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1. 发明授权

US5624730A Magnetic head 失效
标题翻译：磁头
公开(公告)号：US5624730A
公开(公告)日：1997-04-29
申请号：US414716
申请日：1995-05-17
申请人： Makoto Wakasugi , Chiaki Hara
发明人： Makoto Wakasugi , Chiaki Hara
IPC分类号： G11B5/10 , G11B5/105 , G11B5/265
CPC分类号： G11B5/10 , G11B5/105 , G11B5/2651 , Y10S428/90 , Y10T29/49037 , Y10T29/49041 , Y10T428/24298 , Y10T428/24314 , Y10T428/24479
摘要： A magnetic head is manufactured by the steps of accommodating a core chip blank into an elongated hole provided in a slider blank, joining the core chip blank and the slider blank together with glass and then grinding the surface to form a surface which makes sliding-contact with a recording medium. Glass for joining the core chip blank and the slider blank together is obtained by melting a glass rod mounted in a predetermined position on the slider blank. In order to prevent the core chip from being positionally moved by surface tension of the molten glass when the glass rod is melted, the edges of the elongated hole are partially provided with protrusions for positioning the glass rod so as to prevent surface tension of the molten glass from positionally moving the core chip.
摘要翻译：通过以下步骤制造磁头：将芯片坯件容纳在设置在滑块坯件中的长孔中，将芯片坯料和滑块坯件与玻璃一起接合，然后研磨表面以形成滑动接触与记录介质。通过熔化安装在滑块坯件上的预定位置的玻璃棒来获得用于将芯片坯料和滑块坯件连接在一起的玻璃。为了防止当玻璃棒熔化时芯片由于熔融玻璃的表面张力而位置移动，细长孔的边缘部分地设置有用于定位玻璃棒的突起，以防止熔融玻璃的表面张力从位置移动核心芯片的玻璃。

2. 发明授权

US5629821A Magnetic head 失效
标题翻译：磁头
公开(公告)号：US5629821A
公开(公告)日：1997-05-13
申请号：US404906
申请日：1995-03-15
申请人： Makoto Wakasugi , Toshiro Atobe , Chiaki Hara , Naofumi Asanuma
发明人： Makoto Wakasugi , Toshiro Atobe , Chiaki Hara , Naofumi Asanuma
IPC分类号： G11B5/265 , G11B5/105 , G11B5/17 , G11B5/55 , G11B5/60
CPC分类号： G11B5/17 , G11B5/105 , G11B5/5521
摘要： A pair of parallel frame members 30 and 31 are formed in the inner bobbin faces of recording/reproducing and erasing coil assemblies 3, 4 on the opposite sides and spaced equidistant from a core tip center line T. An orthogonal frame member 32 is formed on the outer side of each of the bobbin end face to extend in a direction perpendicular to the parallel frame members 30 and 31. The end of the orthogonal frame member 32 extending toward an auxiliary sliding face 15 of a slider 2 extends outwardly from one of the parallel frame members 31. The recording/reproducing and erasing coil assemblies 3 and 4 are disposed asymmetrically to each other about the core tip center line T. When the recording/reproducing and erasing coil assemblies 3 and 4 are respectively housed in coil assembly receiving portions 26 and 27, the coil assemblies 3 and 4 will not extend outwardly beyond a slider plane projection line C.
摘要翻译：一对平行的框架构件30和31形成在相对侧上的记录/再现和擦除线圈组件3,4的内部线轴面中并且与芯顶端中心线T等距离地间隔开。正交的框架构件32形成在每个筒管端面的外侧在垂直于平行框架构件30和31的方向上延伸。正向框架构件32朝向滑块2的辅助滑动面15延伸的端部向外延伸平行框架构件31.记录/再现和擦除线圈组件3和4围绕芯末端中心线T彼此不对称地设置。当记录/再现和擦除线圈组件3和4分别容纳在线圈组件接收部分如图26和27所示，线圈组件3和4将不会向外延伸超过滑块平面投影线C.

