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1. 发明授权

US08290241B2 Analyzing apparatus, program, defect inspection apparatus, defect review apparatus, analysis system, and analysis method 有权
标题翻译：分析仪器，程序，缺陷检查装置，缺陷检查装置，分析系统和分析方法
公开(公告)号：US08290241B2
公开(公告)日：2012-10-16
申请号：US12039255
申请日：2008-02-28
申请人： Makoto Ono , Junko Konishi , Tomohiro Funakoshi
发明人： Makoto Ono , Junko Konishi , Tomohiro Funakoshi
IPC分类号： G06K9/00
CPC分类号： G06K9/6215 , G06K2209/19 , G06T7/0004 , G06T2207/30148
摘要： In order to allow to easily specify inspection recipe with which defects desired to be detected can be detected efficiently, a defect inspection apparatus performs defect inspection of a substrate in accordance with a plurality of inspection recipes and produces defect information associated with position of defect in the substrate and attribute data of the defect for each of the inspection recipes and a defect review apparatus produces review result information specifying a kind of defect selected from defects contained in the defect information. An analyzing apparatus obtains defect information and review result information and totalizes the number of defects having attribute data similar to attribute data possessed in defects corresponding to kind of defects to be analyzed for each inspection recipe.
摘要翻译：为了能够容易地指定能够有效地检测出希望的缺陷的检查配方，缺陷检查装置根据多个检查配方进行基板的缺陷检查，并且生成与缺陷的位置有关的缺陷信息每个检查配方的缺陷的基板和属性数据以及缺陷检查装置产生指定从缺陷信息中包含的缺陷中选择的缺陷的种类的检查结果信息。分析装置获取缺陷信息并查看结果信息，并且将具有属性数据的缺陷的数量的总和与每个检查配方的要分析的缺陷的种类相对应的缺陷中具有的属性数据相似。

2. 发明申请

US20080226153A1 ANALYZING APPARATUS, PROGRAM, DEFECT INSPECTION APPARATUS, DEFECT REVIEW APPARATUS, ANALYSIS SYSTEM, AND ANALYSIS METHOD 有权
标题翻译：分析装置，程序，缺陷检查装置，缺陷检查装置，分析系统和分析方法
公开(公告)号：US20080226153A1
公开(公告)日：2008-09-18
申请号：US12039255
申请日：2008-02-28
申请人： Makoto ONO , Junko Konishi , Tomohiro Funakoshi
发明人： Makoto ONO , Junko Konishi , Tomohiro Funakoshi
IPC分类号： G06K9/00
CPC分类号： G06K9/6215 , G06K2209/19 , G06T7/0004 , G06T2207/30148
摘要： In order to allow to easily specify inspection recipe with which defects desired to be detected can be detected efficiently, a defect inspection apparatus performs defect inspection of a substrate in accordance with a plurality of inspection recipes and produces defect information associated with position of defect in the substrate and attribute data of the defect for each of the inspection recipes and a defect review apparatus produces review result information specifying a kind of defect selected from defects contained in the defect information. An analyzing apparatus obtains defect information and review result information and totalizes the number of defects having attribute data similar to attribute data possessed in defects corresponding to kind of defects to be analyzed for each inspection recipe.
摘要翻译：为了能够容易地指定能够有效地检测出希望的缺陷的检查配方，缺陷检查装置根据多个检查配方进行基板的缺陷检查，并且生成与缺陷的位置有关的缺陷信息每个检查配方的缺陷的基板和属性数据以及缺陷检查装置产生指定从缺陷信息中包含的缺陷中选择的缺陷的种类的检查结果信息。分析装置获取缺陷信息并查看结果信息，并且将具有属性数据的缺陷的数量的总和与每个检查配方的要分析的缺陷的种类相对应的缺陷中具有的属性数据相似。

