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    • 1. 发明授权
    • Composite magnetic head having thin conductor film
    • 具有薄导体膜的复合磁头
    • US06014291A
    • 2000-01-11
    • US263252
    • 1994-06-21
    • Makoto WatanabeSeiichi OgataYoshito IkedaKyu Kanno
    • Makoto WatanabeSeiichi OgataYoshito IkedaKyu Kanno
    • G11B5/008G11B5/09G11B5/115G11B5/127G11B5/29G11B5/48G11B5/53G11B23/00G11B5/265
    • G11B5/29G11B5/115G11B5/127G11B5/1272G11B5/4893G11B5/531G11B5/534G11B23/0007G11B5/0086G11B5/09
    • A magnetic head includes a first magnetic core half having a coil winding groove coupled to a second magnetic core half having an auxiliary core element accommodated in the coil winding groove, such that a magnetic gap is defined between joining faces of the first and second core halves. Alternatively, a composite magnetic head includes a pair of magnetic heads that have magnetic gaps with different azimuth angles from each other and disposed closely in an opposing relationship to each other in a head feeding direction so as to define respective track widths and a track pitch. A thin conductor film is formed on at least one of a pair of opposing faces of the magnetic heads for intercepting leakage fluxes from the magnetic gap of the other magnetic head. The thin conductor film has a thickness and is located such that the track pitch formed by the magnetic heads is substantially independent of the thickness of the thin conductor film. A method of producing a magnetic head includes forming a track width restricting groove on each of a pair of head core blocks. The blocks are fused together with glass when aligned with the restricting groove. An additional groove is formed at an angle substantially equal to the azimuth angle of the magnetic gap on at least one of the pairs of faces on the blocks and the blocks are cut in a direction substantially perpendicular to the bottom face of the additional groove.
    • 磁头包括第一磁芯半部,其具有耦合到具有容纳在线圈绕组槽中的辅助芯体的第二磁芯半部的线圈绕组槽,使得在第一和第二芯半部的接合面之间限定磁隙 。 或者,复合磁头包括一对磁头,它们具有彼此不同的方位角的磁隙,并且在磁头输送方向上以彼此相对的关系紧密地设置,以便限定相应的磁道宽度和磁道间距。 在磁头的一对相对面中的至少一个上形成薄导体膜,用于截取来自另一个磁头的磁隙的漏磁通。 薄导体膜具有厚度并且被定位成使得由磁头形成的轨道间距基本上与薄导体膜的厚度无关。 一种制造磁头的方法包括在一对磁头芯块的每一个上形成磁道宽度限制槽。 当与限制槽对准时,这些块与玻璃熔合在一起。 以与块上的至少一对面上的磁隙的方位角大致相等的角度形成附加的槽,并且在基本上垂直于附加槽的底面的方向上切割块。
    • 4. 发明授权
    • Antenna device and communication device
    • 天线设备和通信设备
    • US08849195B2
    • 2014-09-30
    • US13635997
    • 2011-03-31
    • Katsuhisa OriharaYoshito IkedaNorio SaitoSatoru Sugita
    • Katsuhisa OriharaYoshito IkedaNorio SaitoSatoru Sugita
    • H04B5/00H01Q1/22H01Q7/00H01Q1/24
    • H01Q1/2208H01Q1/2225H01Q1/2266H01Q1/24H01Q1/243H01Q1/42H01Q7/00
    • The present invention provides a communication device that can reduce a housing of an electronic device in size and thickness when the communication device is built in the electronic device. The communication device includes: an antenna coil (11a) arranged on an outer peripheral portion (134) of a housing (131) surface facing a reader/writer (120) of a mobile phone (130); a magnetic sheet (13) that attracts a magnetic field transmitted from the reader/writer (120) to the antenna coil (11a); and a communication processing unit (12) that is driven by a current flowing in the antenna coil (11a) and performs communication with the reader/writer (120), wherein the magnetic sheet (13) is arranged on the reader/writer (120) side of the antenna coil (11a) at a center portion (132a), and the antenna coil (11a) is arranged on the reader/writer (120) side on an outer periphery (130d) side.
