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    • 3. 发明授权
    • Hot melt pressure sensitive adhesive designed for use on high density
spun polyolefin film
    • 设计用于高密度聚丙烯薄膜的热熔压敏胶
    • US5869562A
    • 1999-02-09
    • US829712
    • 1997-03-28
    • Jeffrey S. LindquistJanelle C. CameronEugene R. Simmons
    • Jeffrey S. LindquistJanelle C. CameronEugene R. Simmons
    • C09J153/02C08L53/02C08L57/02C08L93/04
    • C09J153/02
    • This invention relates to an envelope coated with a hot melt pressure sensitive adhesive composition preferably comprising a) from about 10% to about 40% by weight in the adhesive of at least one block copolymer selected from the group consisting of styrene-isoprene-styrene block copolymers, styrene-butadiene-styrene block copolymers and mixtures thereof wherein the block copolymers comprise from about 15% to about 35% styrene by weight in the copolymer and diblock contents from about 0% to about 90% by weight in the copolymer; and b) from about 60% to about 90% by weight in the adhesive of a modifier selected from the group consisting of solid tackifying resins, liquid tackifying resins, liquid elastomers and mixtures thereof. The invention further relates to an improved oil-free pressure sensitive adhesive that is low in viscosity and provides a destructive bond and resists deformation of high density spun polyolefin materials.
    • 本发明涉及涂覆有热熔压敏粘合剂组合物的外壳,优选地包含a)粘合剂中约10%至约40%重量的至少一种选自苯乙烯 - 异戊二烯 - 苯乙烯嵌段 共聚物,苯乙烯 - 丁二烯 - 苯乙烯嵌段共聚物及其混合物,其中嵌段共聚物在共聚物中包含约15重量%至约35重量%的苯乙烯,在共聚物中包含约0重量%至约90重量%的二嵌段含量; 和b)在选自固体增粘树脂,液体增粘树脂,液体弹性体及其混合物的改性剂的粘合剂中约60重量%至约90重量%。 本发明还涉及一种改进的无油压敏粘合剂,该粘合剂具有低粘度并提供破坏性粘合并且抵抗高密度纺丝聚烯烃材料的变形。