3. 发明授权

US5457871A Method of manufacturing magnetic head 失效
标题翻译：制造磁头的方法
公开(公告)号：US5457871A
公开(公告)日：1995-10-17
申请号：US211389
申请日：1994-03-31
申请人： Makoto Wakasugi , Chiaki Hara
发明人： Makoto Wakasugi , Chiaki Hara
IPC分类号： G11B5/10 , G11B5/105 , G11B5/265
CPC分类号： G11B5/10 , G11B5/105 , G11B5/2651 , Y10S428/90 , Y10T29/49037 , Y10T29/49041 , Y10T428/24298 , Y10T428/24314 , Y10T428/24479
摘要： A magnetic head is manufactured by the steps of accommodating a core chip blank into an elongated hole provided in a slider blank, joining the core chip blank and the slider blank together with glass and then grinding the surface to form a surface which makes sliding-contact with a recording medium. Glass for joining the core chip blank and the slider blank together is obtained by melting a glass rod mounted in a predetermined position on the slider blank. In order to prevent the core chip from being positionally moved by surface tension of the molten glass when the glass rod is melted, the edges of the elongated hole are partially provided with protrusions for positioning the glass rod so as to prevent surface tension of the molten glass from positionally moving the core chip.
摘要翻译：通过以下步骤制造磁头：将芯片坯件容纳在设置在滑块坯件中的长孔中，将芯片坯料和滑块坯件与玻璃一起接合，然后研磨表面以形成滑动接触与记录介质。通过熔化安装在滑块坯件上的预定位置的玻璃棒来获得用于将芯片坯料和滑块坯件连接在一起的玻璃。为了防止当玻璃棒熔化时芯片由于熔融玻璃的表面张力而位置移动，细长孔的边缘部分地设置有用于定位玻璃棒的突起，以防止熔融玻璃的表面张力从位置移动核心芯片的玻璃。

4. 发明授权

US5898256A Container for enclosing a piezo-electric transducer 失效
标题翻译：用于封闭压电换能器的容器
公开(公告)号：US5898256A
公开(公告)日：1999-04-27
申请号：US836102
申请日：1997-04-29
申请人： Toshinori Ide , Kiyoshi Uchibori , Makoto Wakasugi
发明人： Toshinori Ide , Kiyoshi Uchibori , Makoto Wakasugi
IPC分类号： H03H9/10 , H01L41/08
CPC分类号： H03H9/1021
摘要： With a cylindrical case (10) and a base (18) for sealing an aperture part of the case (10), a piezo-electric transducer is enclosed in the case (10). The base (18) has a cylindrical shape and its section intersecting its axis at right angles at the part where the base (18) comes into contact with the case (10) is elliptical or nearly elliptical. The shape of an inner circumference of a section of the case (10) intersecting its axis at right angles at the part where the case (10) touches the base (18) is smaller than that of the section of the base (18), and is elliptical or nearly elliptical. The case (10) is a cylinder with one end closed and one end open. The piezo-electric transducer is enclosed by press fitting the base (18) into the open end of the case (10). In this case, a press-fitting allowance has a maximum value at parts between minor and major axes of the ellipse or near ellipse.
摘要翻译： PCT No.PCT / JP96 / 02456 Sec。 371日期1997年04月29日 102（e）1997年4月29日PCT PCT 1996年8月30日PCT公布。出版物WO97 / 08826 日期1997年3月6日具有用于密封壳体（10）的开口部分的圆柱形壳体（10）和基座（18），压电换能器封装在壳体（10）中。基部（18）具有圆柱形形状，并且其基部（18）与壳体（10）接触的部分以直角与其轴线交叉的部分为椭圆形或接近椭圆形。在壳体（10）接触基部（18）的部分处与壳体（10）的与其轴线成直角交叉的部分的内周的形状小于基部（18）的截面的形状，并且是椭圆形或近椭圆形。壳体（10）是一端封闭且一端打开的气缸。通过将基座（18）压入壳体（10）的开口端来封闭压电换能器。在这种情况下，压配允许在椭圆形或近椭圆形的小轴和长轴之间的部分具有最大值。

5. 发明授权

US4252839A Tuning fork-type quartz crystal vibrator and method of forming the same 失效
标题翻译：调音叉式石英振子及其形成方法
公开(公告)号：US4252839A
公开(公告)日：1981-02-24
申请号：US864271
申请日：1977-12-27
申请人： Makoto Wakasugi
发明人： Makoto Wakasugi
IPC分类号： C23C14/04 , G04F5/06 , B05D3/06
CPC分类号： G04F5/063 , C23C14/04 , C23C14/042
摘要： A metal electrode film is formed by evaporation on a tuning fork-type quartz crystal vibrator by means of a thin flat mask which has a portion of reduced thickness so that the metallic evaporant is deposited beneath the thinner portion of the mask. In forming electrodes on a tuning fork-type quartz crystal vibrator having X, Y and Z surfaces, a mask has a portion which is positioned in the X-plane between the evaporative deposition source and the inner end of the slit between the tines of vibrator so that the metallic film is prevented from being deposited on portions of the X and Y surfaces of the vibrator adjacent to the inner end of the slit.
摘要翻译：金属电极膜通过薄型平面掩模在音叉式石英晶体振子上蒸发而形成，该平面掩模具有减小厚度的部分，使得金属蒸发剂沉积在掩模的较薄部分之下。在具有X，Y和Z表面的音叉式石英晶体振子上形成电极时，掩模具有位于蒸发沉积源和振动器的尖齿之间的狭缝内的X平面之间的部分使得防止金属膜沉积在与狭缝的内端相邻的振动器的X和Y表面的部分上。

