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1. 发明授权

US06953751B2 Micro device and process for producing it 失效
标题翻译：微型设备及其生产工艺
公开(公告)号：US06953751B2
公开(公告)日：2005-10-11
申请号：US10631421
申请日：2003-07-30
申请人： Manfred Detterbeck , Stefan Lutter , Mathieu Burri , Theo Hartmann , Terunobu Akiyama
发明人： Manfred Detterbeck , Stefan Lutter , Mathieu Burri , Theo Hartmann , Terunobu Akiyama
IPC分类号： B81C1/00 , B81B3/00 , C23F1/40 , G03F7/00 , G03F7/16 , G03F9/00
CPC分类号： G03F7/0035 , B81C99/0085 , G03F7/16
摘要： A micro device comprising a SU-8 photoresist layer adhered to a thin layer of, for example, silicon nitride, silicon oxide, metal, and diamond. The SU-8 layer is clamped on the thin layer by using an under-etching technique.
摘要翻译：一种微器件，包括粘附到例如氮化硅，氧化硅，金属和金刚石的薄层上的SU-8光致抗蚀剂层。通过使用底蚀刻技术将SU-8层夹在薄层上。

2. 发明授权

US06979407B2 Process for producing an SPM sensor 失效
标题翻译：生产SPM传感器的方法
公开(公告)号：US06979407B2
公开(公告)日：2005-12-27
申请号：US10385088
申请日：2003-03-10
申请人： Stefan Lutter
发明人： Stefan Lutter
IPC分类号： B81B3/00 , B81C1/00 , G01Q70/10 , G01Q70/16 , H01L21/00
CPC分类号： G01Q70/16 , G01Q70/10
摘要： Process for producing an SPM sensor having a holding element, a cantilever and a sensor tip which projects out of the surface of the cantilever and is delimited by three surfaces. According to the process, the starting material used is a (100)-silicon wafer. The main patterning process steps are carried out on the wafer back surface, so that an SPM sensor can be produced at low cost in a single batch run.
摘要翻译：用于生产具有保持元件，悬臂和突出于悬臂表面并由三个表面限定的传感器尖端的SPM传感器的方法。根据该方法，使用的起始材料是（100）硅晶片。主要的图案化工艺步骤在晶片背面进行，从而可以在单批次运行中以低成本生产SPM传感器。

3. 发明申请

US20100192843A1 Device for coating a substrate 有权
标题翻译：用于涂覆基材的装置
公开(公告)号：US20100192843A1
公开(公告)日：2010-08-05
申请号：US12658077
申请日：2010-02-02
申请人： Ralph Beyer , Stefan Lutter , Rainer Targus
发明人： Ralph Beyer , Stefan Lutter , Rainer Targus
IPC分类号： B05C11/08
CPC分类号： H01L21/6715 , H01L21/68 , H01L21/68785
摘要： By means of the device for coating a substrate (2; 102) according to the present invention, a homogeneous coating of the substrate (2; 102) can be achieved. The device comprises a holding and rotating means for holding and rotating the substrate (2; 102) about an axis (A). A disk (3) is provided below the substrate (2; 102). Said disk (3) is arranged coaxially with respect to the substrate (2; 102), has at least the same diameter as the substrate (2; 102) and is able to rotate synchronously with the substrate (2; 102). By means of the disk (3), air swirls at the edge of and below the substrate (2; 102) are avoided during coating of the substrate (2; 102). Thus, it is possible to obtain a homogeneous coating. For being able to load and unload a substrate (2; 102) into and out of the device by means of a conventional gripper system (6), the distance between substrate (2; 102) and disk (3) is increased during loading and unloading.
摘要翻译：通过根据本发明的用于涂覆基底（2; 102）的装置，可以实现基底（2; 102）的均匀涂层。该装置包括用于围绕轴线（A）保持和旋转基底（2; 102）的保持和旋转装置。在所述基板（2; 102）的下方设置有盘（3）。所述盘（3）相对于所述基底（2; 102）同轴布置，具有与所述基底（2; 102）至少相同的直径并且能够与所述基底（2; 102）同步旋转。通过盘（3），在衬底（2; 102）的涂覆期间避免在衬底（2; 102）的边缘和下方的空气涡流。因此，可以获得均匀的涂层。为了能够通过传统的夹具系统（6）将衬底（2; 102）装载和卸载到装置中，衬底（2; 102）和盘（3）之间的距离在装载期间增加，并且卸货

