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1. 发明授权

US08656581B2 Method of fabricating a circuit apparatus 有权
标题翻译：电路装置的制造方法
公开(公告)号：US08656581B2
公开(公告)日：2014-02-25
申请号：US12563849
申请日：2009-09-21
申请人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
发明人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
IPC分类号： H05K3/36
CPC分类号： H05K3/243 , H01L23/3128 , H01L23/3142 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/16225 , H01L2224/16237 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48464 , H01L2224/48465 , H01L2224/48599 , H01L2224/48644 , H01L2224/49171 , H01L2224/81801 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K3/284 , H05K3/3452 , H05K3/382 , H05K2201/0989 , H05K2203/049 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49222 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for fabricating a circuit apparatus includes forming a wiring layer, a conductive layer, and a first insulating layer on the wiring substrate, removing the conductive layer in an opening of the first insulating layer so as to expose the wiring layer, forming a gold plating layer on the wiring layer, removing the first insulating layer and the conductive layer, forming a second insulating layer on the wiring substrate, the second insulating layer having an opening through which the gold plating and adjacent wiring layers are exposed, and electrically connecting a circuit element to the gold plating layer.
摘要翻译：一种制造电路装置的方法，包括在布线基板上形成布线层，导电层和第一绝缘层，去除第一绝缘层的开口中的导电层，以露出布线层，形成金在所述布线层上除去所述第一绝缘层和所述导电层，在所述布线基板上形成第二绝缘层，所述第二绝缘层具有开金属镀层和相邻配线层露出的开口，电路元件到镀金层。

2. 发明授权

US07612445B2 Circuit apparatus and method of fabricating the apparatus 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US07612445B2
公开(公告)日：2009-11-03
申请号：US11740669
申请日：2007-04-26
申请人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
发明人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
IPC分类号： H01L23/48 , H01L23/06 , H01R43/00
CPC分类号： H05K3/243 , H01L23/3128 , H01L23/3142 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/16225 , H01L2224/16237 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48464 , H01L2224/48465 , H01L2224/48599 , H01L2224/48644 , H01L2224/49171 , H01L2224/81801 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K3/284 , H05K3/3452 , H05K3/382 , H05K2201/0989 , H05K2203/049 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49222 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.
摘要翻译：密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。金电镀层形成在焊盘电极的布线层区域中。该地区外面的表面粗糙。绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。电路元件安装在绝缘树脂层上的预定区域上。密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

3. 发明申请

US20070164766A1 Circuit device 失效
标题翻译：电路设备
公开(公告)号：US20070164766A1
公开(公告)日：2007-07-19
申请号：US11526875
申请日：2006-09-26
申请人： Makoto Murai , Ryosuke Usui , Yasuhiro Kohara
发明人： Makoto Murai , Ryosuke Usui , Yasuhiro Kohara
IPC分类号： G01R31/02
CPC分类号： H05K1/0206 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/14 , H01L2924/19105 , H05K1/056 , H05K3/0052 , H05K3/0061 , H05K3/383 , H05K3/385 , H05K3/4652 , H05K2201/068 , H05K2201/09054 , H05K2201/2072 , H05K2203/0315 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.
摘要翻译：电路装置在电路板和散热器之间的界面处具有优良的机械强度，并且具有优异的效率，用于通过电路板从电路元件散热至散热片。电路装置包括用于安装电路元件的金属基绝缘板和安装有绝缘板的绝热板的散热器。绝缘板具有沿着周边部分布置在面向散热器的表面上的突起。突起的至少一部分通过膏层与散热片接触。

4. 发明申请

US20070252249A1 Circuit Apparatus and Method of Fabricating the Apparatus 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US20070252249A1
公开(公告)日：2007-11-01
申请号：US11740669
申请日：2007-04-26
申请人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
发明人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
IPC分类号： H01L23/495
CPC分类号： H05K3/243 , H01L23/3128 , H01L23/3142 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/16225 , H01L2224/16237 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48464 , H01L2224/48465 , H01L2224/48599 , H01L2224/48644 , H01L2224/49171 , H01L2224/81801 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K3/284 , H05K3/3452 , H05K3/382 , H05K2201/0989 , H05K2203/049 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49222 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.
摘要翻译：密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。金电镀层形成在焊盘电极的布线层区域中。该地区外面的表面粗糙。绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。电路元件安装在绝缘树脂层上的预定区域上。密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

