专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5061776A Modified polyurethane flow-under thermal transfer adhesive 失效
标题翻译：改性聚氨酯流动传热粘合剂
公开(公告)号：US5061776A
公开(公告)日：1991-10-29
申请号：US615932
申请日：1990-11-19
申请人： Mark A. Weaver , Lynn E. Long , Steven E. Lau
发明人： Mark A. Weaver , Lynn E. Long , Steven E. Lau
IPC分类号： C08G18/66 , C08G18/40 , C08G18/65 , C09J175/00 , C09J175/04 , H01B1/20 , H05K3/30
CPC分类号： C08G18/4045 , C08G18/6547 , C09J175/04 , H05K3/305 , Y02P70/613
摘要： A thermal transfer adhesive composition which is applied after electronic components have been installed on a printed wiring board, comprising:(a) 30 to 70 weight percent of an aliphatic diisocyanate or triisocyanate prepolymer;(b) 5 to 15 weight percent of a polyether diol or triol;(c) 20 to 40 weight percent of castor oil;(d) 5 to 20 weight percent of an epoxy resin containing 2 or more hydroxyl group;(e) 0.006 to 0.008 weight percent of a catalyst for the reaction of isocyanate groups with hydroxyl groups. The cured product is hydrolytically stable at 185.degree. F. and 95 percent relative humidity and has a good storage life when frozen. Alternatively, the composition may also include a pigment.
摘要翻译：将电子部件安装在印刷电路板上之后施加的热转印粘合剂组合物，其包含：（a）30〜70重量％的脂肪族二异氰酸酯或三异氰酸酯预聚物; （b）5〜15重量％的聚醚二醇或三醇; （c）20至40重量％的蓖麻油; （d）5〜20重量％的含有2个以上羟基的环氧树脂; （e）0.006〜0.008重量％的异氰酸酯基与羟基反应的催化剂。固化产物在185°F和95％相对湿度下水解稳定，冷冻时具有良好的储存寿命。或者，组合物还可以包括颜料。

2. 发明授权

US5385966A Frozen premix, fillet-holding urethane adhesives/sealants 失效
标题翻译：冷冻预混料，夹芯聚氨酯胶粘剂/密封剂
公开(公告)号：US5385966A
公开(公告)日：1995-01-31
申请号：US188667
申请日：1994-01-28
申请人： Ralph D. Hermansen , Steven E. Lau
发明人： Ralph D. Hermansen , Steven E. Lau
IPC分类号： C08L75/04 , C08K3/00 , C08K9/06 , C08L75/00 , C09J175/00 , C09J175/04 , C09J175/14 , C09K3/10 , C08J3/20 , C08K3/26 , C08F8/30
CPC分类号： C09K3/1021 , C08K3/0033 , C08K9/06 , C09J175/04 , C09J175/14 , C09K2003/1071 , C09K2200/0213 , C09K2200/0243 , C09K2200/0247 , Y10S525/92
摘要： Adhesives and sealants, based on polyurethane reactants, are provided. The one-component frozen premix material of the invention comprises: (a) up to about 60 vol % of at least one filler; (b) about 0.5 to 5 wt % of a thixotrope comprising hydrophobic fumed silica; and (c) the balance a urethane matrix. The urethane matrix comprises at least one polyol that includes at least one carbon-carbon double bond in its backbone and has less than 20 wt % of ether and ester moieties, at least one aliphatic polyisocyanate in stoichiometric amount relative to the polyol, and about 0.01 to 0.1 wt % of an organo-metallic catalyst. The urethanes of the invention can be stored as one-component, frozen, premix materials for a minimum of three months, and, when thawed, can be applied with a spatula or trowel to form non-sag fillets. The cured elastomers are free of voids, tears, or bubbles.
摘要翻译：提供基于聚氨酯反应物的粘合剂和密封剂。本发明的单组分冷冻预混材料包括：（a）至多约60vol％的至少一种填料; （b）约0.5至5重量％的包含疏水性热解法二氧化硅的触变剂; 和（c）氨基甲酸酯基质的平衡。氨基甲酸酯基质包括至少一种多元醇，其多元醇在其主链中包含至少一个碳 - 碳双键，并且具有少于20重量％的醚和酯部分，至少一种相对于多元醇的化学计量的脂族多异氰酸酯和约0.01 至0.1重量％的有机金属催化剂。本发明的氨基甲酸酯可以作为单组分的冷冻预混材料储存至少三个月，并且当解冻时，可以用刮刀或t刀施用以形成非下垂的鱼片。固化的弹性体没有空隙，眼泪或气泡。

