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    • 4. 发明授权
    • Method and structure for manufacture of light emitting diode devices using bulk GaN
    • 使用体GaN制造发光二极管器件的方法和结构
    • US08252662B1
    • 2012-08-28
    • US12749476
    • 2010-03-29
    • Christiane PoblenzMathew C. SchmidtDaniel F. FeezellJames W. RaringRajat Sharma
    • Christiane PoblenzMathew C. SchmidtDaniel F. FeezellJames W. RaringRajat Sharma
    • H01L21/30
    • H01L33/007H01L33/0079H01L33/0095
    • A method for manufacturing a plurality light emitting diodes includes providing a gallium nitride containing bulk crystalline substrate material configured in a non-polar or semi-polar crystallographic orientation, forming an etch stop layer, forming an n-type layer overlying the etch stop layer, forming an active region, a p-type layer, and forming a metallization. The method includes removing a thickness of material from the backside of the bulk gallium nitride containing substrate material. A plurality of individual LED devices are formed from at least a sandwich structure comprising portions of the metallization layer, the p-type layer, active layer, and the n-type layer. The LED devices are joined to a carrier structure. The method also includes subjecting the gallium nitride containing bulk crystalline substrate material to at least one etching process to selectively remove crystalline material underlying the etch stop layer, wherein the etch stop layer is exposed, and the etch stop layer remains substantially intact.
    • 一种用于制造多个发光二极管的方法,包括提供以非极性或半极性结晶取向配置的含氮化镓的体结晶衬底材料,形成蚀刻停止层,形成覆盖在蚀刻停止层上的n型层, 形成有源区,p型层,形成金属化。 该方法包括从块状含氮化镓的衬底材料的背面去除材料的厚度。 至少由金属化层,p型层,有源层和n型层的部分的夹层结构形成多个单独的LED器件。 LED装置连接到载体结构。 该方法还包括使含氮化镓的块状结晶衬底材料进行至少一个蚀刻工艺以选择性地去除蚀刻停止层下方的结晶材料,其中蚀刻停止层被暴露,并且蚀刻停止层基本保持不变。