5. 发明授权

US07649739B2 Circuit device 失效
标题翻译：电路设备
公开(公告)号：US07649739B2
公开(公告)日：2010-01-19
申请号：US11526875
申请日：2006-09-26
申请人： Makoto Murai , Ryosuke Usui , Yasuhiro Kohara
发明人： Makoto Murai , Ryosuke Usui , Yasuhiro Kohara
IPC分类号： H05K5/00
CPC分类号： H05K1/0206 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/14 , H01L2924/19105 , H05K1/056 , H05K3/0052 , H05K3/0061 , H05K3/383 , H05K3/385 , H05K3/4652 , H05K2201/068 , H05K2201/09054 , H05K2201/2072 , H05K2203/0315 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.
摘要翻译：电路装置在电路板和散热器之间的界面处具有优良的机械强度，并且具有优异的效率，用于通过电路板从电路元件散热至散热片。电路装置包括用于安装电路元件的金属基绝缘板和安装有绝缘板的绝热板的散热器。绝缘板具有沿着周边部分布置在面向散热器的表面上的突起。突起的至少一部分通过膏层与散热片接触。

6. 发明申请

US20100005653A1 Circuit Apparatus and Method of Fabricating the Apparatus 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US20100005653A1
公开(公告)日：2010-01-14
申请号：US12563849
申请日：2009-09-21
申请人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
发明人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
IPC分类号： H05K3/10
CPC分类号： H05K3/243 , H01L23/3128 , H01L23/3142 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/16225 , H01L2224/16237 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48464 , H01L2224/48465 , H01L2224/48599 , H01L2224/48644 , H01L2224/49171 , H01L2224/81801 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K3/284 , H05K3/3452 , H05K3/382 , H05K2201/0989 , H05K2203/049 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49222 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.
摘要翻译：密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。金电镀层形成在焊盘电极的布线层区域中。该地区外面的表面粗糙。绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。电路元件安装在绝缘树脂层上的预定区域上。密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

7. 发明申请

US20070252270A1 Circuit Apparatus 审中-公开
标题翻译：电路设备
公开(公告)号：US20070252270A1
公开(公告)日：2007-11-01
申请号：US11740639
申请日：2007-04-26
申请人： Yoh Takano , Ryosuke Usui , Makoto Murai
发明人： Yoh Takano , Ryosuke Usui , Makoto Murai
IPC分类号： H01L23/34
CPC分类号： H01L23/3677 , H01L21/4871 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L25/16 , H01L2224/45144 , H01L2224/48227 , H01L2224/48472 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H05K1/0206 , H05K1/056 , H05K3/062 , H05K3/383 , H05K3/4644 , H05K2201/09054 , H05K2201/09509 , H05K2203/0369 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： Heat from a circuit element is effectively conducted to a metal substrate so that reliability of a circuit apparatus is improved. A circuit element is configured such that a wiring layer is formed on a metal substrate. Power devices are mounted on the wiring layer in addition to a circuit element constituting a control unit. Steps are formed by grooves of a predetermined pattern on the primary surface of the metal substrate. High heat dissipation circuit elements generating a relatively large amount of heat (i.e., power devices) are mounted above projections on the metal substrate. Low heat dissipation circuit elements generating a relatively small amount of heat are mounted above the depression in the metal substrate. In other words, the distance between the power device which generates a relatively large amount of heat and the metal substrate opposite to the device is smaller than the distance between the circuit element of the control unit which generates a relatively small amount of heat and the metal substrate opposite to the element.
摘要翻译：电路元件的热量有效地传导到金属基板，从而提高了电路装置的可靠性。电路元件被配置为使得布线层形成在金属基板上。功率器件除了构成控制单元的电路元件之外还安装在布线层上。步骤由金属基板的主表面上的预定图案的凹槽形成。产生相对大量热量的高散热电路元件（即，功率器件）安装在金属基板上的突起上方。产生相对较少热量的低散热电路元件安装在金属基板上的凹陷上方。换句话说，产生相对大量热量的功率器件与与器件相反的金属衬底之间的距离小于产生相对少量热量的控制单元的电路元件与金属之间的距离衬底与元件相对。