3. 发明授权

US5929141A Adhesive of epoxy resin, amine-terminated ban and conductive filler 失效
标题翻译：环氧树脂粘合剂，胺封端和导电填料
公开(公告)号：US5929141A
公开(公告)日：1999-07-27
申请号：US901153
申请日：1997-07-28
申请人： Steven E. Lau , Deborah S. Huff , Ralph D. Hermansen , E. Dean Johnston
发明人： Steven E. Lau , Deborah S. Huff , Ralph D. Hermansen , E. Dean Johnston
IPC分类号： C08G59/22 , C08G59/50 , C09J9/02 , C09J163/00 , H05K3/32 , C08K3/08
CPC分类号： H05K3/321 , C08G59/22 , C08G59/50 , C09J163/00 , H05K2201/0133
摘要： A flexible, electrically-conductive, one-component epoxy adhesive composition and method for making the same are provided. The present adhesive composition comprises: (a) at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45 when cured with a stoichiometric amount of diethylene triamine; (b) a substantially stoichiometric amount of curing agent including at least one amine-terminated butadiene-acrylonitrile polymer; and (c) an electrically-conductive filler. The epoxy adhesive, upon cure, has a volume resistivity not exceeding about 10.sup.-3 ohm-cm at room temperature and a drop resistance such that a 6-mil-thick (0.015 cm) bond effected by the adhesive can withstand at least six 60-inch (152 cm) drops onto a hard surface. Optional components in the epoxy adhesive include secondary rigid and semi-rigid epoxy resins, secondary amine curing agents, non-reactive flexibilizers, diluents, and processing aids. The adhesive bonds achieved using these epoxy adhesives are non-brittle, flexible, resilient, and drop-resistant, while also exhibiting strong adhesion and good processing characteristics.
摘要翻译：提供柔性导电的单组分环氧粘合剂组合物及其制备方法。本发明的粘合剂组合物包含：（a）当化学计量量的二亚乙基三胺固化时，至少一种聚环氧树脂的硬度不超过肖氏D读数约45; （b）基本上化学计量的固化剂，包括至少一种胺封端的丁二烯 - 丙烯腈聚合物; 和（c）导电填料。环氧树脂粘合剂在固化时的体积电阻率在室温下不超过约10-3欧姆 - 厘米，并且具有防滴落性，使得由粘合剂实现的6密耳厚（0.015cm）的粘合剂能够承受至少六个60 -inch（152厘米）滴在硬表面上。环氧树脂粘合剂中的任选组分包括二级刚性和半刚性环氧树脂，仲胺固化剂，非反应性增韧剂，稀释剂和加工助剂。使用这些环氧树脂粘合剂的粘合剂粘合剂是非脆性的，柔性的，有弹性的和防滴落的，同时还具有很强的附着力和良好的加工特性。

4. 发明授权

US5575956A Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives 失效
标题翻译：室温稳定，单组分，导电，柔性环氧胶粘剂
公开(公告)号：US5575956A
公开(公告)日：1996-11-19
申请号：US504002
申请日：1995-07-19
申请人： Ralph D. Hermansen , Steven E. Lau
发明人： Ralph D. Hermansen , Steven E. Lau
IPC分类号： C08G59/22 , C08G59/32 , C08G59/36 , C08G59/38 , C08G59/50 , C08G59/56 , C08K3/08 , C08L63/04 , C09J9/02 , C09J163/00 , C09J163/04 , H01B1/20 , H01B1/22
CPC分类号： H01B1/22
摘要： A flexible electrically-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises: (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore A reading of 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) an electrically-conductive filler comprising a metal. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks as a single component mixture at room temperature and is curable in less than two hours at a temperature ranging from about 100.degree. C. to 140.degree. C., whereupon the cured adhesive composition exhibits a durometer Shore A of less than 95 and a volume resistivity less than about 10.sup.-2 ohm-cm at room temperature.
摘要翻译：提供柔性导电性环氧类粘合剂组合物及其制造方法。本发明的粘合剂组合物包括：（a）当用化学计量量的二亚乙基三胺（“DETA”）固化时，包含至少一种硬度不超过硬度的肖氏A读数为45的聚环氧树脂的聚合物混合物和基本上化学计量至少一种潜在环氧树脂固化剂的量; 和（b）包含金属的导电填料。可选组分包括二级环氧树脂，非反应性增韧剂，稀释剂和加工助剂。本粘合剂组合物在室温下作为单一组分混合物流变稳定了几周，并且在约100℃至140℃的温度下在少于两小时内可固化，于是固化的粘合剂组合物显示出硬度为Shore A小于95，体积电阻率小于约10-2欧姆 - 厘米。

