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    • 3. 发明授权
    • Techniques for tiling arrays of pixel elements
    • 平铺像素元素阵列的技术
    • US09163995B2
    • 2015-10-20
    • US13656711
    • 2012-10-21
    • Joseph Donald LaVeigneJohn LañnonScott GoodwinJason Kulick
    • Joseph Donald LaVeigneJohn LañnonScott GoodwinJason Kulick
    • G01J5/02G01J5/20
    • G01J5/02G01J5/20Y10T29/49002Y10T29/49117
    • Sub-arrays such as tiles or chips having pixel elements arranged on a routing layer or carrier to form a larger array. Through-chip vias or the like to the backside of the chip are used for connecting with the pixel elements. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. Edge damage tolerance with minimal loss of function may be achieved by moving unit cell circuitry and the electrically active portions of a pixel element away from the tile edge(s) while leaving the optically active portion closer to the edge(s) if minor damage will not cause a complete failure of the pixel. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like. Various architectures are disclosed.
    • 诸如瓦片或芯片的子阵列具有布置在路由层或载体上的像素元件以形成更大的阵列。 用于芯片背面的通孔等用于与像素元件连接。 瓦片的边缘特征可以提供物理对准,机械连接和芯片到芯片通信。 可以通过将单元电池电路和像素元件的电活动部分远离瓦片边缘移动,同时使光学有效部分更靠近边缘(如果较小的损坏)将使光学有效部分更接近边缘,则可以实现具有最小功能损失的边缘损伤容限 不会导致像素完全失效。 像素元件可以是用于IR图像投影仪的热发射元件,用于微测辐射热计的热检测器元件,基于LED的发射器,或诸如在可见光,红外和紫外线FPAs(焦平面阵列)中发现的量子光子检测器等)。 公开了各种架构。