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    • 2. 发明授权
    • Method for airfoil electroplating
    • 翼型电镀方法
    • US07560014B2
    • 2009-07-14
    • US12194732
    • 2008-08-20
    • Michael RuckerBhupendra K. Gupta
    • Michael RuckerBhupendra K. Gupta
    • C25D5/00C25D5/50
    • C25D17/008Y10S204/07Y10T428/12736
    • A method is provided for electroplating a high temperature coating onto an airfoil. The method includes providing a shield having a recess defining one or more walls conforming to the shape of at least a portion of a pressure side and a suction side of the airfoil to be electroplated, introducing the portions of the pressure side and the suction side of the airfoil to be electroplated into the recess of the shield, attaching an anode and cathode to the airfoil, submerging at least the shield and the portions of the pressure side and the suction side of the airfoil to be electroplated into an electroplating tank containing an electrolyte, and electroplating a coating of a high temperature resistant metal onto the portions of the pressure side and the suction side of the airfoil to be electroplated to a predetermined minimum thickness.
    • 提供了一种将高温涂层电镀到翼型上的方法。 该方法包括提供一种屏蔽件,其具有限定一个或多个壁的凹部,所述壁符合要电镀的翼型件的压力侧和吸力侧的至少一部分的形状,将压力侧和吸力侧的部分 要电镀到屏蔽件的凹槽中的翼型件,将阳极和阴极附接到翼型件上,至少将屏蔽件淹没,将翼型的压力侧和吸力侧的部分浸入电镀槽中,该电镀槽包含电解液 并将耐高温金属的涂层电镀到要被电镀的翼型的压力侧和吸力侧的部分至预定的最小厚度。
    • 7. 发明申请
    • METHOD AND APPARATUS FOR AIRFOIL ELECTROPLATING, AND AIRFOIL
    • 用于气膜电镀的方法和装置,以及气翼
    • US20080302667A1
    • 2008-12-11
    • US12194732
    • 2008-08-20
    • Michael RuckerBhupendra K. Gupta
    • Michael RuckerBhupendra K. Gupta
    • C25D3/66
    • C25D17/008Y10S204/07Y10T428/12736
    • A chemically-nonreactive, electrically-nonconductive shield having a recess generally corresponding to the shape of an airfoil portion to be positioned therein. The shield is submerged in an electroplating solution in a plating tank. The recess in the shield is sized to provide a predetermined, closely-spaced apart clearance gap between walls of the recess and the adjacent airfoil portion sufficient to reduce the flow rate of an electrolyte present in the electroplating solution between walls of the recess and the adjacent airfoil portion. The clearance gap permits control of the amount of electroplating that is deposited on the airfoil portion that is positioned within the recess in relation to portions of the airfoil not positioned within the recess.
    • 一种化学非反应性的非导电屏蔽,其具有通常对应于待定位在其中的翼型部分的形状的凹部。 屏蔽层浸没在电镀槽中的电镀溶液中。 屏蔽件中的凹部的尺寸被设计成在凹部的壁和邻近的翼型部分之间提供预定的,间隔较短的间隙,其足以减少存在于电镀溶液中的电解质在凹槽和相邻的壁之间的流速 机翼部分。 所述间隙允许控制相对于未位于凹槽内的翼型件的部分,沉积在位于凹部内的翼型部分上的电镀量。
    • 9. 发明申请
    • Method and apparatus for airfoil electroplating, and airfoil
    • 翼型电镀和翼型的方法和装置
    • US20060275624A1
    • 2006-12-07
    • US11146964
    • 2005-06-07
    • Michael RuckerBhupendra Gupta
    • Michael RuckerBhupendra Gupta
    • B32B19/00B32B9/00B32B15/01
    • C25D17/008Y10S204/07Y10T428/12736
    • A chemically-nonreactive, electrically-nonconductive shield having a recess generally corresponding to the shape of an airfoil portion to be positioned therein. The shield is submerged in an electroplating solution in a plating tank. The recess in the shield is sized to provide a predetermined, closely-spaced apart clearance between walls of the recess and the adjacent airfoil portion sufficient to reduce the flow rate of an electrolyte present in the electroplating solution between walls of the recess and the adjacent airfoil portion. The clearance permits control of the amount of electroplating that is deposited on the portion of the airfoil that is positioned in the recess in relation to portions of the airfoil not positioned in the recess.
    • 一种化学非反应性的非导电屏蔽,其具有通常对应于待定位在其中的翼型部分的形状的凹部。 屏蔽层浸没在电镀槽中的电镀溶液中。 屏蔽件中的凹槽的尺寸被设计成在凹部的壁和相邻的翼型部分之间提供预定的,间隔较短的间隙,其足以减少存在于凹槽壁和相邻翼型之间的电镀溶液中的电解质的流速 一部分。 该间隙允许控制相对于未位于凹部中的翼型件的部分而沉积在位于凹部中的翼型部分上的电镀量。