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1. 发明授权

US06467001B1 VLSI chip macro interface 失效
标题翻译： VLSI芯片宏接口
公开(公告)号：US06467001B1
公开(公告)日：2002-10-15
申请号：US09374222
申请日：1999-08-13
申请人： Mandy Alexander Gray , Michael J. Palmer , Ian David Judd
发明人： Mandy Alexander Gray , Michael J. Palmer , Ian David Judd
IPC分类号： G06F1336
CPC分类号： H04L49/101
摘要： The present invention provides a method and a system for connecting together, in a VLSI chip, a plurality of macros which require data flow connections between each other. A simple standard interface is realised between all macros. Any number of macros can be connected together, also allowing concurrent transactions between 4 or more macros using a cross-bar switch. Each macro may be a master (capable of requesting connections), a slave (capable of receiving connections from a master) or both. The centralised inter-connect logic includes three major components: the cross-bar switch, which makes the connections between the macros, the address decoder, which determines which slave each master wishes to connect to and an arbiter, which arbitrates between the macros when two or more masters request a connection simultaneously.
摘要翻译：本发明提供了一种用于在VLSI芯片中将需要相互数据流连接的多个宏连接在一起的方法和系统。所有宏之间实现简单的标准接口。任何数量的宏都可以连接在一起，也允许使用交叉开关的4个或更多宏之间的并发事务。每个宏可以是主（能够请求连接），从机（能够从主机接收连接）或两者。集中式互连逻辑包括三个主要部分：交叉开关，它们使得宏之间的连接，地址解码器确定每个主机希望连接的从属和仲裁器，它们在宏之间进行仲裁或更多的主人同时请求连接。

2. 发明授权

US08302630B2 Gate valve with equalizer port 有权
标题翻译：闸门带均衡器口
公开(公告)号：US08302630B2
公开(公告)日：2012-11-06
申请号：US12102168
申请日：2008-04-14
申请人： Michael J. Palmer
发明人： Michael J. Palmer
IPC分类号： F16K3/18
CPC分类号： F16K3/0209 , F16K3/029 , F16K3/314 , F16K39/04 , Y10T137/86509 , Y10T137/86831 , Y10T137/86936 , Y10T137/8696 , Y10T137/87378 , Y10T137/87491
摘要： A gate valve has a gate movable between open and closed positions within a valve body, and walls in the gate defining an equalizer port between opposite sides of the gate. The equalizer port is adapted and arranged to be shiftable by actuation of the gate between closed and opened positions and between opened and closed positions.
摘要翻译：闸阀具有可在阀体内的打开和关闭位置之间移动的闸门，并且闸门中的壁限定在闸门的相对侧之间的均衡器端口。均衡器端口被适配和布置成可以通过在关闭位置和打开位置之间以及在打开位置和关闭位置之间的门的致动来移动。

3. 发明申请

US20120198341A1 System and Method of Automatic Scaling of Clinical Data for Varied Display Size 审中-公开
标题翻译：自动缩放不同显示尺寸临床数据的系统和方法
公开(公告)号：US20120198341A1
公开(公告)日：2012-08-02
申请号：US13015840
申请日：2011-01-28
申请人： Matthew R. Pekarske , Michael J. Palmer , Brian Bayer , Bruce Friedman , Antti Ylostalo , David Meier
发明人： Matthew R. Pekarske , Michael J. Palmer , Brian Bayer , Bruce Friedman , Antti Ylostalo , David Meier
IPC分类号： G06F3/048
CPC分类号： G06F3/04886 , G06F3/0481 , G06F19/3418 , G06F2203/04803 , G16H40/63
摘要： The system and method of the present application allows for the configurable display of a number of physiological parameters on a wide variety of display sizes, usually those displays that are smaller than the bedside monitor display. The system and method organizes data in a grid of displayable elements, each displayable element including a piece of information corresponding to a collected physiological parameter of a patient. Depending upon the size of the display, an appropriate number of displayable elements are organized in a grid on the display and the size of each grid on the display is configurable and adjustable by a user.
摘要翻译：本申请的系统和方法允许在各种各样的显示器尺寸（通常是比床边显示器显示器小的显示器）上可配置地显示多个生理参数。该系统和方法将数据组织在可显示元件的网格中，每个可显示元素包括对应于患者的收集的生理参数的一条信息。根据显示器的尺寸，适当数量的可显示元件被组织在显示器上的网格中，并且显示器上的每个网格的大小可由用户配置和调节。