3. 发明申请

US20110311125A1 OBSERVATION CONDITION DETERMINATION SUPPORT DEVICE AND OBSERVATION CONDITION DETERMINATION SUPPORT METHOD 失效
标题翻译：观察条件确定支持设备和观察条件确定支持方法
公开(公告)号：US20110311125A1
公开(公告)日：2011-12-22
申请号：US13131759
申请日：2009-11-19
申请人： Junko Konishi , Tomohiro Funakoshi , Tsunehiro Sakai
发明人： Junko Konishi , Tomohiro Funakoshi , Tsunehiro Sakai
IPC分类号： G06K9/00
CPC分类号： H01L22/20 , G06T7/0004 , G06T2200/24 , G06T2207/30148 , H01L22/12
摘要： Provided is an observation condition determination support device which can improve the defect classification accuracy. The observation condition determination support device includes: a means (26) for acquiring a plurality of defects images which have captured the same defect under a plurality of observation conditions set in advance in an observation device (5) in accordance with check data relating to defects of a semiconductor device detected by an inspection device (4); a means (12) for classifying the plurality of the same defects according to the respective defect images and determining a first category to which the same defects belong for each of the observation conditions as a result of the classification; and a means (13) for determining an observation condition to be used when fabricating the semiconductor device among the plurality of the observation conditions according to the ratio at which the first category is matched with a second category determined by a user of the observation device who has classified the same defects
摘要翻译：提供了可以提高缺陷分类精度的观察条件判定支持装置。观察条件确定支持装置包括：根据与缺陷有关的检查数据，在观察装置（5）中预先设置的多个观察条件下获取已经捕获相同缺陷的多个缺陷图像的装置（26）由检查装置（4）检测的半导体装置; 根据各个缺陷图像对多个相同的缺陷进行分类的装置（12），并且作为分类的结果确定与每个观察条件相同的缺陷属于的第一类别; 以及用于根据所述第一类别与所述观察装置的用户确定的第二类别匹配的比例，确定在所述多个观察条件中制造所述半导体装置时使用的观察条件的装置（13）已分类相同的缺陷

4. 发明申请

US20110274362A1 IMAGE CLASSIFICATION STANDARD UPDATE METHOD, PROGRAM, AND IMAGE CLASSIFICATION DEVICE 有权
标题翻译：图像分类标准更新方法，程序和图像分类装置
公开(公告)号：US20110274362A1
公开(公告)日：2011-11-10
申请号：US13142812
申请日：2009-12-28
申请人： Yuya Isomae , Fumiaki Endo , Tomohiro Funakoshi , Junko Konishi , Tsunehiro Sakai
发明人： Yuya Isomae , Fumiaki Endo , Tomohiro Funakoshi , Junko Konishi , Tsunehiro Sakai
IPC分类号： G06K9/62
CPC分类号： G06K9/6263 , G01N21/94 , G01N21/95607 , G01N2021/8854 , G06K9/033 , G06K9/6254 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： The objective is to improve a classification standard. Classification standard data, in which is registered image data information that is the standard when image data is classified, and classification data, in which is registered image data information that is the result when newly input image data is classified using the classification standard data, are stored in a storage unit. An image classification device is characterized in that when any image data information of the image data that is registered in the classification data is selected by means of an input unit, and an instruction to additionally register the selected image data information in the classification standard data is input by means of the input unit, the selected image data information is additionally registered in the classification standard data.
摘要翻译：目标是提高分类标准。分类标准数据，其中作为分类图像数据时的标准的登记图像数据信息，以及分类数据，其中作为新输入图像数据使用分类标准数据分类的结果的登记图像数据信息是分类数据，存储在存储单元中。图像分类装置的特征在于，当通过输入单元选择登记在分类数据中的图像数据的任何图像数据信息，并且在分类标准数据中附加地注册所选择的图像数据信息的指令是通过输入单元输入，所选择的图像数据信息被附加地登记在分类标准数据中。

