06511463B1
    • 2003-01-28
    • US09442827
    • 1999-11-18
    • Robert L. WoodHenry A. WynandsKaren W. Markus
    • Robert L. WoodHenry A. WynandsKaren W. Markus
    • A61M500
    • B81C99/0085A61B5/14514A61B5/150022A61B5/150282A61B5/150984A61M37/0015A61M2037/003A61M2037/0053B81B2201/055Y10T29/302Y10T29/49222
    • Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold. The first material preferably is coated on the sacrificial mold by plating. Prior to plating, a plating base preferably is formed on the sacrificial mold including on the substrate and on the array of posts. The inner and outer surfaces of the array of hollow tubes preferably are coated with the second material by overplating the second material on the inner and outer surfaces of the array of hollow tubes.
    • 微针阵列通过提供包括基底和从其突出的柱的阵列(优选固体柱)的牺牲模具来制造。 第一材料涂覆在牺牲模具上,包括在基板上和柱阵列上。 去除牺牲模具以提供从基部突出的中空管阵列。 中空管阵列的内表面和外表面涂覆有第二材料以产生从基底突出的微针阵列。 牺牲模具可以通过制造主模具来制造,该模具包括从其表面延伸到主模具中的通道阵列。 将第三种材料模制到通道中并在母模的表面上,以形成牺牲模具。 然后将牺牲模具与主模具分离。 或者,引线接合可用于将线阵列引线接合到基底以产生牺牲模。 第一种材料优选通过电镀涂覆在牺牲模具上。 在电镀之前,优选在包括在基板和柱阵列上的牺牲模具上形成镀覆基底。 优选地,中空管阵列的内表面和外表面通过在中空管阵列的内表面和外表面上的第二材料的上镀敷而涂覆有第二材料。