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1. 发明授权

US07427457B1 Methods for designing grating structures for use in situ scatterometry to detect photoresist defects 有权
标题翻译：设计光栅结构的方法用于原位散射检测光刻胶缺陷
公开(公告)号：US07427457B1
公开(公告)日：2008-09-23
申请号：US10934277
申请日：2004-09-03
申请人： Marina V. Plat , Calvin T. Gabriel , Christopher F. Lyons , Anna M. Minvielle
发明人： Marina V. Plat , Calvin T. Gabriel , Christopher F. Lyons , Anna M. Minvielle
IPC分类号： G03F9/00
CPC分类号： G03F7/70783 , G03F1/44 , G03F7/70491 , G03F7/70533 , G03F7/7065
摘要： The present invention discloses a system and method for designing grating structures for use in situ scatterometry during the photolithography process to detect a photoresist defect (e.g., photoresist erosion, pattern collapse or pattern bending). In one embodiment, a grating structure may be designed with a pitch or critical dimensional smaller than the one used for the semiconductor device. The pitch and the critical dimension of the grating structure may be varied. In another embodiment, the present invention provides for a feedback mechanism between the in situ scatterometry process and the photolithography process to provide an early warning of the existence of a photoresist defect. If a defect is detected on the wafer, the wafer may be sent to be re-worked or re-patterned, thereby avoiding scrapping the entire wafer.
摘要翻译：本发明公开了一种用于在光刻工艺期间用于原位散射测量的光栅结构的系统和方法，用于检测光致抗蚀剂缺陷（例如，光致抗蚀剂侵蚀，图案崩溃或图案弯曲）。在一个实施例中，可以设计具有小于用于半导体器件的间距或临界尺寸的光栅结构。光栅结构的间距和临界尺寸可以变化。在另一个实施例中，本发明提供了原位散射测量过程和光刻工艺之间的反馈机制，以提供光刻胶缺陷的存在的早期警告。如果在晶片上检测到缺陷，则可以将晶片发送以进行再加工或重新图案化，从而避免报废整个晶片。

2. 发明授权

US07052921B1 System and method using in situ scatterometry to detect photoresist pattern integrity during the photolithography process 有权
标题翻译：使用原位散射法在光刻过程中检测光致抗蚀剂图案完整性的系统和方法
公开(公告)号：US07052921B1
公开(公告)日：2006-05-30
申请号：US10934192
申请日：2004-09-03
申请人： Marina V. Plat , Bhanwar Singh , Calvin T. Gabriel , Christopher F. Lyons , Scott A. Bell , Ramkumar Subramanian , Srikanteswara Dakshina-Murthy
发明人： Marina V. Plat , Bhanwar Singh , Calvin T. Gabriel , Christopher F. Lyons , Scott A. Bell , Ramkumar Subramanian , Srikanteswara Dakshina-Murthy
IPC分类号： H01L21/66
CPC分类号： G03F7/70625 , G03F7/70608 , H01L22/12
摘要： The present invention uses in situ scatterometry to determine if a defect (e.g., photoresist erosion, photoresist bending and pattern collapse) is present on a wafer. In one embodiment, in situ scatterometry is used to detect a pattern integrity defect associated with the layer of photoresist. In situ scatterometry produces diffraction data associated with the thickness of the photoresist patterned mask. This data is compared to a model of diffraction data associated with a suitable photoresist thickness. If the measured diffraction data is within an acceptable range, the next step of the photolithography process is carried out. However, if the measured thickness is outside of the suitable range, a defect is detected, and the wafer may be sent for re-working or re-patterned prior to main etch, thereby preventing unnecessary wafer scrap. Another aspect of the present invention allows for a feedback control mechanism to alter a physical parameter of the photolithographic process based upon the in situ scatterometry measurements.
摘要翻译：本发明使用原位散射法来确定晶片上是否存在缺陷（例如，光致抗蚀剂侵蚀，光致抗蚀剂弯曲和图案崩溃）。在一个实施例中，原位散射法用于检测与光致抗蚀剂层相关联的图案完整性缺陷。原位散射法产生与光致抗蚀剂图案掩模的厚度相关的衍射数据。将该数据与与合适的光致抗蚀剂厚度相关联的衍射数据的模型进行比较。如果测量的衍射数据在可接受的范围内，则进行光刻工艺的下一步骤。然而，如果测量的厚度在合适的范围之外，则检测到缺陷，并且可以在主蚀刻之前将晶片发送用于再加工或重新图案化，从而防止不必要的晶片废料。本发明的另一方面允许反馈控制机制基于原位散射测量来改变光刻工艺的物理参数。

