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    • 10. 发明授权
    • Lithography system, method of heat dissipation and frame
    • 平版印刷系统,散热方法和框架
    • US08325321B2
    • 2012-12-04
    • US11880833
    • 2007-07-24
    • Pieter KruitMichel Pieter DansbergMarco Jan-Jaco Wieland
    • Pieter KruitMichel Pieter DansbergMarco Jan-Jaco Wieland
    • F28D15/00G03B27/42G03B27/52G03B27/58G03B27/62
    • G03F7/70875
    • The present invention relates to a lithography system for projecting an image or an image pattern on to a target such as a wafer. Energy that is accumulated in the target by the projection of the image or image pattern is removed from said target, such that expansion by local and/or overall heating is limited to a relevant pre-defined value, and wherein such heat removal is realised by the use of a phase transition in a heat absorbing material that is brought into thermal contact with said target. As a further elaboration, such material may be applied in combination with a further material having a superior coefficient of heat transport, and may be incorporated in an emulsion comprising a material having a superior coefficient of heat transfer. Said material may e.g. be adhered to a bottom face of the target, and may also be included in a frame.
    • 本发明涉及用于将图像或图像图案投影到诸如晶片的靶上的光刻系统。 通过图像或图像图案的投影而累积在目标物中的能量从所述目标去除,使得通过局部和/或整体加热的膨胀被限制到相关的预定义值,并且其中这种除热由 在与所述靶导致热接触的吸热材料中使用相变。 作为进一步的阐述,这种材料可以与具有优异传热系数的另外的材料结合使用,并且可以结合在包含具有优良传热系数的材料的乳液中。 所述材料可以例如 粘附到目标的底面,并且也可以包括在框架中。