5. 发明授权

US08625906B2 Image classification standard update method, program, and image classification device 有权
标题翻译：图像分类标准更新方法，程序和图像分类装置
公开(公告)号：US08625906B2
公开(公告)日：2014-01-07
申请号：US13142812
申请日：2009-12-28
申请人： Yuya Isomae , Fumiaki Endo , Tomohiro Funakoshi , Junko Konishi , Tsunehiro Sakai
发明人： Yuya Isomae , Fumiaki Endo , Tomohiro Funakoshi , Junko Konishi , Tsunehiro Sakai
IPC分类号： G06K9/62 , G06K9/54
CPC分类号： G06K9/6263 , G01N21/94 , G01N21/95607 , G01N2021/8854 , G06K9/033 , G06K9/6254 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： The objective is to improve a classification standard. Classification standard data, in which is registered image data information that is the standard when image data is classified, and classification data, in which is registered image data information that is the result when newly input image data is classified using the classification standard data, are stored in a storage unit. An image classification device is characterized in that when any image data information of the image data that is registered in the classification data is selected by means of an input unit, and an instruction to additionally register the selected image data information in the classification standard data is input by means of the input unit, the selected image data information is additionally registered in the classification standard data.
摘要翻译：目标是提高分类标准。分类标准数据，其中作为分类图像数据时的标准的登记图像数据信息，以及分类数据，其中作为新输入图像数据使用分类标准数据分类的结果的登记图像数据信息是分类数据，存储在存储单元中。图像分类装置的特征在于，当通过输入单元选择登记在分类数据中的图像数据的任何图像数据信息，并且在分类标准数据中附加地注册所选择的图像数据信息的指令是通过输入单元输入，所选择的图像数据信息被附加地登记在分类标准数据中。

6. 发明授权

US08209135B2 Wafer inspection data handling and defect review tool 有权
标题翻译：晶圆检查数据处理和缺陷检查工具
公开(公告)号：US08209135B2
公开(公告)日：2012-06-26
申请号：US13040794
申请日：2011-03-04
申请人： Tomohiro Funakoshi , Junko Konishi , Yuko Kariya , Noritsugu Takahashi , Fumiaki Endo
发明人： Tomohiro Funakoshi , Junko Konishi , Yuko Kariya , Noritsugu Takahashi , Fumiaki Endo
IPC分类号： H04N7/18
CPC分类号： G03F7/7065 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G03F1/84
摘要： A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.
摘要翻译：由晶片检查工具检测到的缺陷由缺陷检查工具可靠地捕获。缺陷检查工具中的缺陷检查条件根据晶片检查工具提供的缺陷属性而变化，以优化审查过程。例如，根据缺陷的尺寸来改变复查倍率，或者根据最大灰度差来改变帧相加数。

7. 发明授权

US08472696B2 Observation condition determination support device and observation condition determination support method 失效
标题翻译：观察条件确定支持装置和观察条件确定支持方法
公开(公告)号：US08472696B2
公开(公告)日：2013-06-25
申请号：US13131759
申请日：2009-11-19
申请人： Junko Konishi , Tomohiro Funakoshi , Tsunehiro Sakai
发明人： Junko Konishi , Tomohiro Funakoshi , Tsunehiro Sakai
IPC分类号： G06K9/62
CPC分类号： H01L22/20 , G06T7/0004 , G06T2200/24 , G06T2207/30148 , H01L22/12
摘要： Provided is an observation condition determination support device which can improve the defect classification accuracy. The observation condition determination support device includes: a means (26) for acquiring a plurality of defects images which have captured the same defect under a plurality of observation conditions set in advance in an observation device (5) in accordance with check data relating to defects of a semiconductor device detected by an inspection device (4); a means (12) for classifying the plurality of the same defects according to the respective defect images and determining a first category to which the same defects belong for each of the observation conditions as a result of the classification; and a means (13) for determining an observation condition to be used when fabricating the semiconductor device among the plurality of the observation conditions according to the ratio at which the first category is matched with a second category determined by a user of the observation device who has classified the same defects.
摘要翻译：提供了可以提高缺陷分类精度的观察条件判定支持装置。观察条件确定支持装置包括：根据与缺陷有关的检查数据，在观察装置（5）中预先设置的多个观察条件下获取已经捕获相同缺陷的多个缺陷图像的装置（26）由检查装置（4）检测的半导体装置; 根据各个缺陷图像对多个相同的缺陷进行分类的装置（12），并且作为分类的结果确定与每个观察条件相同的缺陷属于的第一类别; 以及用于根据所述第一类别与所述观察装置的用户确定的第二类别匹配的比例，确定在所述多个观察条件中制造所述半导体装置时使用的观察条件的装置（13）已分类相同的缺陷。

