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    • 7. 发明授权
    • Wafer polishing method, wafer cleaning method and wafer protective film
    • 晶圆抛光法,晶圆清洗法及晶圆保护膜
    • US06558233B1
    • 2003-05-06
    • US09719564
    • 2000-12-28
    • Takashi MatsuokaNaotaka ToyamaHideki MunakataHisashi Masumura
    • Takashi MatsuokaNaotaka ToyamaHideki MunakataHisashi Masumura
    • B24B100
    • H01L21/02052H01L21/02024
    • Provided are a wafer polishing method in which, in single side polishing, covering a wafer holding surface (one side surface) with a protective film, a wafer polishing surface (the other side surface) is polished, so that the wafer holding surface can be prevented from being etched and contaminated by a polishing agent; a wafer cleaning method in which the protective film that remains behind on the wafer holding surface after polishing can be efficiently removed, and a waste cleaning solution is easily treated; and a wafer protective film that sufficiently covers the wafer holding surface in polishing but is effectively removed in cleaning. In a wafer polishing method in which a wafer holding surface of one side surface of a wafer is held and a wafer polishing surface of the other side surface thereof is polished while dripping a polishing agent, the wafer polishing surface is polished while covering the wafer holding surface with a synthetic resin protective film of etching resistance against the polishing agent, good adhesiveness to the wafer and a property easy to peel off from the wafer after polishing.
    • 提供一种晶片抛光方法,其中在单面抛光中,用保护膜覆盖晶片保持表面(一个侧表面),抛光晶片抛光表面(另一侧表面),使得晶片保持表面可以 防止被抛光剂蚀刻和污染; 可以有效地除去在抛光后保留在晶片保持面上的保护膜的晶片清洗方法,并且容易地处理废物清洁溶液; 以及晶片保护膜,其在抛光中充分地覆盖晶片保持表面,但在清洁中被有效地去除。 在晶片抛光方法中,晶片的一个侧表面的晶片保持表面和其另一侧表面的晶片抛光表面被抛光抛光剂,抛光晶片抛光表面,同时覆盖晶片保持 表面具有对抛光剂的耐蚀刻性的合成树脂保护膜,对晶片的良好粘合性和抛光后容易从晶片剥离的性质。
    • 8. 发明授权
    • Pellicle with a filter and method for production thereof
    • 具有过滤器的防护薄膜及其制造方法
    • US06436586B1
    • 2002-08-20
    • US09544333
    • 2000-04-06
    • Takashi MatsuokaYuichi HamadaMeguru Kashida
    • Takashi MatsuokaYuichi HamadaMeguru Kashida
    • G03F114
    • G03F1/64G03F7/70933G03F7/70983
    • There is disclosed a pellicle having a pellicle frame with at least one vent for controlling atmospheric pressure and a filter attached so as to cover the vent, wherein it takes 5 minutes to 180 minutes, to restore a pellicle film swelled during a step of attaching the pellicle to the exposure original plate under atmospheric pressure of 760 mmHg followed by reducing atmospheric pressure to 500 mmHg and keeping the pressure, to the original state and a method for producing it, and a pellicle with a filter having a pellicle frame with at least one vent for controlling atmospheric pressure wherein all over the inner surface of the filter attached so as to cover said vent is impregnated with a resin, and 50% by volume or more of the filter is impregnated therewith. There can be provided a pellicle with a filter having both of impurity-trapping performance and ventilating performance, and a method for producing it, and a pellicle with a filter having ventilating performance wherein impurities can be fixed without being released even under violent airflow such as air blow or the like and finer impurities can be trapped, with keeping ventilating performance.
    • 公开了一种防护薄膜组件,其具有至少一个用于控制大气压力的通风口的防护薄膜组件框架和附着以覆盖通风口的过滤器,其中需要5分钟至180分钟,以恢复在附接步骤期间膨胀的防护薄膜组件 将防护薄膜组件暴露在760mmHg的大气压下的原版上,随后将大气压降至500mmHg,并将压力保持在原始状态,及其制备方法,以及具有过滤器的防护薄膜组件,该防护薄膜组件框架具有至少一个 用于控制大气压力的排气口,其中,将覆盖所述通气口的过滤器的内表面全部浸渍在树脂中,并且浸渍50体积%以上的过滤器。 可以提供一种带有具有杂质捕获性能和通气性能的过滤器的防护薄膜及其制造方法,以及具有通风性能的过滤器的防护薄膜组件,其中即使在暴力气流下即使固定也不会释放杂质,例如 吹气等,并且可以捕获更细的杂质,同时保持通风性能。