5. 发明授权

US5367006A Superior thermal transfer adhesive 失效
标题翻译：卓越的热转印胶
公开(公告)号：US5367006A
公开(公告)日：1994-11-22
申请号：US178341
申请日：1994-01-06
申请人： Ralph D. Hermansen , Steven E. Lau
发明人： Ralph D. Hermansen , Steven E. Lau
IPC分类号： C08G59/18 , C08G59/22 , C08G59/50 , C09J7/00 , C09J163/00 , H01B3/40 , H05K1/02 , H05K3/30 , C08K3/22 , C08K3/36 , C09J163/02 , C09J163/04 , C08G59/08 , C08G59/36 , C08G59/38
CPC分类号： H05K3/305 , C08G59/22 , C08G59/5006 , C09J163/00 , C09J7/00 , H01B3/40 , H05K1/0203 , H05K2201/0209 , H05K2203/0528 , H05K2203/1105 , Y02P70/613
摘要： A superior thermal transfer film adhesive comprises the following composition: (a) at least one aliphatic epoxy resin; (b) a stoichiometric amount of at least one aliphatic polyamine curative; (c) an effective amount of a thixotropic agent, such as fumed silica; and (d) about 20 to 50 volume percent of at least one filler, such as alumina, based on the total of the epoxy resin and the curative. The aliphatic epoxy resin has aliphatic pendant chains of 6 to 20 carbon atoms in length. The curative comprises a long chain aliphatic or cycloaliphatic curing agent for the epoxy resin. Since aliphatic moieties, which are flexible, are used, the glass transition temperature of the resulting cured material is lower than epoxies and plasticizers employing rigid moieties. The adhesive of the invention is novel in attaining high volume resistivity (at least 10.sup.14 ohm-cm at 25.degree. C.), low temperature flexibility (-55.degree. C.), excellent adhesion for maximum thermal transfer, and ease of reworkability.
摘要翻译：优异的热转印膜粘合剂包含以下组成：（a）至少一种脂族环氧树脂; （b）化学计量的至少一种脂族多胺治疗剂; （c）有效量的触变剂，如热解法二氧化硅; 和（d）约20至50体积％的至少一种填料，例如氧化铝，基于环氧树脂和固化剂的总量。脂肪族环氧树脂的长度为6〜20个碳原子的脂肪族侧链。固化剂包括用于环氧树脂的长链脂族或脂环族固化剂。由于使用柔性的脂肪族部分，所得固化材料的玻璃化转变温度低于采用刚性部分的环氧树脂和增塑剂。本发明的粘合剂在获得高体积电阻率（25℃时至少1014欧姆 - 厘米），低温柔韧性（-55℃），优异的粘合力以达到最大热转印和易于再加工性方面是新颖的。