8. 发明申请

US20070105245A1 Wafer inspection data handling and defect review tool 审中-公开
标题翻译：晶圆检查数据处理和缺陷检查工具
公开(公告)号：US20070105245A1
公开(公告)日：2007-05-10
申请号：US11594757
申请日：2006-11-09
申请人： Tomohiro Funakoshi , Junko Konishi , Yuko Kariya , Noritsugu Takahashi , Fumiaki Endo
发明人： Tomohiro Funakoshi , Junko Konishi , Yuko Kariya , Noritsugu Takahashi , Fumiaki Endo
IPC分类号： H01L21/66
CPC分类号： G03F7/7065 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G03F1/84
摘要： A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.
摘要翻译：由晶片检查工具检测到的缺陷由缺陷检查工具可靠地捕获。缺陷检查工具中的缺陷检查条件根据晶片检查工具提供的缺陷属性而变化，以优化审查过程。例如，根据缺陷的尺寸来改变复查倍率，或者根据最大灰度差来改变帧相加数。

9. 发明授权

US08462352B2 Surface inspection tool and surface inspection method 有权
标题翻译：表面检查工具和表面检查方法
公开(公告)号：US08462352B2
公开(公告)日：2013-06-11
申请号：US13450226
申请日：2012-04-18
申请人： Yuji Miyoshi , Tomohiro Funakoshi
发明人： Yuji Miyoshi , Tomohiro Funakoshi
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01B11/30 , G01N21/9501
摘要： A surface inspection tool 110 measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200. The surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.
摘要翻译：表面检查工具110通过与图案的晶片200上的测量坐标相关联地测量由照射的照射光产生的散射光的散射光强度并检查晶片200的表面粗糙度。表面检查工具包括控制器250，其提取测量将测量的散射光强度的坐标设定为等于或大于下限阈值L，设定与周边相对应的图案的整体布局401的一部分的部分布局405a中的表面粗糙度检查的检查范围406 提取测量坐标，并获得检查范围406中的表面粗糙度。

10. 发明申请

US20120262723A1 SURFACE INSPECTION TOOL AND SURFACE INSPECTION METHOD 有权
标题翻译：表面检查工具和表面检查方法
公开(公告)号：US20120262723A1
公开(公告)日：2012-10-18
申请号：US13450226
申请日：2012-04-18
申请人： Yuji MIYOSHI , Tomohiro Funakoshi
发明人： Yuji MIYOSHI , Tomohiro Funakoshi
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01B11/30 , G01N21/9501
摘要： A surface inspection tool 110 measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200. The surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.
摘要翻译：表面检查工具110通过与图案的晶片200上的测量坐标相关联地测量由照射的照射光产生的散射光的散射光强度并检查晶片200的表面粗糙度。表面检查工具包括控制器250，其提取测量将测量的散射光强度的坐标设定为等于或大于下限阈值L，设定与周边相对应的图案的整体布局401的一部分的部分布局405a中的表面粗糙度检查的检查范围406 提取测量坐标，并获得检查范围406中的表面粗糙度。

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