4. 发明授权

US06832756B2 Expandable mandrel 有权
标题翻译：可扩展心轴
公开(公告)号：US06832756B2
公开(公告)日：2004-12-21
申请号：US10345495
申请日：2003-01-16
申请人： Michael J. Palmer , S. Scott MacIntyre
发明人： Michael J. Palmer , S. Scott MacIntyre
IPC分类号： B21D4102
CPC分类号： B23B31/4013
摘要： An expandable mandrel for holding a workpiece, including a mandrel body having an interior surface and an exterior surface. The interior surface defines at least first and second interior regions separated by a transition surface, the first region having a cross sectional area greater than a cross-sectional area of the second region. A plurality of slots extend between the interior surface and the exterior surface. A slave actuator having a bearing surface is at least partially disposed in the first region, and a master actuator is provided for urging the bearing surface against the transition surface to expand the mandrel against the workpiece.
摘要翻译：一种用于保持工件的可膨胀心轴，包括具有内表面和外表面的心轴本体。内表面限定由过渡表面分开的至少第一和第二内部区域，第一区域具有大于第二区域的横截面面积的横截面面积。多个狭槽在内表面和外表面之间延伸。具有轴承表面的从动致动器至少部分地布置在第一区域中，并且提供主致动器用于将支承表面压靠过渡表面以使心轴相对于工件膨胀。

5. 发明授权

US06509464B1 FKBP inhibitors 失效
公开(公告)号：US06509464B1
公开(公告)日：2003-01-21
申请号：US09699869
申请日：2000-10-30
申请人： Martin J. Wythes , Michael J. Palmer , Mark I. Kemp , Malcolm C. MacKenny , Robert J. Maguire , James F. Blake, Jr.
发明人： Martin J. Wythes , Michael J. Palmer , Mark I. Kemp , Malcolm C. MacKenny , Robert J. Maguire , James F. Blake, Jr.
IPC分类号： C07D41302
CPC分类号： C07D211/60 , A61K31/423 , A61K31/428 , C07D401/04 , C07D413/04 , C07D413/14 , C07D471/14
摘要： Compounds of formula (I), their salts and solvates, wherein the substituents are as described herein, are FKBP inhibitors.

6. 发明授权

US5360946A Flex tape protective coating 失效
标题翻译：柔性胶带保护涂层
公开(公告)号：US5360946A
公开(公告)日：1994-11-01
申请号：US761182
申请日：1991-09-17
申请人： Claudius Feger , Teresita O. Graham , Kurt R. Grebe , Alphonso P. Lanzetta , John J. Liutkus , Linda C. Matthew , Michael J. Palmer , Nelson R. Tanner , Ho-Ming Tong , Charles H. Wilson , Helen L. Yeh
发明人： Claudius Feger , Teresita O. Graham , Kurt R. Grebe , Alphonso P. Lanzetta , John J. Liutkus , Linda C. Matthew , Michael J. Palmer , Nelson R. Tanner , Ho-Ming Tong , Charles H. Wilson , Helen L. Yeh
IPC分类号： H01L21/60 , H01L21/48 , H01L23/495 , H01L23/498 , H01L23/50 , H01R12/04 , H05K1/11 , H05K3/00 , H05K3/28 , H05K3/34 , H05K3/36 , H01R9/09
CPC分类号： H01L24/45 , H01L21/481 , H01L23/49572 , H01L23/49894 , H01L24/85 , H05K3/363 , H01L2224/056 , H01L2224/05644 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K2201/10681 , H05K2201/10977 , H05K2203/176 , H05K3/0017 , H05K3/3452 , Y10T29/49121 , Y10T29/49155 , Y10T29/49165
摘要： The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.
摘要翻译：本发明涉及适用于硅载体或其它类型的芯片载体应用的改进的柔性（或TAB）产品，其中例如通过Cu热循环引起的柔性可靠性问题被显着地减少或消除。更具体地，本发明体现了用于这种产品中的许多涂层以及制造和使用它们的各种方法。

7. 发明授权

US5205461A Method and apparatus for fluxless solder bonding 失效
标题翻译：无焊剂焊接方法和装置
公开(公告)号：US5205461A
公开(公告)日：1993-04-27
申请号：US524408
申请日：1990-05-16
申请人： Harry R. Bickford , Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , John C. Zyzo
发明人： Harry R. Bickford , Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , John C. Zyzo
IPC分类号： B23K1/012 , H01L21/00 , H05K3/34
CPC分类号： H01L21/67144 , B23K1/012 , H05K3/3494
摘要： Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.
摘要翻译：将焊锡焊料无焊焊接到焊料可润湿表面的方法和装置。加热气体，优选还原性或非反应性气体，被引导到固体焊料堆。将气体加热到足以熔化焊料堆的温度。加热的气体以足以将氧化物层分散在熔融焊料堆的表面的动量指向熔融焊料堆。分散氧化物层允许熔融焊料润湿焊料可润湿表面。将熔融的焊料冷却以形成焊料接合。