8. 发明申请

US20070200220A1 FLEXIBLE SUBSTRATE 审中-公开
标题翻译：柔性基板
公开(公告)号：US20070200220A1
公开(公告)日：2007-08-30
申请号：US11678309
申请日：2007-02-23
申请人： Makoto Murai , Ryosuke Usui
发明人： Makoto Murai , Ryosuke Usui
IPC分类号： H01L23/053
CPC分类号： H01L23/4985 , H01L2924/0002 , H05K1/0366 , H05K1/0393 , H05K2201/029 , H01L2924/00
摘要： A flexible substrate is provided which contains not only flexibility but also rigidity and hear resistance. A flexible substrate includes a first wiring layer, an insulating resin layer, a glass cloth and a second wiring layer. The insulating layer is formed by an insulating material, such as a BT resin, epoxy resin or the like that contains a high elastic modulus, heat resistance and moisture resistance. The film thickness of the insulating resin layer is thinned down to about 60 μm. As a reinforcing material, the glass cloth is embedded in the insulating resin layer. With this structure, the flexible substrate attains flexibility and at the same time in any of the first wiring layer and the second wiring layer, circuit elements can be mounted both on a curved area and a non-curved area of the wiring layers.
摘要翻译：提供了柔性基板，其不仅包含柔性，而且包含刚性和听阻力。挠性基板包括第一布线层，绝缘树脂层，玻璃布和第二布线层。绝缘层由包含高弹性模量，耐热性和耐湿性的BT树脂，环氧树脂等绝缘材料形成。绝缘树脂层的膜厚变薄至约60μm。作为增强材料，玻璃布嵌入绝缘树脂层中。利用这种结构，柔性基板具有灵活性，并且同时在第一布线层和第二布线层中的任一个中，电路元件既可以安装在布线层的弯曲区域和非弯曲区域上。

9. 发明授权

US07759583B2 Circuit board 失效
标题翻译：电路板
公开(公告)号：US07759583B2
公开(公告)日：2010-07-20
申请号：US11528683
申请日：2006-09-28
申请人： Makoto Murai , Ryosuke Usui
发明人： Makoto Murai , Ryosuke Usui
IPC分类号： H05K1/11
CPC分类号： H05K3/421 , H05K1/0373 , H05K3/0055 , H05K3/4626 , H05K2201/0209 , H05K2201/09509 , Y10T428/24917 , Y10T428/24926
摘要： A circuit board, having improved adhesion between its via conductor and insulating layer, is provided. The circuit board includes a first wiring layer, a second wiring layer, the insulating layer, a filler, and the via conductor. The first wiring layer and the second wiring layer are electrically insulated from each other by the insulating layer. The filler which has a favorable thermal conductivity is added into the insulating layer. The via conductor establishing electrical connection between the first wiring layer and the second wiring layer is formed in a predetermined position of the insulating layer. The via conductor is in direct contact with part of the filler added into the insulating layer.
摘要翻译：提供了一种电路板，其通孔导体和绝缘层之间具有改善的粘合性。电路板包括第一布线层，第二布线层，绝缘层，填料和通孔导体。第一布线层和第二布线层通过绝缘层彼此电绝缘。将具有良好导热性的填料加入到绝缘层中。在第一布线层和第二布线层之间建立电连接的通孔导体形成在绝缘层的预定位置。通孔导体与添加到绝缘层中的填料的一部分直接接触。

10. 发明申请

US20070082183A1 Circuit board 失效
标题翻译：电路板
公开(公告)号：US20070082183A1
公开(公告)日：2007-04-12
申请号：US11528683
申请日：2006-09-28
申请人： Makoto Murai , Ryosuke Usui
发明人： Makoto Murai , Ryosuke Usui
IPC分类号： B32B3/00 , H05K1/00
CPC分类号： H05K3/421 , H05K1/0373 , H05K3/0055 , H05K3/4626 , H05K2201/0209 , H05K2201/09509 , Y10T428/24917 , Y10T428/24926
摘要： A circuit board, having improved adhesion between its via conductor and insulating layer, is provided. The circuit board includes a first wiring layer, a second wiring layer, the insulating layer, a filler, and the via conductor. The first wiring layer and the second wiring layer are electrically insulated from each other by the insulating layer. The filler which has a favorable thermal conductivity is added into the insulating layer. The via conductor establishing electrical connection between the first wiring layer and the second wiring layer is formed in a predetermined position of the insulating layer. The via conductor is in direct contact with part of the filler added into the insulating layer.
摘要翻译：提供了一种电路板，其通孔导体和绝缘层之间具有改善的粘合性。电路板包括第一布线层，第二布线层，绝缘层，填料和通孔导体。第一布线层和第二布线层通过绝缘层彼此电绝缘。将具有良好导热性的填料加入到绝缘层中。在第一布线层和第二布线层之间建立电连接的通孔导体形成在绝缘层的预定位置。通孔导体与添加到绝缘层中的填料的一部分直接接触。

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