6. 发明授权

US6157937A High speed interpolation circuit with small circuit scale 失效
标题翻译：具有小电路规格的高速插补电路
公开(公告)号：US6157937A
公开(公告)日：2000-12-05
申请号：US116961
申请日：1998-07-17
申请人： Makoto Wakasugi
发明人： Makoto Wakasugi
IPC分类号： G06F7/544 , G06F17/17 , G06T3/40
CPC分类号： G06T3/4007
摘要： An interpolation circuit for calculating the value of an arbitrary point by interpolation using the values of points on the boundaries of a domain which surrounds the arbitrary point comprises a partial product generation circuit composed of multiplexers and a partial product addition circuit for adding partial products generated by the partial product generation circuit together. When an interpolated value f(C) between f(Ci) and f(Ci+1) (where the integer part of C is Ci and the decimal part of C as a binary number of n digits is c=C.sub.n-1 2.sup.n-1 +C.sub.n-2 2.sup.n-2 + . . . +C.sub.1 2.sup.1 +C.sub.0 2.sup.0) is calculated by the interpolation circuit, each multiplexer MPk+1 (k=0, 1, . . . , n-2, n-1) corresponding to 2.sup.k of the decimal part c is supplied with two input values f(Ci) and f(Ci+1) and one selection signal Ck (k=0, 1, . . . , n-2, n-1) respectively and outputs f(Ci) or f(Ci+1) depending on the selection signal Ck, and the interpolated value f(C) is obtained by the partial product addition circuit by adding the outputs of the multiplexers MPk+1 (k=0, 1, . . . , n-2, n-1) corresponding to 2.sup.k as the partial products together. By use of the multiplexers as the partial product generation circuit, circuit composition of the interpolation circuit can be considerably simplified, and thus high speed interpolation calculation can be realized and systems which employ interpolation circuits can be miniaturized.
摘要翻译：用于通过使用围绕任意点的域的边界上的点的值进行插值来计算任意点的值的内插电路包括由多路复用器和部分乘积加法电路构成的部分乘积生成电路，该部分乘积生成电路用于添加由部分产品生成电路在一起。当f（Ci）和f（Ci + 1）之间（其中C的整数部分为Ci，C的小数部分为n位数的二进制数）为c = Cn-12n-1时的内插值f（C） + Cn-22n-2 + ... + C121 + C020）由内插电路计算，对应于2k的每个复用器MPk + 1（k = 0,1，...，n-2，n-1）小数部分c分别被提供有两个输入值f（Ci）和f（Ci + 1）和一个选择信号Ck（k = 0,1，...，n-2，n-1），并输出f Ci）或f（Ci + 1），并且通过将多路复用器MPk + 1（k = 0,1，...）的输出相加，通过部分积加法电路获得内插值f（C） ...，n-2，n-1）对应于2k作为部分积。通过使用多路复用器作为部分乘积生成电路，可以显着地简化内插电路的电路组成，从而可以实现高速插值计算，并且可以将采用内插电路的系统小型化。

7. 发明授权

US06924429B2 Electronic device and production method therefor 失效
标题翻译：电子设备及其制造方法
公开(公告)号：US06924429B2
公开(公告)日：2005-08-02
申请号：US10398563
申请日：2002-08-16
申请人： Takao Kasai , Makoto Wakasugi , Tsuneji Takasugi
发明人： Takao Kasai , Makoto Wakasugi , Tsuneji Takasugi
IPC分类号： C04B35/111 , H01L23/055 , H01L23/057 , H01L23/10 , H03H3/02 , H03H9/05 , H03H9/10 , H05K5/06
CPC分类号： B32B18/00 , B32B2311/04 , B32B2311/08 , B32B2311/12 , B32B2311/22 , B32B2311/30 , C04B35/111 , C04B37/006 , C04B37/026 , C04B37/045 , C04B2235/6025 , C04B2235/6567 , C04B2235/6585 , C04B2237/10 , C04B2237/124 , C04B2237/125 , C04B2237/126 , C04B2237/341 , C04B2237/343 , C04B2237/40 , C04B2237/405 , C04B2237/406 , C04B2237/407 , C04B2237/408 , C04B2237/62 , C04B2237/64 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/72 , C04B2237/76 , C04B2237/82 , H01L23/055 , H01L23/057 , H01L23/10 , H01L2224/48091 , H01L2224/73265 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H03H3/02 , H03H9/0552 , H03H9/1021 , H01L2924/00014 , H01L2924/00
摘要： A method for producing an electronic element comprising a housing composed of an insulating ceramic substrate and a lid member covering a surface of the ceramic substrate, with at least one electronic element being mounted inside the housing. After preparing a plate-like ceramic substrate by baking a composite containing inorganic powders and a binder, the ceramic substrate is shaped in accordance with a predetermined design of the device, a metalized layer is formed on a surface of the shaped ceramic substrate, an electronic element is mounted in a predetermined area of the ceramic substrate, and the ceramic substrate is sealed with the lid member.
摘要翻译：一种电子元件的制造方法，包括由绝缘陶瓷基板和覆盖陶瓷基板的表面的盖部件构成的壳体，至少一个电子元件安装在壳体的内部。在通过烘烤含有无机粉末和粘合剂的复合材料制备板状陶瓷基板之后，陶瓷基板根据该装置的预定设计成形，在成形陶瓷基板的表面上形成金属化层，电子元件安装在陶瓷基板的预定区域中，陶瓷基板被盖部件密封。