8. 发明授权

US5134460A Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding 失效
标题翻译：铝凸块，可重复工作的凸块和用于接头接合的氮化钛结构
公开(公告)号：US5134460A
公开(公告)日：1992-07-28
申请号：US609057
申请日：1990-11-02
申请人： Michael J. Brady , Sung K. Kang , Paul A. Moskowitz , James G. Ryan , Timothy C. Reiley , Erick G. Walton , Harry R. Bickford , Michael J. Palmer
发明人： Michael J. Brady , Sung K. Kang , Paul A. Moskowitz , James G. Ryan , Timothy C. Reiley , Erick G. Walton , Harry R. Bickford , Michael J. Palmer
IPC分类号： H01L21/60 , H01L23/485
CPC分类号： H01L24/86 , H01L24/10 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , Y10S257/915
摘要： A semiconductor chip carrying integrated circuits has lead lines terminating in conductive terminal pads exposed to the exterior through openings in a passivation layer. The pads include pedestals or bumps extending up from them. Each of the pedestals includes a thin metallic adhesion layer deposited on the pad. A thick metallic layer of aluminum or an alloy of aluminum is deposited upon said thin metallic adhesion layer. The thick metallic layer includes at least one metal selected from the group consisting of aluminum, aluminum plus a small percentage of Cu, Ni, Si, or Fe. Several other alternative metals can be added to aluminum to form an alloy. The thick metallic layer forms the bulk of the height of the pedestal. An adhesion layer is deposited on the bump of aluminum composed of a thin film of titanium or chromium. A barrier layer is deposited on the adhesion layer composed of copper, nickel, platinum, palladium or cobalt. A noble metal consisting of gold, palladium, or platinum is deposited on the barrier layer. In a variation of the top surface, a thick cap of a reworkable bonding metal is deposited above the metallic bump as the top surface of said bump. The bump can be composed of a number of metals such as gold, copper, nickel and aluminum in this case with aluminum being preferred. In place of the adhesion and barrier metals one can employ a layer of titanium nitride deposited on said thick layer of metal.
摘要翻译：携带集成电路的半导体芯片具有终端于通过钝化层中的开口暴露于外部的导电端子焊盘中的导线。垫片包括从它们向上延伸的基座或凸块。每个基座包括沉积在垫上的薄金属粘附层。铝的厚金属层或铝合金沉积在所述薄金属粘合层上。厚金属层包括选自铝，铝和小百分比的Cu，Ni，Si或Fe中的至少一种金属。可以将几种其它替代金属加入到铝中以形成合金。厚的金属层形成基座的高度的大部分。粘合层沉积在由钛或铬的薄膜构成的铝凸块上。阻挡层沉积在由铜，镍，铂，钯或钴组成的粘合层上。由金，钯或铂组成的贵金属沉积在阻挡层上。在顶表面的变型中，可再加工的粘合金属的厚盖被沉积在金属凸块上方作为所述凸块的顶表面。凸起可以由许多金属如金，铜，镍和铝组成，在这种情况下，优选铝。代替粘合和阻挡金属，可以使用沉积在所述厚金属层上的氮化钛层。

9. 发明授权

US5038195A Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate 失效
标题翻译：组合和涂层以防止电介质基底上的导体之间的电流引起的电化学枝晶形成
公开(公告)号：US5038195A
公开(公告)日：1991-08-06
申请号：US477705
申请日：1990-02-09
申请人： William D. Brewer , Kurt R. Grebe , Raymond R. Horton , Linda C. Matthew , Ismail C. Noyan , Michael J. Palmer , Sampath Purushothaman , David L. Rath
发明人： William D. Brewer , Kurt R. Grebe , Raymond R. Horton , Linda C. Matthew , Ismail C. Noyan , Michael J. Palmer , Sampath Purushothaman , David L. Rath
IPC分类号： H01L21/60 , H01L21/48 , H01L23/498 , H01L23/50 , H05K1/00 , H05K1/09 , H05K3/24
CPC分类号： H05K3/244 , H01L21/4846 , H01L23/49866 , H05K1/09 , H01L2924/0002 , H01L2924/09701 , H05K1/0393 , Y10T428/1291
摘要： The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

10. 发明授权

US5006917A Thermocompression bonding in integrated circuit packaging 失效
标题翻译：集成电路封装中的热压接
公开(公告)号：US5006917A
公开(公告)日：1991-04-09
申请号：US398799
申请日：1989-08-25
申请人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
发明人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
IPC分类号： B23K20/02 , B23K20/233 , B23K33/00 , H01L21/60 , H01L21/603
CPC分类号： H01L24/80 , B23K20/023 , B23K20/233 , B23K33/00 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/14
摘要： A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

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