3. 发明授权

US07268066B2 Method for semiconductor gate line dimension reduction 有权
标题翻译：半导体栅极线尺寸减小的方法
公开(公告)号：US07268066B2
公开(公告)日：2007-09-11
申请号：US10922093
申请日：2004-08-19
申请人： Douglas J. Bonser , Marina V. Plat , Chih Yuh Yang , Scott A. Bell , Srikanteswara Dakshina-Murthy , Philip A. Fisher , Christopher F. Lyons
发明人： Douglas J. Bonser , Marina V. Plat , Chih Yuh Yang , Scott A. Bell , Srikanteswara Dakshina-Murthy , Philip A. Fisher , Christopher F. Lyons
IPC分类号： H01L21/4763
CPC分类号： H01L29/66477 , H01L21/28123 , H01L29/1045 , H01L29/1054 , H01L29/665
摘要： To reduce the width of a MOSFET gate, the gate is formed with a hardmask formed thereupon. An isotropic etch is then performed to trim the gate in order to reduce the width of the gate. The resulting gate may be formed with a width that is narrower than a minimum width achievable solely through conventional projection lithography techniques.
摘要翻译：为了减小MOSFET栅极的宽度，栅极形成有在其上形成的硬掩模。然后执行各向同性蚀刻以修剪栅极，以便减小栅极的宽度。所形成的栅极可以形成为比仅通过常规投影光刻技术可实现的最小宽度窄的宽度。

4. 发明授权

US06689541B1 Process for forming a photoresist mask 有权
标题翻译：光刻胶掩模形成工艺
公开(公告)号：US06689541B1
公开(公告)日：2004-02-10
申请号：US09884182
申请日：2001-06-19
申请人： Scott A. Bell , Todd P. Lukanc , Christopher F. Lyons , Marina V. Plat , Ramkumar Subramanian
发明人： Scott A. Bell , Todd P. Lukanc , Christopher F. Lyons , Marina V. Plat , Ramkumar Subramanian
IPC分类号： G03C500
CPC分类号： G03F7/38 , G03F7/265 , G03F7/40
摘要： In a process for forming a photoresist mask, a photoresist layer is applied to a substrate. A silyated layer is formed in the photoresist layer. The features of the silyated area correspond to the features of a photoresist mask to be formed. The photoresist layer is then etched to form a photoresist base beneath the silyated area. The photoresist base is etched to remove material from its sides such that it becomes narrower than the silyated area. The silyated area is then removed, leaving a photoresist mask on the substrate.
摘要翻译：在形成光致抗蚀剂掩模的工艺中，将光致抗蚀剂层施加到基底上。在光致抗蚀剂层中形成硅化层。硅酸盐化区域的特征对应于要形成的光致抗蚀剂掩模的特征。然后蚀刻光致抗蚀剂层以在硅化区域下方形成光致抗蚀剂基底。蚀刻光致抗蚀剂基底以从其侧面去除材料，使得它比斯里芬特区域变窄。然后除去硅酸盐化区域，在基材上留下光刻胶掩模。

5. 发明授权

US06605546B1 Dual bake for BARC fill without voids 失效
标题翻译：双烘烤BARC填充无空隙
公开(公告)号：US06605546B1
公开(公告)日：2003-08-12
申请号：US09901699
申请日：2001-07-11
申请人： Ramkumar Subramanian , Wolfram Grundke , Bhanwar Singh , Christopher F. Lyons , Marina V. Plat
发明人： Ramkumar Subramanian , Wolfram Grundke , Bhanwar Singh , Christopher F. Lyons , Marina V. Plat
IPC分类号： H01L21302
CPC分类号： H01L21/76808
摘要： A method for forming a semiconductor device comprises forming a first layer over a semiconductor substrate. At least one hole is formed through the first layer. A bottom anti-reflective coating (BARC) layer is formed in the at least one hole. A first heating is performed to heat the BARC layer to a flow temperature. A second heating is performed to heat the BARC layer to a hardening temperature so that the BARC layer hardens, wherein the hardening temperature is greater than the flow temperature. An etch is performed to form a trench in the first layer and over the at least one hole, wherein the hardened BARC layer in the at least one hole acts as an etch resistant layer during the etch. As an alternative to the second heating step, the BARC may be simply hardened. The first and second heating may be performed within a heating chamber without removing the semiconductor substrate.
摘要翻译：一种用于形成半导体器件的方法包括在半导体衬底上形成第一层。通过第一层形成至少一个孔。在至少一个孔中形成底部抗反射涂层（BARC）层。执行第一次加热以将BARC层加热至流动温度。执行第二次加热以将BARC层加热至硬化温度，使得BARC层硬化，其中硬化温度大于流动温度。进行蚀刻以在第一层中和在至少一个孔上形成沟槽，其中至少一个孔中的硬化的BARC层在蚀刻期间用作耐蚀刻层。作为第二加热步骤的替代方案，BARC可以简单地硬化。第一和第二加热可以在加热室内进行，而不去除半导体衬底。