8. 发明授权

US5628106A Method of manufacturing magnetic head 失效
标题翻译：制造磁头的方法
公开(公告)号：US5628106A
公开(公告)日：1997-05-13
申请号：US261963
申请日：1994-06-17
申请人： Makoto Wakasugi
发明人： Makoto Wakasugi
IPC分类号： C03C29/00 , G11B5/127 , G11B5/23 , G11B5/265 , G11B5/235
CPC分类号： C03C29/00 , G11B5/1272 , G11B5/232 , G11B5/2651 , Y10T29/49039 , Y10T29/49057
摘要： In a first glass bonding process, a silicon-dioxide layer is formed on either a first or second magnetic material by vacuum evaporation. The first or second magnetic material with the silicon-dioxide layer is dipped in a warm solution containing alkali sodium or potassium for a predetermined period of time. Alkali metal is diffused on a surface of the silicon-dioxide layer to form a glass layer thereon, thereby bonding the first and second magnetic materials.
摘要翻译：在第一玻璃接合工艺中，通过真空蒸发在第一或第二磁性材料上形成二氧化硅层。将具有二氧化硅层的第一或第二磁性材料浸入含有碱性钠或钾的温热溶液中一段预定的时间。碱金属在二氧化硅层的表面上扩散，在其上形成玻璃层，从而结合第一和第二磁性材料。

9. 发明授权

US5151837A Composite magnetic head 失效
标题翻译：复合磁头
公开(公告)号：US5151837A
公开(公告)日：1992-09-29
申请号：US638766
申请日：1991-01-08
申请人： Makoto Wakasugi , Takao Kasai
发明人： Makoto Wakasugi , Takao Kasai
IPC分类号： G11B5/10 , G11B5/105 , G11B5/11
CPC分类号： G11B5/105 , G11B5/10 , G11B5/11 , Y10T29/4903
摘要： A magnetic head includes a core chip, a slider having an aperture for receiving the core chip and protrusions for positioning and constraining the core chip received in the aperture. The protrusions are formed on the inner walls of the aperture. After the core chip has been inserted into the aperture, a molten welding material is flowed into the clearance between the core chip and the inner walls of the aperture so as to weld the core chip to the inner walls of the aperture in the slider. The clearance between the core chip and the inner walls of the aperture is equalized. If the core chip is formed of soft magnetic material, the slider can absorb electromagnetic noises.
摘要翻译：磁头包括芯片芯片，具有用于接收芯片芯片的滑块和用于定位和限制接收在孔中的芯片芯片的凸起的滑块。突起形成在孔的内壁上。在核心芯片已经插入孔中之后，熔融的焊接材料流入核心芯片和孔的内壁之间的间隙中，以将芯片芯焊接到滑块的孔的内壁。芯片与孔的内壁之间的间隙相等。如果芯片由软磁材料形成，则滑块可以吸收电磁噪声。

10. 发明申请

US20090140769A1 System-in-package 审中-公开
标题翻译：系统级封装
公开(公告)号：US20090140769A1
公开(公告)日：2009-06-04
申请号：US12289822
申请日：2008-11-05
申请人： Katsunobu Suzuki , Takao Ikeuchi , Fumihiko Tajima , Kazuaki Maehara , Hajime Kawamura , Makoto Wakasugi
发明人： Katsunobu Suzuki , Takao Ikeuchi , Fumihiko Tajima , Kazuaki Maehara , Hajime Kawamura , Makoto Wakasugi
IPC分类号： H03K19/0175
CPC分类号： H01L25/18 , H01L23/3677 , H01L23/49827 , H01L23/5386 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2225/06506 , H01L2225/0651 , H01L2924/00014 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A System-in-Package includes a first chip to be mounted in common for a plurality of product types, a second chip having different specifications for each product type, and a wiring substrate being common to a plurality of product types, on which the first chip and the second chip are to be mounted. A setting signal is supplied from the second chip to the first chip.
摘要翻译：一种系统级封装包括：为多种产品类型共同安装的第一芯片;对于每种产品类型具有不同规格的第二芯片;以及多个产品类型共有的布线基板，芯片和第二芯片将被安装。设置信号从第二芯片提供给第一芯片。

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