    • 本发明提供一种通信装置,当通信装置内置在电子装置中时,可以减小电子装置的尺寸和厚度的外壳。 通信装置包括:天线线圈(11a),布置在面向移动电话(130)的读取器/写入器(120)的壳体(131)表面的外周部分(134)上; 吸引从读取器/写入器(120)发送到天线线圈(11a)的磁场的磁性片(13); 以及由在天线线圈(11a)中流动的电流驱动并与读取器/写入器(120)进行通信的通信处理单元(12),其中磁片(13)布置在读取器/写入器(120) )侧,天线线圈(11a)在中心部分(132a)处,天线线圈(11a)布置在外周(130d)侧的读/写器(120)侧。
    • 6. 发明授权
    • Infrared sensor and infrared sensor array
    • 红外传感器和红外传感器阵列
    • US07332717B2
    • 2008-02-19
    • US10580534
    • 2005-09-15
    • Takahiko MurataTakumi YamaguchiShigetaka KasugaShinji YoshidaYoshito Ikeda
    • Takahiko MurataTakumi YamaguchiShigetaka KasugaShinji YoshidaYoshito Ikeda
    • G01J5/00
    • G01J5/24G01J1/46H04N5/33
    • An infrared sensor includes a series capacitor element and a reference capacitor element each exhibiting a predetermined capacitance value; an infrared-detecting capacitor element whose capacitance value varies depending on an intensity of infrared light incident on the element; and an output node being a node at which a first terminal of the series capacitor element, a first terminal of the reference capacitor element and a first terminal of the infrared-detecting capacitor element are connected to one another. The intensity of infrared light is output as a potential difference between the reference potential which is brought to a potential by applying a predetermined voltage between the series capacitor element and the reference capacitor element and the detection potential which is brought to a potential by applying a predetermined voltage between the series capacitor element and the infrared-detecting capacitor element.
    • 红外线传感器包括串联电容器元件和参考电容器元件,每个都具有预定的电容值; 其电容值根据入射到元件上的红外光的强度而变化的红外线检测电容器元件; 并且输出节点是串联电容器元件的第一端子,参考电容器元件的第一端子和红外线检测电容器元件的第一端子彼此连接的节点。 红外光的强度通过在串联电容器元件和参考电容器元件之间施加预定电压而被引入到电位的参考电位之间的电位差和通过施加预定的 串联电容器元件和红外线检测电容器元件之间的电压。
    • 10. 发明申请
    • Contact formation method and semiconductor device
    • 触点形成方法和半导体器件
    • US20050189651A1
    • 2005-09-01
    • US10625546
    • 2003-07-24
    • Yutaka HiroseYoshito IkedaKaoru Inoue
    • Yutaka HiroseYoshito IkedaKaoru Inoue
    • H01L21/285H01L23/48H01L33/00H01L33/32H01L33/40H01S5/042H01S5/323
    • H01L21/28575H01L33/0095H01L33/32H01L33/40H01S5/0425H01S5/32341
    • An object of the present invention is to reduce the resistance of an electrode of a Group III nitride semiconductor. A thin Si film and a thin Ti film are formed selectively in a contact formation region on a surface of an AlGaN layer as a Group III nitride semiconductor layer formed on a substrate, and the resulting substrate is heat-treated at a high temperature. By the heat treatment, Si is diffused into the AlGaN layer in the ohmic contact formation region at a concentration of about 1020 cm3. Further, an electron density sufficiently high to provide an ohmic characteristic through a reaction between Si and Ti is provided. Thus, a low resistance TiSi2 portion resulting from the reaction between Si and Ti, a TiN portion resulting from a reaction between Ti and AlGaN and a Group III metal portion of Ga and Al devoid of nitrogen are formed in the contact formation region thereby to provide a low resistance electrode film mainly comprising TiSi2.
    • 本发明的目的是降低III族氮化物半导体的电极的电阻。 在AlGaN层的表面上的接触形成区域中选择性地形成薄的Si膜和薄的Ti膜,作为形成在衬底上的III族氮化物半导体层,并将所得到的衬底在高温下进行热处理。 通过热处理,Si在欧姆接触形成区域中扩散到约10 20 cm 3的浓度的AlGaN层中。 此外,提供足够高的电子密度以通过Si和Ti之间的反应提供欧姆特性。 因此,形成由Si和Ti之间的反应产生的低电阻TiSi 2 H 2部分,由Ti和AlGaN之间的反应导致的TiN部分和缺少氮的Ga和Al的III族金属部分 在接触形成区域中,由此提供主要包含TiSi 2 N的低电阻电极膜。