6. 发明授权

US5965673A Epoxy-terminated prepolymer of polyepoxide and diamine with curing agent 失效
标题翻译：聚环氧化物和二胺与固化剂的环氧封端预聚物
公开(公告)号：US5965673A
公开(公告)日：1999-10-12
申请号：US835671
申请日：1997-04-10
申请人： Ralph D. Hermansen , Steven E. Lau
发明人： Ralph D. Hermansen , Steven E. Lau
IPC分类号： C08G59/06 , C08G59/08 , C08G59/40 , C08L63/00 , C08K3/36 , C08L63/02 , C08L63/04
CPC分类号： C08G59/4042 , C08G59/066 , C08G59/08
摘要： A solid, one-component, flexible epoxy-based composition and method for making the same are provided. The present compositions comprise: (a) an epoxy-terminated prepolymer formed by reacting at least four moles of a polyepoxide resin with approximately one mole of a diamine compound, wherein at least one of the polyepoxide resin and diamine compound is solid at room temperature, and wherein the prepolymer is rheologically stable for weeks as a single component mixture at room temperature and, and (b) a substantially stoichiometric amount of an epoxy resin curing agent selected from the group consisting of a heat-curable, latent epoxy resin curing agent and a room temperature-curable ketimine curing agent. Optional components include thixotropic agents, diluents, fillers, anti-oxidants, and processing aids. The present uncured epoxy-based compositions upon cure, exhibit a durometer Shore D of less than about 45 (or a durometer Shore A of less than about 100).
摘要翻译：提供固体，单组分，柔性环氧基组合物及其制备方法。本发明的组合物包括：（a）通过使至少四摩尔的聚环氧树脂与约1摩尔的二胺化合物反应形成的环氧基封端的预聚物，其中至少一种聚环氧树脂和二胺化合物在室温下是固体，并且其中所述预聚物在室温下作为单一组分混合物流变稳定数周，和（b）基本上化学计量的环氧树脂固化剂，其选自可热固化的潜在环氧树脂固化剂和室温固化的酮亚胺固化剂。任选组分包括触变剂，稀释剂，填充剂，抗氧化剂和加工助剂。目前未固化的环氧基组合物在固化时表现出小于约45的肖氏硬度（或肖氏A的硬度小于约100）。

7. 发明申请

US20100255312A1 X-Ray Opaque Coating 审中-公开
标题翻译： X射线不透明涂层
公开(公告)号：US20100255312A1
公开(公告)日：2010-10-07
申请号：US12620001
申请日：2009-11-17
申请人： Thomas K. Dougherty , Christopher T. Snively , Steven E. Lau , William J. Wolfgong , Cindy W. Ma , Stephen L. Schrader
发明人： Thomas K. Dougherty , Christopher T. Snively , Steven E. Lau , William J. Wolfgong , Cindy W. Ma , Stephen L. Schrader
IPC分类号： B32B27/38 , C09D163/00
CPC分类号： H01L23/552 , C08G59/063 , C08G59/226 , C08G59/30 , C08G59/3254 , C09D163/00 , H01L23/573 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/19105 , H01L2924/3025 , Y10T428/31511 , H01L2924/00012 , H01L2924/00
摘要： The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodophenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at least one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.
摘要翻译：本公开涉及含有包含共价结合到缩水甘油醚的碘化苯酚的环氧树脂的X射线不透明涂层。共价键合到缩水甘油醚的碘化苯酚可以包括碘化双酚A，例如四碘双酚A，单碘苯酚的缩水甘油醚，双碘苯酚，三碘苯酚或其组合。涂层可以包括X射线不透明的无机填料。本公开还涉及一种电子部件，其包括衬底和耦合到衬底的至少一个器件，其中设置在衬底上的混淆层用于使器件从X射线源模糊。混淆层可以包括X射线不透明涂层。本公开还涉及通过沉积可包括X射线不透明涂层的混淆层和形成X射线不透明涂层的方法来模糊电子部件的至少一部分的方法。

8. 发明授权

US06723803B1 Adhesive of flexible epoxy resin and latent dihydrazide 失效
标题翻译：柔性环氧树脂和潜在二酰肼的粘合剂
公开(公告)号：US06723803B1
公开(公告)日：2004-04-20
申请号：US08700133
申请日：1996-08-20
申请人： Ralph D. Hermansen , Steven E. Lau
发明人： Ralph D. Hermansen , Steven E. Lau
IPC分类号： C08G5940
CPC分类号： C08G59/4035 , C08G59/20 , C08G59/22 , C09J163/00
摘要： Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.
摘要翻译：在未固化状态下在室温下保持稳定的柔性环氧基粘合剂组合物包含：（a）当化学计量量的二亚乙基三胺固化时，至少一种硬度不超过硬度的肖氏D读数为45的柔性聚环氧树脂（ “DETA”）; 和（b）基本上化学计量的至少一种潜在环氧树脂固化剂。任选地，粘合剂组合物还可以掺入一种或多种半柔性树脂。其它任选的组分包括填料，触变剂和增韧剂。粘合剂组合物提供环氧基粘合剂组合物，其可在室温下作为单一组分混合物储存数周，可在不到两小时内在约100℃至125℃的温度范围内固化，并且在固化至温度低至零下50摄氏度，表现出肖氏A的硬度小于约95。