4. 发明授权

US06780767B2 Semiconductor component in a wafer assembly 有权
标题翻译：晶片组件中的半导体元件
公开(公告)号：US06780767B2
公开(公告)日：2004-08-24
申请号：US10178636
申请日：2002-06-21
申请人： Stefan Lutter
发明人： Stefan Lutter
IPC分类号： H01L2100
CPC分类号： B81C1/00888 , Y10T29/49121 , Y10T29/49124
摘要： Semiconductor components in a wafer assembly, in which the components are connected to a frame by means of in each case one holder and are formed from the same silicon wafer. The holder connects the respective component to the frame on one side and has a desired breaking point. The desired breaking point is designed as a V-shaped groove, the surfaces of which form crystal planes. According to the method, the patterning for production of the holder takes place on the wafer back surface, with subsequent wet chemical anisotropic etching of the V-groove. In this way, the holder is produced independently of the processing of the wafer front surface, and when the semiconductor component is removed a defined broken edge is formed without there being any risk of the semiconductor component being damaged.
摘要翻译：晶片组件中的半导体部件，其中部件通过每个壳体连接到框架，并且由相同的硅晶片形成。保持器将相应的部件连接到一侧的框架并且具有期望的断裂点。所需的断裂点被设计为V形槽，其表面形成晶面。根据该方法，用于制造保持器的图案化发生在晶片背面上，随后对V形槽进行湿化学各向异性蚀刻。以这种方式，保持器独立于晶片前表面的处理而被制造，并且当去除半导体部件时，形成限定的断裂边缘，而不会有半导体部件损坏的风险。

5. 发明授权

US09064686B2 Method and apparatus for temporary bonding of ultra thin wafers 有权
标题翻译：用于临时粘合超薄晶片的方法和装置
公开(公告)号：US09064686B2
公开(公告)日：2015-06-23
申请号：US13790684
申请日：2013-03-08
申请人： Gregory George , Stefan Lutter
发明人： Gregory George , Stefan Lutter
IPC分类号： H01L21/00 , H01L21/02 , H01L21/20 , H01L21/67 , H01L21/683
CPC分类号： B32B37/0046 , B32B37/1284 , B32B37/18 , B32B2307/202 , B32B2457/14 , H01L21/0201 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/17
摘要： A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.
摘要翻译：临时粘合第一和第二晶片的方法包括：在第一晶片的第一表面上施加第一粘合剂层，然后固化第一粘合剂层。接下来，将第二粘合剂层施加到第二晶片的第一表面上。接下来，将第一晶片插入粘合剂模块中，并通过上卡盘组件保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。接下来，将第二晶片插入到接合器模块中，并将第二晶片放置在下卡盘组件上，使得第二粘合剂层面向上并与第一粘合剂层相对。接下来，向下移动下卡盘组件并使第二粘合剂层与固化的第一粘合剂层接触，然后固化第二粘合剂层。

6. 发明申请

US20150251396A1 METHOD AND APPARATUS FOR TEMPORARY BONDING OF ULTRA THIN WAFERS 审中-公开
标题翻译：超薄薄膜临时粘结的方法和装置
公开(公告)号：US20150251396A1
公开(公告)日：2015-09-10
申请号：US14714587
申请日：2015-05-18
申请人： GREGORY GEORGE , Stefan Lutter
发明人： GREGORY GEORGE , Stefan Lutter
IPC分类号： B32B37/00 , B32B37/18 , H01L21/683 , B32B37/12
CPC分类号： B32B37/0046 , B32B37/1284 , B32B37/18 , B32B2307/202 , B32B2457/14 , H01L21/0201 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/17
摘要： An apparatus for temporary bonding first and second wafers includes, a first coating chamber configured to apply a first adhesive layer upon a first surface of a first wafer; a second coating chamber configured to apply a second adhesive layer upon a first surface of a second wafer; a curing chamber configured to cure the first adhesive layer of the first wafer; a bonder module comprising an upper chuck assembly and a lower chuck assembly arranged below and opposite the upper chuck assembly. The upper chuck assembly is configured to hold the first wafer so that its first surface with the cured first adhesive layer faces down. The lower chuck assembly is configured to hold the second wafer so that the second adhesive layer faces up and is opposite to the cured first adhesive layer. The lower chuck assembly is configured to move upwards and thereby to bring the second adhesive layer in contact with the cured first adhesive layer. The curing chamber is further configured to cure the second adhesive layer after it is brought in contact with the cured first adhesive layer, thereby forming a temporary bond between the first and second wafers.
摘要翻译：一种用于临时粘合第一和第二晶片的装置包括：第一涂层室，被配置为将第一粘合剂层施加到第一晶片的第一表面上; 第二涂覆室，被配置为将第二粘合剂层施加到第二晶片的第一表面上; 固化室，其构造成固化所述第一晶片的所述第一粘合剂层; 粘合剂模块包括布置在上卡盘组件下方和相对的上卡盘组件和下卡盘组件。上卡盘组件构造成保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。下卡盘组件构造成保持第二晶片，使得第二粘合剂层面向上并且与固化的第一粘合剂层相对。下卡盘组件构造成向上移动，从而使第二粘合剂层与固化的第一粘合剂层接触。固化室进一步构造成在与固化的第一粘合剂层接触之后固化第二粘合剂层，从而在第一和第二晶片之间形成临时粘合。