6. 发明授权

US06563221B1 Connection structures for integrated circuits and processes for their formation 失效
标题翻译：集成电路的连接结构及其形成过程
公开(公告)号：US06563221B1
公开(公告)日：2003-05-13
申请号：US10081982
申请日：2002-02-21
申请人： Scott A. Bell , Todd P. Lukanc , Christopher F. Lyons , Marina V. Plat , Ramkumar Subramanian
发明人： Scott A. Bell , Todd P. Lukanc , Christopher F. Lyons , Marina V. Plat , Ramkumar Subramanian
IPC分类号： H01L2348
CPC分类号： H01L21/76885 , H01L21/76831 , H01L23/485 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： In a method for forming a connection structure in an integrated circuit, a first conducting material is deposited over a substrate and patterned to form a conducting stud in electrical contact with a conducting element of the substrate. A dielectric is formed over the substrate and the conducting stud. A trench is formed in the dielectric to expose a top portion of the conducting stud, and a second conducting material is inlaid in the trench to form wiring in electrical contact with the conducting stud. The electrically conducting element of the substrate may be an element of a semiconductor device or a wiring, contact or via. The first conducting material may be aluminum, and the second conducting material may be copper. The dielectric may be formed as a single layer and may be an organic low-k dielectric. Related connection structures are also disclosed.
摘要翻译：在用于在集成电路中形成连接结构的方法中，第一导电材料沉积在衬底上并被图案化以形成与衬底的导电元件电接触的导电柱。电介质形成在衬底和导电柱上。在电介质中形成沟槽以暴露导电柱的顶部，并且第二导电材料镶嵌在沟槽中以形成与导电柱电接触的布线。衬底的导电元件可以是半导体器件或布线，接触或通孔的元件。第一导电材料可以是铝，第二导电材料可以是铜。电介质可以形成为单层，并且可以是有机低k电介质。还公开了相关的连接结构。

7. 发明授权

US06534418B1 Use of silicon containing imaging layer to define sub-resolution gate structures 有权
标题翻译：使用含硅成像层来定义次分辨率门结构
公开(公告)号：US06534418B1
公开(公告)日：2003-03-18
申请号：US09845656
申请日：2001-04-30
申请人： Marina V. Plat , Scott A. Bell , Christopher F. Lyons , Ramkumar Subramanian , Bhanwar Singh
发明人： Marina V. Plat , Scott A. Bell , Christopher F. Lyons , Ramkumar Subramanian , Bhanwar Singh
IPC分类号： H01L21302
CPC分类号： H01L21/0338 , H01L21/0337 , H01L21/28123 , H01L29/6659 , H01L29/7833
摘要： An exemplary method of using silicon containing imaging layers to define sub-resolution gate structures can include depositing an anti-reflective coating over a layer of polysilicon, depositing an imaging layer over the anti-reflective coating, selectively etching the anti-reflective coating to form a pattern, and removing portions of the polysilicon layer using the pattern formed from the removed portions of anti-reflective coating. Thus, the use of thin imaging layer, that has high etch selectivity to the organic underlayer, allows the use of trim etch techniques without a risk of resist erosion or aspect ratio pattern collapse. That, in turn, allows for the formation of the gate pattern with widths less than the widths of the pattern of the imaging layer.
摘要翻译：使用含硅成像层来限定次分辨率门结构的示例性方法可以包括在多晶硅层上沉积抗反射涂层，在抗反射涂层上沉积成像层，选择性地蚀刻抗反射涂层以形成使用由抗反射涂层的去除部分形成的图案去除多晶硅层的部分。因此，对有机底层具有高蚀刻选择性的薄成像层的使用允许使用修剪蚀刻技术，而不会有抗蚀剂侵蚀或高宽比图案崩溃的风险。这又反过来允许形成具有小于成像层的图案的宽度的宽度的栅极图案。

8. 发明授权

US06458691B1 Dual inlaid process using an imaging layer to protect via from poisoning 有权
标题翻译：双镶嵌工艺使用成像层保护通孔免受中毒
公开(公告)号：US06458691B1
公开(公告)日：2002-10-01
申请号：US09824662
申请日：2001-04-04
申请人： Ramkumar Subramanian , Christopher F. Lyons , Marina V. Plat , Bhanwar Singh
发明人： Ramkumar Subramanian , Christopher F. Lyons , Marina V. Plat , Bhanwar Singh
IPC分类号： H01L214763
CPC分类号： H01L21/31144 , H01L21/76807
摘要： There is provided a method of making a dual inlaid via in a first layer. The first layer may be a polymer intermetal dielectric, such as HSQ, of a semiconductor device. The method includes forming a first opening, such as a via, in the first layer and forming an inorganic base radiation sensitive layer in the first opening. The radiation sensitive layer may be a polysilane imaging layer. The inorganic base radiation sensitive layer is selectively exposed to radiation and then patterned. A second opening, such a trench, is formed in communication with the first opening using the patterned inorganic base radiation sensitive layer as a mask. A conductive layer may be formed in the dual inlaid via to complete a dual damascene process.
摘要翻译：提供了在第一层中制作双重嵌入通孔的方法。第一层可以是半导体器件的聚合物金属间电介质，例如HSQ。该方法包括在第一层中形成诸如通孔的第一开口，并在第一开口中形成无机碱辐射敏感层。辐射敏感层可以是聚硅烷成像层。无机碱辐射敏感层选择性地暴露于辐射，然后图案化。使用图案化的无机基底辐射敏感层作为掩模，形成与第一开口连通的第二开口，这样的沟槽。可以在双镶嵌通孔中形成导电层以完成双镶嵌工艺。