9. 发明授权

US6103853A Amine curing agents and epoxy coatings produced using same 失效
标题翻译：胺固化剂和环氧涂料使用相同
公开(公告)号：US6103853A
公开(公告)日：2000-08-15
申请号：US15112
申请日：1998-01-29
申请人： T. Kirk Dougherty , Steven E. Lau , Teresa L. Rosales , Steven A. Tunick
发明人： T. Kirk Dougherty , Steven E. Lau , Teresa L. Rosales , Steven A. Tunick
IPC分类号： C08G59/18 , C08G59/30 , C08G59/68
CPC分类号： C08G59/184 , C08G59/306
摘要： Amine adducts comprising a reactive amine curing agent containing an aromatic silane epoxy along with improved coatings made by combining the amine adduct with additional epoxy material. The amine adducts, when formulated and cured with an epoxy material, cures in several hours and gives a protective coating material that cures without blush or CO.sub.2 incorporation. Specific embodiments of the amine adduct contain a bisepoxy compound, such as 2,11-bis(3-glycidylphenyl)-2,11dimethyl-2,11-disiladodocane (n=4), for example, while the amine functionalized compound may be ethylenediamine (90.degree. C., 120.2 g, 20 mol) or aminoethylpiperazine, respectively. A number of chemical compounds are also disclosed.
摘要翻译：胺加合物包含含有芳族硅烷环氧树脂的反应性胺固化剂以及通过将胺加合物与另外的环氧材料结合而制备的改进的涂层。当用环氧树脂材料配制和固化时，胺加合物在几个小时内固化并产生可以固化而没有腮红或二氧化碳结合的保护性涂层材料。胺加合物的具体实例包括双环氧化合物，例如2,11-双（3-缩水甘油基苯基）-2,11-二甲基-2,11-二脱氧山梨醇（n = 4），而胺官能化化合物可以是乙二胺（90℃，120.2g，20mol）或氨基乙基哌嗪。还公开了许多化合物。

10. 发明授权

US6060539A Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives 失效
标题翻译：室温稳定，单组分，导热，柔性环氧胶粘剂
公开(公告)号：US6060539A
公开(公告)日：2000-05-09
申请号：US877980
申请日：1997-06-18
申请人： Ralph D. Hermansen , Steven E. Lau
发明人： Ralph D. Hermansen , Steven E. Lau
IPC分类号： C08G59/18 , C08G59/20 , C08G59/40 , C08K3/22 , C08K3/34 , C08K3/38 , C09J163/00 , C08K3/28
CPC分类号： C08K3/34 , C08G59/184 , C08G59/20 , C08G59/4035 , C08K3/22 , C08K3/38 , C09J163/00
摘要： A flexible thermally-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) a thermally-conductive filler. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks or even months at room temperature and is curable in less than one hour at a temperature ranging from about 100.degree. C. to 140.degree. C., whereupon the cured adhesive composition exhibits a durometer Shore A of less than about 90 and a thermal conductivity exceeding 0.4 BTU/hr-ft-.degree. F. (0.7 W/m-K).
摘要翻译：提供柔性导热性环氧系粘合剂组合物及其制造方法。本发明的粘合剂组合物包含（a）当用化学计量的二亚乙基三胺（“DETA”）固化时，包含至少一种硬度不超过约45的硬度的肖氏D读数的聚环氧树脂的聚合物混合物和基本上化学计量至少一种潜在环氧树脂固化剂的量; 和（b）导热填料。可选组分包括二级环氧树脂，非反应性增韧剂，稀释剂和加工助剂。本粘合剂组合物在室温下流变稳定数周或甚至几个月，并且在约100℃至140℃的温度下在少于1小时内可固化，因此固化的粘合剂组合物显示硬度为肖氏A 小于约90，热导率超过0.4BTU / hr-ft-°F（0.7W / mK）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式