7. 发明申请

US20130244400A1 METHOD AND APPARATUS FOR TEMPORARY BONDING OF ULTRA THIN WAFERS 审中-公开
标题翻译：超薄薄膜临时粘结的方法和装置
公开(公告)号：US20130244400A1
公开(公告)日：2013-09-19
申请号：US13790684
申请日：2013-03-08
申请人： GREGORY GEORGE , Stefan Lutter
发明人： GREGORY GEORGE , Stefan Lutter
IPC分类号： H01L21/02
CPC分类号： B32B37/0046 , B32B37/1284 , B32B37/18 , B32B2307/202 , B32B2457/14 , H01L21/0201 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/17
摘要： A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.
摘要翻译：临时粘合第一和第二晶片的方法包括：在第一晶片的第一表面上施加第一粘合剂层，然后固化第一粘合剂层。接下来，将第二粘合剂层施加到第二晶片的第一表面上。接下来，将第一晶片插入粘合剂模块中，并通过上卡盘组件保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。接下来，将第二晶片插入到接合器模块中，并将第二晶片放置在下卡盘组件上，使得第二粘合剂层面向上并与第一粘合剂层相对。接下来，向下移动下卡盘组件并使第二粘合剂层与固化的第一粘合剂层接触，然后固化第二粘合剂层。

8. 发明授权

US08353255B2 Device for coating a substrate 有权
标题翻译：用于涂覆基材的装置
公开(公告)号：US08353255B2
公开(公告)日：2013-01-15
申请号：US12658077
申请日：2010-02-02
申请人： Ralph Beyer , Stefan Lutter , Rainer Targus
发明人： Ralph Beyer , Stefan Lutter , Rainer Targus
IPC分类号： B05C11/02 , B05C13/00
CPC分类号： H01L21/6715 , H01L21/68 , H01L21/68785
摘要： By means of the device for coating a substrate (2; 102) according to the present invention, a homogeneous coating of the substrate (2; 102) can be achieved. The device comprises a holding and rotating means for holding and rotating the substrate (2; 102) about an axis (A). A disk (3) is provided below the substrate (2; 102). Said disk (3) is arranged coaxially with respect to the substrate (2; 102), has at least the same diameter as the substrate (2; 102) and is able to rotate synchronously with the substrate (2; 102). By means of the disk (3), air swirls at the edge of and below the substrate (2; 102) are avoided during coating of the substrate (2; 102). Thus, it is possible to obtain a homogeneous coating. For being able to load and unload a substrate (2; 102) into and out of the device by means of a conventional gripper system (6), the distance between substrate (2; 102) and disk (3) is increased during loading and unloading.
摘要翻译：通过根据本发明的用于涂覆基底（2; 102）的装置，可以实现基底（2; 102）的均匀涂层。该装置包括用于围绕轴线（A）保持和旋转基底（2; 102）的保持和旋转装置。在所述基板（2; 102）的下方设置有盘（3）。所述盘（3）相对于所述基底（2; 102）同轴布置，具有与所述基底（2; 102）至少相同的直径并且能够与所述基底（2; 102）同步旋转。通过盘（3），在衬底（2; 102）的涂覆期间避免在衬底（2; 102）的边缘和下方的空气涡流。因此，可以获得均匀的涂层。为了能够通过传统的夹具系统（6）将衬底（2; 102）装载和卸载到装置中，衬底（2; 102）和盘（3）之间的距离在装载期间增加，并且卸货

9. 发明授权

US06958124B2 SPM sensor and process for producing it 有权
标题翻译： SPM传感器及其生产工艺
公开(公告)号：US06958124B2
公开(公告)日：2005-10-25
申请号：US10385060
申请日：2003-03-10
申请人： Stefan Lutter
发明人： Stefan Lutter
IPC分类号： G01B21/00 , B81B1/00 , B81B3/00 , B81C1/00 , G01Q70/02 , G01Q70/10 , G01Q70/16 , C23F1/00 , B44C1/22
CPC分类号： G01Q70/16 , G01Q70/10
摘要： SPM sensor comprising a holding element, cantilever and a sensor tip, which projects out of the surface of the cantilever, at the free end of the cantilever, at least the cantilever and the three-surface sensor tip consisting of monocrystalline (100)-silicon, and a process for producing this sensor. The process is distinguished by inexpensive process steps, substantially wet-chemical etching steps. The result is that an SPM sensor with a rectangular cantilever arm having a tip which may or may not project beyond the free end is produced from a single piece.
摘要翻译： SPM传感器包括在悬臂的自由端突出到悬臂的表面之外的保持元件悬臂和传感器尖端，至少悬臂和由单晶（100）硅晶体组成的三面传感器尖端，以及该传感器的制造方法。该方法的特征在于廉价的工艺步骤，基本上湿化学蚀刻步骤。结果是，具有可能或可能不突出超过自由端的尖端的具有矩形悬臂的SPM传感器由单件产生。

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