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1. 发明申请

US20050040512A1 Circuit device 有权
标题翻译：电路设备
公开(公告)号：US20050040512A1
公开(公告)日：2005-02-24
申请号：US10899220
申请日：2004-07-26
申请人： Makoto Tsubonoya , Katsuhiko Shibusawa , Takashi Kitazawa
发明人： Makoto Tsubonoya , Katsuhiko Shibusawa , Takashi Kitazawa
IPC分类号： H01L25/18 , H01L21/50 , H01L21/60 , H01L23/28 , H01L23/48 , H01L23/495 , H01L23/50 , H01L25/00 , H01L25/04 , H01L27/15
CPC分类号： H01L24/85 , H01L23/49541 , H01L23/49575 , H01L23/49589 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/85 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2224/78 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A circuit device is provided comprising leads and electrical circuitry. The circuit device has a first semiconductor element, a second semiconductor element, first leads electrically connected to the first semiconductor element or the second semiconductor element via fine metal wires and having an end thereof extending outwardly, second leads electrically connected via metal wires to both the first semiconductor element and the second semiconductor element to thus electrically connect the first and second semiconductor elements.
摘要翻译：提供了一种包括引线和电路的电路装置。电路装置具有第一半导体元件，第二半导体元件，通过细金属线电连接到第一半导体元件或第二半导体元件并且其端部向外延伸的第一引线，第二引线通过金属线电连接到两者第一半导体元件和第二半导体元件，从而电连接第一和第二半导体元件。

2. 发明授权

US07332803B2 Circuit device 有权
标题翻译：电路设备
公开(公告)号：US07332803B2
公开(公告)日：2008-02-19
申请号：US10899220
申请日：2004-07-26
申请人： Makoto Tsubonoya , Katsuhiko Shibusawa , Takashi Kitazawa
发明人： Makoto Tsubonoya , Katsuhiko Shibusawa , Takashi Kitazawa
IPC分类号： H01L23/52
CPC分类号： H01L24/85 , H01L23/49541 , H01L23/49575 , H01L23/49589 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/85 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2224/78 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A circuit device is provided comprising leads and electrical circuitry. The circuit device has a first semiconductor element, a second semiconductor element, first leads electrically connected to the first semiconductor element or the second semiconductor element via fine metal wires and having an end thereof extending outwardly, second leads electrically connected via metal wires to both the first semiconductor element and the second semiconductor element to thus electrically connect the first and second semiconductor elements.
摘要翻译：提供了一种包括引线和电路的电路装置。电路装置具有第一半导体元件，第二半导体元件，通过细金属线电连接到第一半导体元件或第二半导体元件并且其端部向外延伸的第一引线，第二引线通过金属线电连接到两者第一半导体元件和第二半导体元件，从而电连接第一和第二半导体元件。

3. 发明申请

US20070090521A1 Circuit device and method of manufacturing the same 审中-公开
标题翻译：电路装置及其制造方法
公开(公告)号：US20070090521A1
公开(公告)日：2007-04-26
申请号：US10569788
申请日：2004-09-01
申请人： Hideo Imaizumi , Takuji Kato , Kenichi Nakajima , Masami Harigai , Masachika Kuwata , Isao Ochiai , Makoto Tsubonoya , Katsuhiko Shibusawa , Iwao Takase
发明人： Hideo Imaizumi , Takuji Kato , Kenichi Nakajima , Masami Harigai , Masachika Kuwata , Isao Ochiai , Makoto Tsubonoya , Katsuhiko Shibusawa , Iwao Takase
IPC分类号： H01L23/34
CPC分类号： H01L23/49558 , H01L21/565 , H01L23/315 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/49175 , H01L2924/00014 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： It is an object of the present invention to provide a circuit device in which a plurality of circuit elements including a circuit element having a hollow inside are sealed with resin, and to provide a method of manufacturing the same. A circuit device (10) has a first circuit element (13A) having a hollow inside and a plurality of second circuit elements (13B) electrically connected to the first circuit element (13A). The first and second circuit elements (13A) and (13B) are sealed with sealing resin (15). The distances by which the first circuit element (13A) is separated from the second circuit elements (13B) are longer than those by which the second circuit elements (13B) are separated from each other.
摘要翻译：本发明的目的是提供一种电路装置，其中包括具有中空的电路元件的多个电路元件用树脂密封，并提供其制造方法。电路装置（10）具有具有中空内部的第一电路元件（13A）和与第一电路元件（13A）电连接的多个第二电路元件（13B）。第一和第二电路元件（13A）和（13B）用密封树脂（15）密封。第一电路元件（13A）与第二电路元件（13B）分离的距离比第二电路元件（13B）彼此分离的距离长。

4. 发明申请

US20050029534A1 Semiconductor device and method of manufacturing the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050029534A1
公开(公告)日：2005-02-10
申请号：US10899219
申请日：2004-07-26
申请人： Isao Ochiai , Makoto Tsubonoya , Katsuhiko Shibusawa , Takanori Kato
发明人： Isao Ochiai , Makoto Tsubonoya , Katsuhiko Shibusawa , Takanori Kato
IPC分类号： H01L21/50 , H01L21/52 , H01L21/56 , H01L21/58 , H01L21/60 , H01L23/02 , H01L23/055 , H01L23/32 , H01L31/02 , H01L33/62 , H05K1/00 , H01L33/00
CPC分类号： H01L33/483 , H01L23/055 , H01L23/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L31/0203 , H01L2224/05553 , H01L2224/05599 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4823 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/09701 , H01L2924/10157 , H01L2924/10158 , H01L2924/10162 , H01L2924/12044 , H01L2924/16152 , H01L2224/45099 , H01L2924/00 , H01L2924/00015
摘要： A semiconductor device of the present invention has a semiconductor element mounted on a surface of a support substrate, a case member for covering the surface of the support substrate to seal the semiconductor element, fine metal wires as connecting region for electrically connecting the semiconductor element and external terminals extending outside, and a frame member as a fixing component for mechanically fixing the semiconductor element to the support substrate by coming into contact with side surfaces of the semiconductor element.
摘要翻译：本发明的半导体器件具有安装在支撑基板的表面上的半导体元件，用于覆盖支撑基板的表面以密封半导体元件的壳体构件，作为用于将半导体元件电连接的连接区域的细金属线外部端子延伸到外部，框架构件作为固定部件，用于通过与半导体元件的侧表面接触来将半导体元件机械地固定到支撑基板。