9. 发明授权

US06358856B1 Bright field image reversal for contact hole patterning 有权
标题翻译：接触孔图案的亮场图像反转
公开(公告)号：US06358856B1
公开(公告)日：2002-03-19
申请号：US09716215
申请日：2000-11-21
申请人： Christopher F. Lyons , Ramkumar Subramanian , Marina V. Plat , Todd P. Lukanc
发明人： Christopher F. Lyons , Ramkumar Subramanian , Marina V. Plat , Todd P. Lukanc
IPC分类号： H01L21311
CPC分类号： H01L21/31144
摘要： A method of forming a small contact hole uses a bright field mask to form a small cylinder in a positive resist layer. A negative resist layer is formed around the small cylinder, and then etched or polished back to leave a top portion of the small cylinder exposed above the negative resist layer. The negative resist layer and the small cylinder (positive resist) are flood exposed to light, and then subject to a developer. What remains is a small contact hole located where the small cylinder was previously located.
摘要翻译：形成小接触孔的方法使用亮场掩模在正抗蚀剂层中形成小圆筒。在小圆筒周围形成负的抗蚀剂层，然后被蚀刻或抛光回去，使得暴露在负性抗蚀剂层上方的小圆筒的顶部部分留下。负抗蚀剂层和小圆筒（正性抗蚀剂）暴露于光下，然后经受显影剂。剩下的是一个位于小圆柱之前所在的小接触孔。

10. 发明授权

US07112489B1 Negative resist or dry develop process for forming middle of line implant layer 有权
标题翻译：用于形成线植入层中间的负阻抗或干式显影工艺
公开(公告)号：US07112489B1
公开(公告)日：2006-09-26
申请号：US11004691
申请日：2004-12-03
申请人： Christopher F. Lyons , Anna Minvielle , Marina V. Plat
发明人： Christopher F. Lyons , Anna Minvielle , Marina V. Plat
IPC分类号： H01L21/336 , H01L21/8238
CPC分类号： H01L27/115 , H01L21/26513 , H01L27/11521
摘要： A method of implanting a middle of line (MOL) implant layer of a flash memory device that does not require a descumming step is disclosed. In a first embodiment, the method includes depositing a negative tone resist over the MOL implant layer. Portions of the negative tone resist in and above a plurality of trenches are not exposed to optical radiation, while portions surrounding the plurality of trenches are exposed. The unexposed portions are developed out thereby leaving a bottom surface of each trench substantially free of a resist residue. Implants can be placed in the MOL implant layer without the need for a descumming step. In a second embodiment, a bi-layer resist is deposited on the MOL implant layer, wherein the bi-layer resist includes a silicon containing top layer and a bottom layer. The bi-layer resist is patterned to expose a portion of the bottom layer that resides in and above a plurality of trenches. The bottom layer is dry etch developed using oxygen plasma as the etchant, thereby leaving a bottom surface of each trench substantially free of a resist residue. Implants can be placed in the MOL implant layer without the need for a descumming step.
摘要翻译：公开了一种注入不需要除尘步骤的闪速存储器件的中间线（MOL）注入层的方法。在第一实施例中，该方法包括在MOL植入层上沉积负色调抗蚀剂。在多个沟槽中和上方的负色调抗蚀剂的部分不暴露于光辐射，而围绕多个沟槽的部分被暴露。未曝光部分显影出来，从而留下每个沟槽的底表面基本上没有抗蚀剂残留物。植入物可以放置在MOL植入层中，而不需要除去步骤。在第二实施例中，双层抗蚀剂沉积在MOL注入层上，其中双层抗蚀剂包括含硅顶层和底层。图案化双层抗蚀剂以暴露驻留在多个沟槽中和上方的底层的一部分。底层是使用氧等离子体作为蚀刻剂进行干法蚀刻，从而留下每个沟槽的底表面基本上没有抗蚀剂残留物。植入物可以放置在MOL植入层中，而不需要除去步骤。

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