5. 发明授权

US5099333A Solid state image sensing device having no field isolation layer 失效
标题翻译：没有场隔离层的固体摄像装置
公开(公告)号：US5099333A
公开(公告)日：1992-03-24
申请号：US397753
申请日：1989-08-23
申请人： Katsuhiko Shibusawa
发明人： Katsuhiko Shibusawa
IPC分类号： H01L27/148 , H04N5/335 , H04N5/341 , H04N5/349 , H04N5/369 , H04N5/3728
CPC分类号： H01L27/14831
摘要： A solid state image sensing device is comprised of a plurality of vertical electrons transfer areas and a plurality of transfer electrodes for receiving different clock signals respectively, a plurality of polysilicon patterns for connecting one of the transfer electrodes in one of the vertical channels to other transfer electrodes receiving the same clock signal in other vertical channels and a plurality of photodiode being alternately disposed to the vertical channels, each of the photodiode being surrounded by a part of each of the polysilicon patterns.
摘要翻译：固态图像感测装置由多个垂直电子传输区域和多个传输电极组成，用于分别接收不同的时钟信号;多个多晶硅图案，用于将一个垂直通道中的一个传输电极连接到另一个传输在其他垂直通道中接收相同时钟信号的电极和交替地设置在垂直通道上的多个光电二极管，每个光电二极管被每个多晶硅图案的一部分包围。

6. 发明授权

US07075188B2 Circuit device and method for manufacturing the same 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US07075188B2
公开(公告)日：2006-07-11
申请号：US10785471
申请日：2004-02-24
申请人： Takuji Kato , Isao Ochiai , Katsuhiko Shibusawa
发明人： Takuji Kato , Isao Ochiai , Katsuhiko Shibusawa
IPC分类号： H01L21/26 , H01L21/42
CPC分类号： H01L25/105 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2225/1029 , H01L2924/01078 , H01L2924/14 , H01L2924/19041 , H01L2924/00014 , H01L2924/00
摘要： In order to provide a circuit device 10 where a second circuit element 15B is exposed from a sealing resin 16, a circuit device 10A comprises: an island 12 to whose top a first circuit element 15A is fixedly fitted; a plurality of leads 11 which are extended around the island 12 and electrically connected to the first circuit element 15A; a sealing resin 16 which seals the first circuit element 15A, the island 12, and leads 11 and forms a cavity portion 18; and a second circuit element 15B stored in the cavity portion 18. Accordingly, since the second circuit element 15B can be externally provided, the degree of freedom for mounting can be improved.
摘要翻译：为了提供电路装置10，其中第二电路元件15B从密封树脂16暴露出来，电路装置10A包括：岛12，其顶部固定有第一电路元件15A; 多个引线11，其围绕岛12延伸并电连接到第一电路元件15A; 密封树脂16，其密封第一电路元件15A，岛12和引线11并形成空腔部分18; 以及存储在空腔部分18中的第二电路元件15B。因此，由于可以从外部设置第二电路元件15B，所以可以提高安装的自由度。

7. 发明授权

US5235426A Solid state image sensing device having no field isolation layer 失效
标题翻译：没有场隔离层的固体摄像装置
公开(公告)号：US5235426A
公开(公告)日：1993-08-10
申请号：US819115
申请日：1992-01-10
申请人： Katsuhiko Shibusawa
发明人： Katsuhiko Shibusawa
IPC分类号： H01L27/148
CPC分类号： H01L27/14831
摘要： A method of operating a solid state image sensing device having a plurality of electron transfer channels; first and second photodiodes; and first, second, third and fourth electrodes disposed on the electron transfer channels and surrounding the first and second photodiodes. The method includes the step of applying a first potential to the first electrode to transfer electrons from the second photodiode to an electron transfer channel and simultaneously applying a lower potential to the second, third and fourth electrodes to prohibit the electron transfer from the second photodiode to the transfer channel. The method also applies the first potential to the third electrode to transfer electrons from the first photodiode to the electron transfer channel and simultaneously applies the lower potential to the first, second and fourth electrodes to prohibit the electron transfer from the first photodiode to the electron transfer channel. Finally, the method includes the step of sequentially applying a second potential to the first, second, third and fourth electrodes to transfer electrons through the electron transfer channel.
摘要翻译：一种操作具有多个电子传输通道的固态图像感测装置的方法; 第一和第二光电二极管; 以及设置在电子传输通道上并围绕第一和第二光电二极管的第一，第二，第三和第四电极。该方法包括向第一电极施加第一电位以将电子从第二光电二极管转移到电子传输通道的步骤，同时向第二，第三和第四电极施加较低的电位以禁止从第二光电二极管到第传输通道。该方法还将第一电位施加到第三电极以将电子从第一光电二极管转移到电子传输通道，并且同时将较低电位施加到第一，第二和第四电极，以禁止从第一光电二极管到电子转移的电子转移渠道。最后，该方法包括顺序地向第一，第二，第三和第四电极施加第二电位以将电子传送通过电子传输通道的步骤。

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